unfricking directory structure

.~lock.oresat-acs-card-bom.xlsx#

@@ -1 +0,0 @@
-,DESKTOP-LS2SM5H/dal56,DESKTOP-LS2SM5H,06.04.2021 16:05,file:///C:/Users/dal56/AppData/Roaming/LibreOffice/4;

Component File/SOP for stuffing PCBs.md

@@ -1,11 +0,0 @@
-# SOP for board stuffing.
-Both Rev1.1 and Rev3 can have the top side fully stuffed and baked in the reflow oven.
-1. Prepare all tool and supplies: Tweezers, solder-paste, napkins, surface mount components, schematic and board layout references.
-1. Prepare solder-paste stencil: Place the bare PCB on the table and place the L-shaped supports around it. The L-shaped supports should come with the solder stencil. Tape the supports to the table so they do not slide around. Now align the solder stencil on top of the board and tap the stencil down to the L-shaped supports so that the stencil does not slide around. Apply solder-paste and squeegee/scrape off the excess.
-1. Organize surface mount components in whatever is most convenient.
-1. Place components one by one on the board with tweezers by referencing the board layout. This is the super long tedious part. Be patient. It’s better to work slow than to mess up. You don’t want to clean a pasty mess.
-1. After all the components are placed, carefully remove the board and inspect everything visually under a microscope. Make small alignment fixes where necessary.
-1. Carefully place the board in the reflow over and follow reflow procedure.
-1. Remove board (CAUTION - HOT). Inspect visually with the microscope. Look for solder bridging. Reflow and remove solder where necessary. Pro tip 1: look at tricky components at an angle so you can see underneath them better. Pro tip 2: use the Metcal solder station. It dumps heat very quickly and regulates its temperature well.
-1. Proceed to stuff the bottom of the board by hand with the solder iron. Pro tip 3: don’t use solder irons with tiny tiny tips. The tips rarely get hot enough to melt solder properly. Pro tip 4: For soldering surface mount resistors and capacitors; tin one pad with solder and leave the other one clean. Bring the component close with tweezers in one hand and with the other hand use the iron to reflow the solder while aligning the component into its place. Solder the other pad once the component is being held in its proper place. A similar method should be used for an mcu. Only tin one pad. Aling and place the mcu. That one pad will hold it aligned in place. Then solder the rest of the pins. Don’t worry if you bridge. The Metcal is good at heating up braid for removing solder bridging.
-1. Congrats! You are done. Now you can move on to testing and debugging.

LICENSE

@@ -1,339 +0,0 @@
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Project Design Constraints.md

@@ -1,26 +0,0 @@
-# Project Design Contraints:
-Our capstone project is the first step in a long-term goal to have a fully-operational attitude control system that can operate inside oresat. The oresat frame design, and the space environment present some constraints on our project. We had to find hardware that could operate within these constraints. The list of constraints that we were given was,
-
-* Size, Weight, Shape
-	* Withstand the space environment:
-	* Operate from -40 to +125 deg C
-	* Survive CubeSat vibration testing.
-	* Be storable for up to 6 months
-	* Survive in space
-	* Work in a hard vacuum.
-	* Not outgas (as specified by CubeSat standards).
-* Use the OreSat power bus:
-	* Vbus of 3.0 - 4.2 V.
-	* Minimize current consumption; power capped at 10W, but should be much less.
-* Minimize size, weight, and complexity.’
-
-The most important of these restraints is,
-* Operate from -40 to +125 deg C
-* Vbus of 3.0 - 4.2 V.
-* Minimize size, weight, and complexity.’
-	* Fit in a volume of 10x10x4 cm.
-
-The temperature range, voltage range, and volume constraints are the most limiting requirments that guided our hardware choices and the design of our board layout.
-
-
-

README.md

@@ -1,6 +1,46 @@
-# oresat-acs-board
+# oresat-adcs-hardware
+
+For more information on the OreSat project, please see <https://www.oresat.org/>!
+
+## About this Repo
+
+This repo contains the following projects:
+
+* **The OreSat ADCS Card**
+   * ADCS M0 microcontroller on its own OreSat Power Domain (OPD)
+      * Power switch and LTC4300 that connects the M0 to:
+         * BMI088 IMU (onboard the ADCS card)
+         * LTC4305 2-Channel I2C Bus Multiplexer (one on each end cap via the backplane, end cards, and connectors to the end caps)
+            * Two MMC5883MA magnetometers (two on each end cap, multiplexed by the LTC4305s)
+      * Three STSPIN250s for the X, Y, and Z magnetorquers
+   * Q1 Reaction Wheel OPD which powers the Q1 RW board
+   * Q2 Reaction Wheel OPD which powers the Q2 RW board
+   * Q3 Reaction Wheel OPD which powers the Q3 RW board
+   * Q4 Reaction Wheel OPD which powers the Q4 RW board
+* **OreSat RW boards**
+   * Boards that run one of the four reaction wheels that we have.
+   * Note that the "flat" version of the boards are for development
+
+![ADCS Card Block Diagram](https://github.com/oresat/oresat-adcs-hardware/blob/master/documentation/OreSat%20ADCS%20Card%20Block%20Diagram%20V1.0%202022-08-18.png)
+
+
+## LICENSE
+
+Copyright the Portland State Aerospace Society, 2022.
+
+This source describes Open Hardware that is licensed under CERN-OHL-S v2, or any later version.
+
+You may redistribute and modify this source and make products using it under the terms of the CERN-OHL-S v2 (https://ohwr.org/cern_ohl_s_v2.txt).
+
+This source is distributed WITHOUT ANY EXPRESS OR IMPLIED WARRANTY, INCLUDING OF MERCHANTABILITY, SATISFACTORY QUALITY AND FITNESS FOR A PARTICULAR PURPOSE. Please see the CERN-OHL-S v2 for applicable conditions.
+
+Source location: https://github.com/oresat/
+
+As per CERN-OHL-S v2 section 4, should You produce hardware based on this source, You must where practicable maintain the Source Location visible on the external case of the Gizmo or other products you make using this source.
+
+
+# DEPRECATED - PLEASE EVENTUALLY REWRITE :)
 
-# Introduction
 ## The OreSat Project
 OreSat is an inter university collaboration to design an orbital vehicle. Once in orbit, the nanosatellite will engage in three missions. One of the missions is space testing a relatively new photovoltaic panel. The other missions require the ability to point at and maintain visual contact with a specified location. 
 ## Background Motivation   
@@ -39,11 +79,14 @@ ACS Level 2 Block Diagram Version 3.2
 ### System Firmware:
 [Check here for the firmware information](https://github.com/oresat/oresat-firmware/wiki/ACS-Firmware)
 
+
+
+
 ### Research and Tutorials / Ramp Up Documents:
 Brushless DC (BLDC) motor control is a challenging form of motor control. We found numerous helpful tutorials and references.
 [Link to research references and bibliography, start here for a ramp up on ACS](https://github.com/oresat/oresat-acs-board/blob/master/Ramp%20Up.md)
 
-# Final Product:
+## Final Product:
 ![Physical Product](https://github.com/oresat/oresat-acs-board/blob/master/Manufacturing%20photos/rev3_1.jpg)
 ![Physical Product](https://github.com/oresat/oresat-acs-board/blob/master/Manufacturing%20photos/rev3_2.jpg)
 ![Physical Product](https://github.com/oresat/oresat-acs-board/blob/master/Manufacturing%20photos/rev3_3.jpg)