Added NXP LPC176x Footprints/Models/Symbols

Browse Source

...

This commit is contained in:

Mark 2016-03-01 11:54:00 -07:00

parent ea34a61282

commit e333516441

4 changed files with 17888 additions and 0 deletions

Show all changes Ignore whitespace when comparing lines Ignore changes in amount of whitespace Ignore changes in whitespace at EOL

Download Patch File Download Diff File Expand all files Collapse all files

Footprints

Leadless.PcbLib

STEP/Generic

NXP TFBGA-100.STEPNXP WLCSP100.STEP

Symbols

ARM Cortex.SchLib

Footprints/Leadless.PcbLib

Show: Full Diff

Full Diff

Added or Changed

Removed

No Diff

View File

empty

Name

Comment

Description

Allegro QFN-28 ET

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density

Allegro QFN-28 ET

QFN, 28-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.15x3.15mm, IPC Medium Density

Part ID
Comment

ALLEGRO QFN-32 ET

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density

ALLEGRO QFN-32 ET

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.40x3.40mm, IPC Medium Density

Part ID
Comment

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Part ID
Comment

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

Part ID
Comment

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

Part ID
Comment

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

Part ID
Comment

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

Part ID
Comment

INFINEON PGTSON-8

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.58mm, IPC Medium Density

INFINEON PGTSON-8

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 2.40x1.58mm, IPC Medium Density

Part ID
Comment

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

Part ID
Comment

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

Part ID
Comment

MAXIM TDFN-10 3x3MM T1033-1

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.35mm, IPC Medium Density

MAXIM TDFN-10 3x3MM T1033-1

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.35mm, IPC Medium Density

Part ID
Comment

MAXIM TDFN-10 T1034N-1

DFN, 10-Leads, Body 4.00x3.00mm, Pitch 0.50mm, Thermal Pad 2.30x2.60mm, IPC Medium Density

MAXIM TDFN-10 T1034N-1

DFN, 10-Leads, Body 4.00x3.00mm, Pitch 0.50mm, Thermal Pad 2.30x2.60mm, IPC Medium Density

Part ID
Comment

MAXIM TDFN-14 3x3MM T1433+2

DFN, 14-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.78x2.35mm, IPC Medium Density

MAXIM TDFN-14 3x3MM T1433+2

DFN, 14-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.78x2.35mm, IPC Medium Density

Part ID
Comment

MAXIM TDFN-8 2x2MM

DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.80x1.38mm, IPC Medium Density

MAXIM TDFN-8 2x2MM

DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.80x1.38mm, IPC Medium Density

Part ID
Comment

MAXIM UCSP-12 1.5x2.0MM B12-11

BGA, 12-Leads, Body 2.02x1.54mmx0.67mm, Pitch 0.50mm

MAXIM UCSP-12 1.5x2.0MM B12-11

BGA, 12-Leads, Body 2.02x1.54mmx0.67mm, Pitch 0.50mm

Part ID
Comment

MAXIM WLP-9 1.2x1.2MM

WLP, 9-Leads, Body 1.26x1.26mmx0.64mm, Pitch 0.40mm

MAXIM WLP-9 1.2x1.2MM

WLP, 9-Leads, Body 1.26x1.26mmx0.64mm, Pitch 0.40mm

Part ID
Comment

MICREL MLF-8 2x2MM ML

MLF, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.60x1.20mm, IPC Medium Density

MICREL MLF-8 2x2MM ML

MLF, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.60x1.20mm, IPC Medium Density

Part ID
Comment

MICROCHIP DFN-10 3mmx3mm MF

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.34mm, IPC Medium Density

MICROCHIP DFN-10 3mmx3mm MF

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.34mm, IPC Medium Density

Part ID
Comment

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Part ID
Comment

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

Part ID
Comment

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

Part ID
Comment

NXP TFBGA-100 9x9mm

BGA, 100-Leads, Body 9.00x9.00mmx1.20mm, Pitch 0.80mm

NXP TFBGA-100 9x9mm

BGA, 100-Leads, Body 9.00x9.00mmx1.20mm, Pitch 0.80mm

Part ID
Comment

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

Part ID
Comment

NXP WLCSP-100 5x5mm

WLCSP, 100-Leads, Body 5.07x5.39mmx0.65mm, Pitch 0.50mm

NXP WLCSP-100 5x5mm

WLCSP, 100-Leads, Body 5.07x5.39mmx0.65mm, Pitch 0.50mm

Part ID
Comment

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

Part ID
Comment

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

Part ID
Comment

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

Part ID
Comment

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

Part ID
Comment

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

Part ID
Comment

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

Part ID
Comment

SKYWORKS TDFN-14 2.2x2.2mm

TDFN, 14-Leads, Body 2.20x2.20mm, Pitch 0.40mm, Thermal Pad 0.90x1.70mm, IPC Medium Density

