Added VLSI VS1053 Footprint/Symbol · f6ca1ce282 - altium-library - AllSpice Hub

AllSpiceMirrors/altium-library

mirror of https://github.com/issus/altium-library.git synced 2025-04-01 03:16:56 +00:00

Added VLSI VS1053 Footprint/Symbol

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Mark

2016-01-18 20:40:08 -07:00

parent 064bec3fa7

commit f6ca1ce282

2 changed files with 0 additions and 0 deletions

Footprints

Symbols

Footprints/Leaded.PcbLib

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Name

Comment

Description

ALLEGRO TSSOP-24 LP

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, Thermal Pad 4.32x3.00mm, IPC Medium Density

Atmel SO-14 14S1

SOIC, 14-Leads, Body 8.65x3.90mm, Pitch 1.27mm, IPC Medium Density

ATMEL SO-8 S8S1

SOIC, 8-Leads, Body 4.89x3.90mm, Pitch 1.27mm, IPC Medium Density

Atmel SO-8 Wide 8S2

SOIC, 8-Leads, Body 5.24x5.29mm, Pitch 1.27mm, IPC Medium Density

ATMEL SOT-23-6 6ST1

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

Atmel TSSOP-8 8X

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

DIODES SM-8

SOP, 8-Leads, Body 6.7x3.7mm (max), Pitch 1.53mm, IPC High Density

DIODES SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

DIODES SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

DIODES SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

DIODES SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

DIODES SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

DIODES SOT-523

SOT523, 3-Leads, Body 0.8x1.60mm, Pitch 0.50mm, IPC Medium Density

FAIRCHILD SSOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

INFINEON PG-HSOF-8-1

PG-HSOF, 9-Leads, Body 10.58x11.68mm, Pitch 1.20mm, IPC Medium Density

INFINEON PG-TDSON-8

TDSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

INFINEON SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

INFINEON SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

INFINEON SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

INFINEON SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

INFINEON SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

INFINEON TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

INTERSIL TSSOP-24 M24.173

TSSOP, 24-Leads, Body 7.80x4.40mm, Pitch 0.65mm, IPC Medium Density

INTERSIL TSSOP-28 M28.173

TSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, IPC Medium Density

IRF TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

LT MSOP-8 MS8E 3x3MM

MSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

LT TSOT-23-6 S6 RFDET

TSOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC High Density

MAXIM SOT-23-6

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

MICROCHIP MSOP-10 UN

MSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, IPC Medium Density

MICROCHIP SC70-5 LT

SC70, 5-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

MICROCHIP SC70-6 LT

SC70, 6-Leads, Body 2.03x2.10mm, Pitch 0.65mm, IPC Medium Density

MICROCHIP SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

MICROCHIP SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

MICROCHIP SOT-23-3 NB

SOT23, 3-Leads, Body 2.86x2.37mm, Pitch 0.95mm, IPC Medium Density

MICROCHIP SOT-23-5 OT

SOT23, 5-Leads, Body 2.90x2.70mm, Pitch 0.95mm, IPC Medium Density

MICROCHIP TSSOP-8 ST

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

NXP LQFP-100 14x14mm

TQFP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, IPC Medium Density

NXP LQFP-48 7x7mm

LQFP, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, IPC Medium Density

NXP LQFP-64 10x10mm

LQFP, 64-Leads, Body 10.00x10.00mm, Pitch 0.50mm, IPC Medium Density

NXP SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

NXP SOT-23-3 TO-236AB

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

NXP SOT-323-3

SOT323, 3-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

NXP SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

NXP TSSOP-16

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

NXP TSSOP-20

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

ON SEMI SO-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

ON SEMI SOT-223 ST(318H)

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

ON SEMI SOT-23-3

SOT23, 3-Leads, Body 2.90x2.40mm, Pitch 0.95mm, IPC Medium Density

ON SEMI SOT-23-5 NTR

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

ON SEMI SOT-363

SOT363, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm, IPC Medium Density

ON SEMI SOT-89 H

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

ON SEMI TSOT-23-5 419AE

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

ON SEMI TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

SKYWORKS SC70JW-8

SC70J, 8-Leads, Body 2.20x2.20mm, Pitch 0.50mm, IPC Medium Density

SPANSION SOIC-8 150mil Wide

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

SPANSION SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

ST HTSSOP-28

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 5.50x2.80mm, IPC Medium Density

ST LQFP-48 7x7MM

LQFP, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, IPC Medium Density

ST LQFP-64 10x10mm

LQFP, 64-Leads, Body 10.00x10.00mm, Pitch 0.50mm, IPC Medium Density

ST POWERSO-36

POWERSO, 36-Leads, Body 15.90x11.00mm, Pitch 0.65mm, Thermal Pad 9.80x6.20mm, IPC Medium Density

ST SOIC-8N

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

ST SOT-223

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

ST TO-263-7

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

ST TSSOP-20

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

ST TSSOP-8

TSSOP, 8-Leads, Body 3.00x4.40mm, Pitch 0.65mm, IPC Medium Density

TI HTSSOP-28 PWP

HTSSOP, 28-Leads, Body 9.70x4.40mm, Pitch 0.65mm, Thermal Pad 9.60x3.40mm, IPC Medium Density

TI MSOP-8 DGN

MSOP, 8-Leads, Body 3.1x3.1mm (max), Pitch 0.65mm, IPC Medium Density

TI PDSO-10 DCQ

PDTSSOP, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.88x1.57mm, IPC Medium Density

TI SOT-223 DCY

SOT223, 4-Leads, Body 6.50x7.00mm (avg), Pitch 2.30mm, IPC Medium Density

TI SOT-23-5 DBV

SOT23, 5-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

TI SOT-23-6 DDC

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm, IPC Medium Density

TI SOT-89 PK

SOT89, 3-Leads, Body 4.50x2.50mm, Pitch 1.50mm, Lead Span 3.3mm, IPC Medium Density

TI SSOP-20 DB

SSOP, 20-Leads, Body 7.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI SSOP-24 DB

SSOP, 24-Leads, Body 8.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI SSOP-28 DB

TSSOP, 28-Leads, Body 10.20x5.30mm, Pitch 0.65mm, IPC Medium Density

TI TSSOP-16 PW

TSSOP, 16-Leads, Body 5.00x4.40mm, Pitch 0.65mm, IPC Medium Density

TI TSSOP-20 PW

TSSOP, 20-Leads, Body 6.50x4.40mm, Pitch 0.65mm, IPC Medium Density

TI VSSOP-8 DGK

TSOP, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, IPC Medium Density

VLSI LQFP-48 7x7MM

LQFP, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, IPC Medium Density

WINBOND SOIC-8

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

WINBOND SOIC-8 208MIL WIDE

SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density

Symbols/Audio.SchLib

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