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https://github.com/oresat/oresat-adcs-hardware.git
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Remove some build files.
This commit is contained in:
parent
05697fde5a
commit
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mezzanine-breakout-board
mezzanine-breakout-board-B_Cu.gbrmezzanine-breakout-board-Edge_Cuts.gbrmezzanine-breakout-board-job.gbrjob
rev-6/rev6.0_flat_powerstage/bom
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%TF.GenerationSoftware,KiCad,Pcbnew,(6.0.8)*%
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%TF.CreationDate,2022-11-20T14:02:22-08:00*%
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%TF.ProjectId,mezzanine-breakout-board,6d657a7a-616e-4696-9e65-2d627265616b,rev?*%
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%TF.SameCoordinates,Original*%
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%TF.FileFunction,Profile,NP*%
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%FSLAX46Y46*%
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G04 Gerber Fmt 4.6, Leading zero omitted, Abs format (unit mm)*
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G04 Created by KiCad (PCBNEW (6.0.8)) date 2022-11-20 14:02:22*
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%MOMM*%
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%LPD*%
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G01*
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G04 APERTURE LIST*
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%TA.AperFunction,Profile*%
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%ADD10C,0.100000*%
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%TD*%
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G04 APERTURE END LIST*
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D10*
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X118000000Y-91000000D02*
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G75*
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G03*
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X117000000Y-92000000I0J-1000000D01*
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G01*
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X117000000Y-120000000D02*
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G75*
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G03*
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X118000000Y-121000000I1000000J0D01*
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G01*
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X145000000Y-121000000D02*
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G75*
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G03*
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X146000000Y-120000000I0J1000000D01*
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G01*
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X146000000Y-92000000D02*
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G75*
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G03*
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X145000000Y-91000000I-1000000J0D01*
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G01*
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X118000000Y-91000000D02*
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X145000000Y-91000000D01*
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X117000000Y-120000000D02*
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X117000000Y-92000000D01*
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X145000000Y-121000000D02*
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X118000000Y-121000000D01*
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X146000000Y-92000000D02*
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X146000000Y-120000000D01*
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M02*
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@ -1,92 +0,0 @@
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{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "(6.0.8)"
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},
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"CreationDate": "2022-11-20T14:02:22-08:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "mezzanine-breakout-board",
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"GUID": "6d657a7a-616e-4696-9e65-2d627265616b",
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"Revision": "rev?"
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},
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"Size": {
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"X": 29.1,
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"Y": 30.1
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.3,
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"TrackToRegion": 0.2,
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"RegionToRegion": 0.2
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}
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],
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"FilesAttributes": [
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{
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"Path": "mezzanine-breakout-board-B_Cu.gbr",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "mezzanine-breakout-board-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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