SKYWORKS TDFN-14 2.2x2.2mm

TDFN, 14-Leads, Body 2.20x2.20mm, Pitch 0.40mm, Thermal Pad 0.90x1.70mm, IPC Medium Density

Part ID
Comment

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

Part ID
Comment

SMSC QFN-24 4x4MM

QFN, 24-Leads, Body 4.1x4.1mm (max), Pitch 0.50mm, IPC Medium Density

SMSC QFN-24 4x4MM

QFN, 24-Leads, Body 4.1x4.1mm (max), Pitch 0.50mm, IPC Medium Density

Part ID
Comment

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

Part ID
Comment

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

Part ID
Comment

ST DFN-8 3x3

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.20x1.70mm, IPC Medium Density

ST DFN-8 3x3

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.20x1.70mm, IPC Medium Density

Part ID
Comment

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

Part ID
Comment

ST VFPDFN-10

VFPDFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.62x2.36mm, IPC Medium Density

ST VFPDFN-10

VFPDFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.62x2.36mm, IPC Medium Density

Part ID
Comment

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

Part ID
Comment

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

Part ID
Comment

TI PVQFN-16 4x4MM RSA

QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.65mm, Thermal Pad 2.70x2.70mm, IPC Medium Density

TI PVQFN-16 4x4MM RSA

QFN, 16-Leads, Body 4.00x4.00mm, Pitch 0.65mm, Thermal Pad 2.70x2.70mm, IPC Medium Density

Part ID
Comment

TI PVSON-10 3x3MM DRC

PVSON, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.40mm, IPC Medium Density

TI PVSON-10 3x3MM DRC

PVSON, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.40mm, IPC Medium Density

Part ID
Comment

TI PWQFN-16 3x3MM RTE

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

TI PWQFN-16 3x3MM RTE

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

Part ID
Comment

TI PWSON-10 DSQ

DFN, 10-Leads, Body 2.00x2.00mm, Pitch 0.40mm, Thermal Pad 0.70x1.20mm, IPC Medium Density

TI PWSON-10 DSQ

DFN, 10-Leads, Body 2.00x2.00mm, Pitch 0.40mm, Thermal Pad 0.70x1.20mm, IPC Medium Density

Part ID
Comment

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

Part ID
Comment

TI VQFN-16 RVA

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

TI VQFN-16 RVA

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

Part ID
Comment

TI VQFN-9 3x3MM RWL

VQFN, 14-Leads, Body 2.50x2.50mm, Pitch 0.50mm/0.47mm, IPC Medium Density

TI VQFN-9 3x3MM RWL

VQFN, 14-Leads, Body 2.50x2.50mm, Pitch 0.50mm/0.47mm, IPC Medium Density

Part ID
Comment

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

Part ID
Comment

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

Part ID
Comment

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Part ID
Comment

8944

STEP/Generic/NXP TFBGA-100.STEP Normal file

View File

File diff suppressed because it is too large Load Diff

8944

STEP/Generic/NXP WLCSP100.STEP Normal file

View File

File diff suppressed because it is too large Load Diff

Symbols/ARM Cortex.SchLib

Show: Full Diff

Full Diff

Added or Changed

Removed

No Diff

View File

empty

Name

Comment

Description

NXP LPC11U1X 33Pin

*

NXP LPC11U1X 33Pin

Part ID	NXP LPC11U1X 33Pin
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U1X LQFP48

*

NXP LPC11U1X LQFP48

Part ID	NXP LPC11U1X LQFP48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U2X 33Pin

*

NXP LPC11U2X 33Pin

Part ID	NXP LPC11U2X 33Pin
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U2X LQFP48

*

NXP LPC11U2X LQFP48

Part ID	NXP LPC11U2X LQFP48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U2X LQFP64

