altium-library/Leadless.PcbLib at 209ba1c7b88cdcdf711399987dedfcb5e86122e9

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Mark 209ba1c7b8 Added NXP LPC81x Footprints/Models/Symbols

2016-01-07 01:02:20 -07:00

314 KiB

Raw History

Name

Comment

Description

Atmel BGA-15 3x3mm 15CC1

BGA, 15-Leads, Body 3.00x3.00mmx0.60mm, Pitch 0.65mm

Atmel MLF-20 20M1

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x2.60mm, IPC Medium Density

ATMEL UDFN-8 2x2mm 8MA4

UDFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.50mm, IPC Medium Density

Atmel VQFN-20 3x3mm 20M2

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

INFINEON PG-TSDSON-8

PG-TSDSOFN, 8-Leads, Body 3.30x3.30mm, Pitch 0.65mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

LT DFN-6 2x2mm DC6 RF

DFN, 6-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.61x1.42mm, IPC High Density

LT DFN-8 3X3MM

DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

MICROCHIP WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

NXP HVQFN-33 5x5mm

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

NXP HVQFN-33 7x7mm

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

NXP TFBGA-48 4.5x4.5mm

TFBGA, 48-Leads, Body 4.50x4.50mmx1.10mm, Pitch 0.50mm

NXP XSON16 SOT1341-1

SON, 16-Leads, Body 3.20x2.50mm, Pitch 0.40mm, IPC Medium Density

RFMD QFN-16 3x3mm

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC High Density

SKYWORKS DFN-6 1.5x1.5mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MLPD-6 1x1mm

DFN, 6-Leads, Body 1.50x1.50mm, Pitch 0.50mm, Thermal Pad 0.70x1.20mm, IPC High Density

SKYWORKS MLPD-6 2x1.5mm

DFN, 6-Leads, Body 2.00x1.50mm, Pitch 0.50mm, Thermal Pad 1.10x1.20mm, IPC High Density

Skyworks QFN-12 2x2mm

QFN, 12-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.76x0.76mm, IPC High Density

SKYWORKS XFDFN-6 1x1mm

QFN, 6-Leads, Body 1.00x1.00mm, Pitch 0.50mm, IPC High Density

SPANSION WSON-8 6x5MM

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

SPANSION WSON-8 6x8MM

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

ST UFDFPN-8 MLP8

UFDFPN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density

TI 8-TDFN Q5

TDFN, 8-Leads, Body 6.00x5.00mm, Pitch 1.27mm, Thermal Pad, IPC Medium Density

TI DSBGA-6 1.25x0.85mm

BGA, 6-Leads, Body 0.84x1.24mmx0.68mm, Pitch 0.40mm

TI SON-6 Q2

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.10x1.05mm, IPC Medium Density

TI VSON-8 Q5B

VSON, 8-Leads, Body 6x5mm, Pitch 1.27mm, Thermal Pad 1.65x2.38mm, IPC Medium Density

TI XFBGA-6 1.2x0.8mm

BGA, 6-Leads, Body 0.8x1.22mmx0.425mm, Pitch 0.40mm

WINBOND WSON-8 6x5mm

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

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314 KiB Raw History

314 KiB

Raw History