Added TI BQ2409x LiPo Charger IC Footprint/Model/Symbol

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Mark 2016-01-16 06:51:38 -07:00

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Footprints

Leaded.PcbLibLeadless.PcbLib

STEP/Generic

PDSO-10.STEP

Symbols

Charger.SchLib

Footprints/Leaded.PcbLib

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Name

Comment

Description

ALLEGRO TSSOP-24 LP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, Thermal Pad 4.32x3.00mm, IPC Medium Density

ALLEGRO TSSOP-24 LP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, Thermal Pad 4.32x3.00mm, IPC Medium Density

Part ID
Comment

Atmel SO-14 14S1

SOIC, 14-Leads, Body 8.65x3.90mm, Pitch 1.27mm, IPC Medium Density

Atmel SO-14 14S1

SOIC, 14-Leads, Body 8.65x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

ATMEL SO-8 S8S1

SOIC, 8-Leads, Body 4.89x3.90mm, Pitch 1.27mm, IPC Medium Density

ATMEL SO-8 S8S1

SOIC, 8-Leads, Body 4.89x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

Atmel SO-8 Wide 8S2

SOIC, 8-Leads, Body 5.24x5.29mm, Pitch 1.27mm, IPC Medium Density

Atmel SO-8 Wide 8S2

SOIC, 8-Leads, Body 5.24x5.29mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

ATMEL SOT-23-6 6ST1

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

ATMEL SOT-23-6 6ST1

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

Atmel TSSOP-8 8X

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Atmel TSSOP-8 8X

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

DIODES SM-8

SOP, 8-Leads, Body 6.7x3.7mm (max), Pitch 1.53mm, IPC High Density

DIODES SM-8

SOP, 8-Leads, Body 6.7x3.7mm (max), Pitch 1.53mm, IPC High Density

Part ID
Comment

DIODES SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

DIODES SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

DIODES SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

DIODES SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

DIODES SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

DIODES SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

DIODES SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

DIODES SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

DIODES SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

DIODES SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

DIODES SOT-523

SOT523, 3-Leads, Body 0.8x1.60mm, Pitch 0.50mm, IPC Medium Density

DIODES SOT-523

SOT523, 3-Leads, Body 0.8x1.60mm, Pitch 0.50mm, IPC Medium Density

Part ID
Comment

FAIRCHILD SSOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

FAIRCHILD SSOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

INFINEON PG-HSOF-8-1

PG-HSOF, 9-Leads, Body 10.58x11.68mm, Pitch 1.20mm, IPC Medium Density

INFINEON PG-HSOF-8-1

PG-HSOF, 9-Leads, Body 10.58x11.68mm, Pitch 1.20mm, IPC Medium Density

Part ID
Comment

INFINEON PG-TDSON-8

TDSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

INFINEON PG-TDSON-8

TDSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

Part ID
Comment

INFINEON SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

INFINEON SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

INFINEON SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

INFINEON SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

INFINEON SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

INFINEON SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

INFINEON SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

INFINEON SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

INFINEON SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

INFINEON SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

INFINEON TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

INFINEON TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

Part ID
Comment

INTERSIL TSSOP-24 M24.173

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, IPC Medium Density

INTERSIL TSSOP-24 M24.173

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

INTERSIL TSSOP-28 M28.173

TSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, IPC Medium Density

INTERSIL TSSOP-28 M28.173

TSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

IRF TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

IRF TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

Part ID
Comment

LT MSOP-8 MS8E 3x3MM

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

LT MSOP-8 MS8E 3x3MM

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

LT TSOT-23-6 S6 RFDET

TSOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC High Density

LT TSOT-23-6 S6 RFDET

TSOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC High Density

Part ID
Comment

MAXIM SOT-23-6

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

MAXIM SOT-23-6

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

MICROCHIP SC70-5 LT

SC70, 5-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

MICROCHIP SC70-5 LT

SC70, 5-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

MICROCHIP SC70-6 LT

SC70, 6-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

MICROCHIP SC70-6 LT

SC70, 6-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

MICROCHIP SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

MICROCHIP SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

MICROCHIP SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

MICROCHIP SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

MICROCHIP SOT-23-3 NB

SOT23, 3-Leads, Body 2.86x2.37mm, Pitch 0.95mm, IPC Medium Density

MICROCHIP SOT-23-3 NB

SOT23, 3-Leads, Body 2.86x2.37mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

MICROCHIP SOT-23-5 OT

SOT23, 5-Leads, Body 2.90x2.70mm, Pitch 0.95mm, IPC Medium Density

MICROCHIP SOT-23-5 OT

SOT23, 5-Leads, Body 2.90x2.70mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

MICROCHIP TSSOP-8 ST

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

MICROCHIP TSSOP-8 ST

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

NXP LQFP-100 14x14mm

TQFP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, IPC Medium Density

NXP LQFP-100 14x14mm

TQFP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, IPC Medium Density

Part ID
Comment

NXP LQFP-48 7x7mm

LQFP, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, IPC Medium Density

NXP LQFP-48 7x7mm

LQFP, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, IPC Medium Density

Part ID
Comment

NXP LQFP-64 10x10mm

LQFP, 64-Leads, Body 10.00x10.00mm, Pitch 0.50mm, IPC Medium Density

NXP LQFP-64 10x10mm

LQFP, 64-Leads, Body 10.00x10.00mm, Pitch 0.50mm, IPC Medium Density

Part ID
Comment

NXP SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

NXP SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

NXP SOT-23-3 TO-236AB

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

NXP SOT-23-3 TO-236AB

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

NXP SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

NXP SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

NXP SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

NXP SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

NXP TSSOP-16

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

NXP TSSOP-16

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

NXP TSSOP-20

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

NXP TSSOP-20

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

ON SEMI SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

ON SEMI SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

ON SEMI SOT-223 ST(318H)

