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Added Infineon IPT059N15N3ATMA1 N-CH Fet 3D Model/Footprint/Symbol
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Name
Comment
Description
Allegro QFN-28 ET
QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density
ALLEGRO QFN-32 ET
QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density
Atmel BGA-15 3x3mm 15CC1
BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm
Atmel MLF-20 20M1
QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density
ATMEL UDFN-8 2x2mm 8MA4
UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density
BOSCH LGA-28 5.2x3.8MM
LGA, 28-Leads, Body 5.20x3.80mm, Pitch 0.50mm, IPC Medium Density
INFINEON PG-HSOF-8-1
SON, 16-Leads, Body 9.90x11.67mm, Pitch 1.20mm, TIPC Medium Density
INFINEON PG-TDSON-8
TDSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density
INFINEON PG-TDSON-8 6.15x5.32mm
TDSON, 8-Leads, Body 6.15x5.32mm, Pitch 1.27mm, Thermal Pad 3.60x4.05mm, IPC Medium Density
INFINEON PG-TSDSON-8
PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density
MICROCHIP QFN-20 4x4MM
QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.50x2.50mm, IPC Medium Density
MICROCHIP WSON-8 6x5mm
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
NXP HVQFN-33 5x5mm
QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density
NXP HVQFN-33 7x7mm
HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density
NXP TFBGA-100 9x9mm
BGA, 100-Leads, Body 9.00x9.00mmx1.20mm, Pitch 0.80mm
SPANSION WSON-8 6x5MM
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density
SPANSION WSON-8 6x8MM
SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density
ST DFN-8 3x3
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.20x1.70mm, IPC Medium Density
ST UFDFPN-8 MLP8
UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density
ST VFPDFN-10
VFPDFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.62x2.36mm, IPC Medium Density
TI 8-TDFN Q5
TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density
TI 8-TDFN Q5A
TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density
TI DSBGA-6 1.25x0.85mm
BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm
TI VQFN-16 4x4mm RSA
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
TI VQFN-16 RVA
QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density
TI VQFN-9 3x3MM RWL
VQFN, 14-Leads, Body 2.50x2.50mm, Pitch 0.50mm/0.47mm, IPC Medium Density
TI VSON-8 DRB
SON, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.65x2.40mm, IPC Medium Density
TI VSON-8 Q5B
VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density
TI WQFN-16 RGH
QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density
TI XFBGA-6 1.2x0.8mm
BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm
WINBOND WSON-8 6x5mm
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
4490
STEP/Generic/Infineon PG-HSOF-8-1.STEP
Normal file
4490
STEP/Generic/Infineon PG-HSOF-8-1.STEP
Normal file
File diff suppressed because it is too large
Load Diff
Name
Comment
Description
INFINEON DUAL MOSFET N-CH SOT363
INFINEON MOSFET IPT059N15N3
INFINEON MOSFET N-CH HSOF
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