*

NXP LPC11U2X LQFP64

Part ID	NXP LPC11U2X LQFP64
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U2X TFBGA48

*

NXP LPC11U2X TFBGA48

Part ID	NXP LPC11U2X TFBGA48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U3X 33Pin

*

NXP LPC11U3X 33Pin

Part ID	NXP LPC11U3X 33Pin
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U3X LQFP48

*

NXP LPC11U3X LQFP48

Part ID	NXP LPC11U3X LQFP48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U3X LQFP64

*

NXP LPC11U3X LQFP64

Part ID	NXP LPC11U3X LQFP64
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC11U3X TFBGA48

*

NXP LPC11U3X TFBGA48

Part ID	NXP LPC11U3X TFBGA48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC134x 33 PIN

LPC1343

32-bit ARM Cortex-M3 microcontroller; up to 32kB flash and 8kB SRAM; USB device

NXP LPC134x 33 PIN

32-bit ARM Cortex-M3 microcontroller; up to 32kB flash and 8kB SRAM; USB device

Part ID	NXP LPC134x 33 PIN
Comment	LPC1343

Attributes

Designator	IC?
Comment	LPC1343

NXP LPC151x LQFP100

*

NXP LPC151x LQFP100

Part ID	NXP LPC151x LQFP100
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC151x LQFP48

*

NXP LPC151x LQFP48

Part ID	NXP LPC151x LQFP48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC151x LQFP64

*

NXP LPC151x LQFP64

Part ID	NXP LPC151x LQFP64
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC154x LQFP100

*

NXP LPC154x LQFP100

Part ID	NXP LPC154x LQFP100
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC154x LQFP48

*

NXP LPC154x LQFP48

Part ID	NXP LPC154x LQFP48
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC154x LQFP64

*

NXP LPC154x LQFP64

Part ID	NXP LPC154x LQFP64
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC176x LQFP100

*

NXP LPC176x LQFP100

Part ID	NXP LPC176x LQFP100
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC176x TFBGA100

*

NXP LPC176x TFBGA100

Part ID	NXP LPC176x TFBGA100
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC176x WLCSP100

*

NXP LPC176x WLCSP100

Part ID	NXP LPC176x WLCSP100
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC81x 16Pin

*

NXP LPC81x 16Pin

Part ID	NXP LPC81x 16Pin
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC81x 20Pin

*

NXP LPC81x 20Pin

Part ID	NXP LPC81x 20Pin
Comment	*

Attributes

Designator	IC?
Comment	*

NXP LPC82x 20Pin

LPC82x

32-bit ARM Cortex-M0+ microcontroller

NXP LPC82x 20Pin

32-bit ARM Cortex-M0+ microcontroller

Part ID	NXP LPC82x 20Pin
Comment	LPC82x

Attributes

Designator	IC?
Comment	LPC82x

NXP LPC82x 33Pin

LPC82x

32-bit ARM Cortex-M0+ microcontroller

NXP LPC82x 33Pin

32-bit ARM Cortex-M0+ microcontroller

Part ID	NXP LPC82x 33Pin
Comment	LPC82x

Attributes

Designator	IC?
Comment	LPC82x

ST STM32F070x6 20PIN

*

ST STM32F070x6 20PIN

Part ID	ST STM32F070x6 20PIN
Comment	*

Attributes

Designator	IC?
Comment	*

ST STM32F070x6 48PIN

*

ST STM32F070x6 48PIN

Part ID	ST STM32F070x6 48PIN
Comment	*

Attributes

Designator	IC?
Comment	*

ST STM32F070x6 64PIN

*

ST STM32F070x6 64PIN

Part ID	ST STM32F070x6 64PIN
Comment	*

Attributes

Designator	IC?
Comment	*

ST STM32L051 32PIN

*

ST STM32L051 32PIN

Part ID	ST STM32L051 32PIN
Comment	*

Attributes

Designator	IC?
Comment	*

ST STM32L051 48PIN

*

ST STM32L051 48PIN

Part ID	ST STM32L051 48PIN
Comment	*

Attributes

Designator	IC?
Comment	*

ST STM32L051 64PIN

*

ST STM32L051 64PIN

Part ID	ST STM32L051 64PIN
Comment	*

Attributes

Designator	IC?
Comment	*