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

ON SEMI SOT-223 ST(318H)

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

ON SEMI SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

ON SEMI SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

ON SEMI SOT-23-5 NTR

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

ON SEMI SOT-23-5 NTR

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

ON SEMI SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

ON SEMI SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

ON SEMI SOT-89 H

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

ON SEMI SOT-89 H

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

Part ID
Comment

ON SEMI TSOT-23-5 419AE

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

ON SEMI TSOT-23-5 419AE

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

ON SEMI TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

ON SEMI TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

SPANSION SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

SPANSION SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

SPANSION SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

SPANSION SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

ST HTSSOP-28

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.80mm, IPC Medium Density

ST HTSSOP-28

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.80mm, IPC Medium Density

Part ID
Comment

ST POWERSO-36

POWERSO, 36-Leads, Body 15.90x11.00mm, Pitch 0.65mm, Thermal Pad 9.80x6.20mm, IPC Medium Density

ST POWERSO-36

POWERSO, 36-Leads, Body 15.90x11.00mm, Pitch 0.65mm, Thermal Pad 9.80x6.20mm, IPC Medium Density

Part ID
Comment

ST SOIC-8N

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

ST SOIC-8N

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

ST SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

ST SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

ST TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

ST TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

Part ID
Comment

ST TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

ST TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI HTSSOP-28 PWP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 9.60x3.40mm, IPC Medium Density

TI HTSSOP-28 PWP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 9.60x3.40mm, IPC Medium Density

Part ID
Comment

TI MSOP-8 DGN

MSOP, 8-Leads, Body 3.1x3.1mm (max), Pitch 0.65mm, IPC Medium Density

TI MSOP-8 DGN

MSOP, 8-Leads, Body 3.1x3.1mm (max), Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI PDSO-10 DCQ

PDTSSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.88x1.57mm, IPC Medium Density

TI PDSO-10 DCQ

PDTSSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.88x1.57mm, IPC Medium Density

Part ID
Comment

TI SOT-223 DCY

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

TI SOT-223 DCY

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

Part ID
Comment

TI SOT-23-5 DBV

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

TI SOT-23-5 DBV

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

TI SOT-23-6 DDC

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

TI SOT-23-6 DDC

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Part ID
Comment

TI SOT-89 PK

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

TI SOT-89 PK

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

Part ID
Comment

TI SSOP-20 DB

SSOP, 20-Leads, Body 7.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI SSOP-20 DB

SSOP, 20-Leads, Body 7.20x5.30mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI SSOP-24 DB

SSOP, 24-Leads, Body 8.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI SSOP-24 DB

SSOP, 24-Leads, Body 8.20x5.30mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI SSOP-28 DB

TSSOP, 28-Leads, Body 10.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI SSOP-28 DB

TSSOP, 28-Leads, Body 10.20x5.30mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI TSSOP-16 PW

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

TI TSSOP-16 PW

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI TSSOP-20 PW

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

TI TSSOP-20 PW

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

TI VSSOP-8 DGK

TSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

TI VSSOP-8 DGK

TSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

Part ID
Comment

WINBOND SOIC-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

WINBOND SOIC-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

WINBOND SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

WINBOND SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

Part ID
Comment

Footprints/Leadless.PcbLib

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Name

Comment

Description

Allegro QFN-28 ET

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density

Allegro QFN-28 ET

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density

Part ID
Comment

ALLEGRO QFN-32 ET

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density

ALLEGRO QFN-32 ET

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density

Part ID
Comment

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Part ID
Comment

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

Part ID
Comment

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

Part ID
Comment

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

Part ID
Comment

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

Part ID
Comment

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

Part ID
Comment

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

Part ID
Comment

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Part ID
Comment

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

Part ID
Comment

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

Part ID
Comment

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

Part ID
Comment

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

Part ID
Comment

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

Part ID
Comment

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

Part ID
Comment

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

Part ID
Comment

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

Part ID
Comment

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

Part ID
Comment

SKYWORKS TDFN-14 2.2x2.2mm

TDFN, 14-Leads, Body 2.20x2.20mm, Pitch 0.40mm, Thermal Pad 0.90x1.70mm, IPC Medium Density

SKYWORKS TDFN-14 2.2x2.2mm

TDFN, 14-Leads, Body 2.20x2.20mm, Pitch 0.40mm, Thermal Pad 0.90x1.70mm, IPC Medium Density

Part ID
Comment

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

Part ID
Comment

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

Part ID
Comment

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

Part ID
Comment

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

Part ID
Comment

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

Part ID
Comment

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

Part ID
Comment

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

Part ID
Comment

TI VQFN-16 RVA

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

TI VQFN-16 RVA

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

Part ID
Comment

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

Part ID
Comment

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

Part ID
Comment

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Part ID
Comment

7352

STEP/Generic/PDSO-10.STEP Normal file

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Name

Comment

Description

SKYWORKS AAT3693

*

SKYWORKS AAT3693

Part ID	SKYWORKS AAT3693
Comment	*

Attributes

Designator	IC?
Comment	*

TI BQ2409x

*

TI BQ2409x

Part ID	TI BQ2409x
Comment	*

Attributes

Designator	IC?
Comment	*