Added Sensirion STS21 Model/Footprint · 82a45ab3f7 - altium-library - AllSpice Hub

AllSpiceMirrors/altium-library

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Added Sensirion STS21 Model/Footprint

This commit is contained in:

Mark Harris

2016-03-27 15:56:00 -06:00

parent 141ba5e935

commit 82a45ab3f7

2 changed files with 1012 additions and 0 deletions

Footprints

Leadless.PcbLib

STEP/Sensor

SENSIRION STS21.STEP

Footprints/Leadless.PcbLib

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Name

Comment

Description

Allegro QFN-28 ET

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density

ALLEGRO QFN-32 ET

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

INFINEON PGTSON-8

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.58mm, IPC Medium Density

INFINEON TSLP-3-9

DFN, 3-Leads, Body 0.60x1.00mm, Pitch 0.57mm, IPC High Density

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

MAXIM TDFN-10 3x3MM T1033-1

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.35mm, IPC Medium Density

MAXIM TDFN-10 T1034N-1

DFN, 10-Leads, Body 4.00x3.00mm, Pitch 0.50mm, Thermal Pad 2.30x2.60mm, IPC Medium Density

MAXIM TDFN-14 3x3MM T1433+2

DFN, 14-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.78x2.35mm, IPC Medium Density

MAXIM TDFN-8 2x2MM

DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.80x1.38mm, IPC Medium Density

MAXIM UCSP-12 1.5x2.0MM B12-11

BGA, 12-Leads, Body 2.02x1.54mmx0.67mm, Pitch 0.50mm

MAXIM WLP-9 1.2x1.2MM

WLP, 9-Leads, Body 1.26x1.26mmx0.64mm, Pitch 0.40mm

MICREL MLF-8 2x2MM ML

MLF, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.60x1.20mm, IPC Medium Density

MICROCHIP DFN-10 3mmx3mm MF

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.34mm, IPC Medium Density

MICROCHIP QFN-20 4x4MM

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.50x2.50mm, IPC Medium Density

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

NXP TFBGA-100 9x9mm

BGA, 100-Leads, Body 9.00x9.00mmx1.20mm, Pitch 0.80mm

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

NXP WLCSP-100 5x5mm

WLCSP, 100-Leads, Body 5.07x5.39mmx0.65mm, Pitch 0.50mm

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

SENSIRION STS21

DFN, 6-Leads, Body 3.00x3.00mm, Pitch 1.00mm, Thermal Pad 1.50x2.40mm, IPC Medium Density

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MCM-12 8.4x8.4mm

QFN, 12-Leads, Body 8.4x8.4mm (max), Pitch 1.91mm, IPC High Density

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

SKYWORKS TDFN-14 2.2x2.2mm

TDFN, 14-Leads, Body 2.20x2.20mm, Pitch 0.40mm, Thermal Pad 0.90x1.70mm, IPC Medium Density

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

SMSC QFN-24 4x4MM

QFN, 24-Leads, Body 4.1x4.1mm (max), Pitch 0.50mm, IPC Medium Density

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

ST DFN-8 3x3

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.20x1.70mm, IPC Medium Density

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

ST VFPDFN-10

VFPDFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.62x2.36mm, IPC Medium Density

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

TI PVQFN-16 4x4MM RSA

QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.65mm, Thermal Pad 2.70x2.70mm, IPC Medium Density

TI PVSON-10 3x3MM DRC

PVSON, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.40mm, IPC Medium Density

TI PWQFN-16 3x3MM RTE

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

TI PWSON-10 DSQ

DFN, 10-Leads, Body 2.00x2.00mm, Pitch 0.40mm, Thermal Pad 0.70x1.20mm, IPC Medium Density

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

TI VQFN-16 4x4mm RSA

QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density

TI VQFN-16 RVA

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

TI VQFN-9 3x3MM RWL

VQFN, 14-Leads, Body 2.50x2.50mm, Pitch 0.50mm/0.47mm, IPC Medium Density

TI VSON-8 DRB

SON, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.65x2.40mm, IPC Medium Density

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

TI WQFN-16 RGH

QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

TI WSON-12 DNT

WSON, 12-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x3.00mm, IPC Medium Density

TI WSON-16 NHR

WSON, 16-Leads, Body 5.00x4.00mm, Pitch 0.50mm, Thermal Pad 4.00x2.60mm, IPC Medium Density

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

1012

STEP/Sensor/SENSIRION STS21.STEP Normal file

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