From 4766175d6077cde35071ed121eed85839f51fa42 Mon Sep 17 00:00:00 2001
From: jean-pierre charras <jp.charras@wanadoo.fr>
Date: Mon, 27 Feb 2023 16:11:44 +0100
Subject: [PATCH] EXPORTER_STEP: handle sub-layers in dielectric layer. A
dielectric layer (between 2 copper layers) can be made by more than one layer
(composite dielectric). Not frequent, but possible. sub-layers where
previously ignored.
---
pcbnew/exporters/step/exporter_step.cpp | 11 ++++++++---
1 file changed, 8 insertions(+), 3 deletions(-)
diff --git a/pcbnew/exporters/step/exporter_step.cpp b/pcbnew/exporters/step/exporter_step.cpp
index 4d12ff21e1..6b5272f8c2 100644
--- a/pcbnew/exporters/step/exporter_step.cpp
+++ b/pcbnew/exporters/step/exporter_step.cpp
@@ -298,7 +298,11 @@ void EXPORTER_STEP::determinePcbThickness()
switch( item->GetType() )
{
case BS_ITEM_TYPE_DIELECTRIC:
- thickness += item->GetThickness();
+ // Dielectric can have sub-layers. Layer 0 is the main layer
+ // Not frequent, but possible
+ for( int idx = 0; idx < item->GetSublayersCount(); idx++ )
+ thickness += item->GetThickness( idx );
+
break;
case BS_ITEM_TYPE_COPPER:
@@ -325,6 +329,9 @@ bool EXPORTER_STEP::Export()
ReportMessage( _( "Determining PCB data\n" ) );
determinePcbThickness();
+ wxString msg;
+ msg.Printf( _( "Board Thickness from stackup: %.3f mm\n" ), m_boardThickness );
+ ReportMessage( msg );
try
{
@@ -362,8 +369,6 @@ bool EXPORTER_STEP::Export()
if( m_fail || m_error )
{
- wxString msg;
-
if( m_fail )
{
msg = _( "Unable to create STEP file.\n"