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oresat-adcs-hardware/oresat-mag-card
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README.md

title, subtitle, fontsize, geometry, toc, toc-depth, colorlinks, urlcolor
title subtitle fontsize geometry toc toc-depth colorlinks urlcolor
**OreSat Mag Card** **Fabrication and Assembly Information**\ For build TIME-STAMP 10pt
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About this Board

Board Description

The OreSat Mag Card handles three things for the open source OreSat CubeSat system:

  • Reads the four magnetometers located on the end caps of the satellite and broadcasts the data on the CAN bus.
  • Reads the 6 DOF inertial measurement unit (IMU) and broadcasts the data on the CAN bus (mostly just the gyroscopes).
  • Runs the three magnetorquers based on commands from the C3 via the CAN bus.

Documentation Links

Documentation Files

Filename Notes
README.pdf This README file
PROJECT-NAME-outline.dxf Board outline (with holes) in DXF format
PROJECT-NAME-pcba.step 3D model of PCBA (with components)
PROJECT-NAME-render-bot.jpg Render of the top of the 3D model
PROJECT-NAME-render-bot.jpg Render of the bottom of the 3D model
PROJECT-NAME-schematic.pdf PDF of board schematics

Contact Information

Board Renders

Render of the top of the 3D model{width=50%} Render of the bottom of the 3D model{width=50%}

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Printed Circuit Board (PCB) Fabrication Information

Board Info

  • 4 layer board
  • Bounding box is 99.8 x 94.6 mm (3.93 x 3.72 in)
  • Board thickness is 1.59 mm (0.063 inch)

Board Requirements

  • Design Rules
    • Minimum Trace / Space design rules
      • Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
      • Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
    • Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
    • Hole placement tolerance: +/- 0.075 mm (3.0 mil)
    • Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
  • Drills
    • Drill Positional Tolerance: 0.051 mm (2.0 mil)
    • Drill Size tolerance: +/- 0.064 mm (2.5 mil)
  • Plated/Un-plated holes
    • There are two un-plated (NPT) holes
    • There are many plated through (PTH) holes
    • PTH minimum diameter: 0.254 mm (10 mil)
    • PTH minimum annulus: 0.102 mm (4 mil) radius
  • Outline/Routing
    • Requires a 1.0 mm or smaller diameter routing bit
  • Slots
    • There are no slots.
  • Cutouts
    • There are one cutouts
  • There are 3 fiducials on the top layer.
  • Panel tabs ("mouse bites")
    • Card edges must be smooth; no mouse bites or other intrusions into the card outline.
    • If external mouse bites are required, minimize and customer will remove by hand before assembly.
  • If not otherwise specified, build to IPC 6012 Class 2 or better.

Materials

  • No controlled impedance.
  • Outer layers must be 1 oz Copper, inner layers can be 0.5 or 1.0 oz Copper.
  • Isola FR408HR or material recommended.
  • Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.
  • White silkscreen on top and bottom surface
  • Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.

Suggested Stack Up

Layer Thickness Notes
Top Copper 0.043 mm / 1.7 mil Layer 1 foil, 1 oz Cu after plating
prepreg 0.200 mm / 7.9 mil Prepreg - Isola FR408HR 2113
Layer 2 0.018 mm / 0.7 mil Layer 2 foil, 0.5 oz Cu
Core 0.991 mm / 39 mil Core Isola FR408HR
Layer 3 0.018 mm / 0.7 mil Layer 3 foil, 0.5 oz Cu
prepreg 0.200 mm / 7.9 mil Prepreg - Isola FR408HR 2113
Bottom Copper 0.043 mm / 1.7 mil Layer 4 foil, 1 oz copper after plating
Total Stackup 1.588 mm / 62.5 mil

Array / Panel Information

  • Coordinate with Contract Manufacturer (CM) for optimal size of this panel.
  • If no feedback from CM, then produce single boards (no panel).

Fabrication Files

IPC-2581 File

Filename Notes
PROJECT-NAME-ipc2581.xml IPC-2581 board information file

Legacy PCB Files

Filename Notes
PROJECT-NAME-Edge_Cuts.gbr RS274X file for the dimension (outline) layer
PROJECT-NAME-F_Silkscreen.gbr RS274X file for the top silkscreen
PROJECT-NAME-F_Mask.gbr RS274X file for the top soldermask
PROJECT-NAME-F_Cu.gbr RS274X file for the top copper layer
PROJECT-NAME-In1_Cu.gbr RS274X file for the layer 2 copper
PROJECT-NAME-In2_Cu.gbr RS274X file for the layer 3 copper
PROJECT-NAME-B_Cu.gbr RS274X file for the bottom copper layer
PROJECT-NAME-B_Mask.gbr RS274X file for the bottom soldermask
PROJECT-NAME-B_Silkscreen.gbr RS274X file for the bottom silkscreen
PROJECT-NAME-NPTH.drl Excellon file for non-plated through holes
PROJECT-NAME-PTH.drl Excellon file for plated through holes

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Printed Circuit Board Assembly (PCBA) Information

Assembly Info

  • There are components on the top side of the board.
  • This PCBA is mostly surface mount (SMT) with a one through-hole (THT) component.

Assembly Requirements

  • Assemble to IPC Class 2 or better
  • Bake components that are not moisture sealed to appropriate levels as required.
  • Solder paste MUST be leaded.
  • Aqueous flux and wash strongly preferred.
    • Clean to NASA Standard "Visibly Clean (VC)": No particles or residues are visible to the naked eye.
  • No conformal coating.
  • Ship in antistatic protective bag

Component Specific Assembly Information

  • No specific requirements.

Assembly Files

IPC-2581 File

Filename Notes
PROJECT-NAME-ipc2581.xml IPC-2581 board information file

Bill of Materials (BOM)

Filename Description
PROJECT-NAME-bom.csv BOM in Comma Separated Variable format

Solder Paste Stencils

Filename Notes
PROJECT-NAME-B_Paste.gbr RS274X file for top/front solder paste stencil
PROJECT-NAME-F_Paste.gbr RS274X file for bottom/back solder paste stencil

Mounting/Placement Location

Filename Description
PROJECT-NAME-3u.pos Pick and place locations for components