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oresat-solar-hardware/1u_panel/kicad/1u_panel.pretty/STM32F091C.kicad_mod
danayamurphy 53e7ddf337 imported eagle files into kicad and committed
2023-04-17 17:13:24 -07:00

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(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 4516c74b-e55d-4807-9dcb-147e5710248a))
(pad "15" smd rect (at 4.25 1.75 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp ea7bd00a-f37a-4a70-b246-0d8353dec0f1))
(pad "16" smd rect (at 4.25 1.25 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 50bbc666-f6ad-4b12-9252-1ffda2bf0fb4))
(pad "17" smd rect (at 4.25 0.75 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 5b4b6a6e-027d-4e2d-bb73-d5577f960713))
(pad "18" smd rect (at 4.25 0.25 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 374994e2-0e38-4429-8d1b-6ee72dbba9ec))
(pad "19" smd rect (at 4.25 -0.25 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 39e9bf7f-de3c-46d3-9c79-7c7f4366c7d3))
(pad "20" smd rect (at 4.25 -0.75 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 29b980fc-5fe6-4728-93ca-98a4e42c1fbf))
(pad "21" smd rect (at 4.25 -1.25 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp ab647771-d9cc-4f3a-93ae-af4f77e03591))
(pad "22" smd rect (at 4.25 -1.75 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp ac94739e-f933-457b-82a5-3fca3e538a37))
(pad "23" smd rect (at 4.25 -2.25 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 118182e5-5383-4cd1-b054-3a630a72c6b2))
(pad "24" smd rect (at 4.25 -2.75 180) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp ae49f180-0af5-4d2f-b486-4fa5ddbdddc9))
(pad "25" smd rect (at 2.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp a24c9e7a-f545-4445-93d2-0d47f24ee816))
(pad "26" smd rect (at 2.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp b3d29d05-214b-453b-9a2c-fa2ecc7ea053))
(pad "27" smd rect (at 1.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 743ea8b3-b3c4-457e-ad4c-10ea66fe26ca))
(pad "28" smd rect (at 1.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 93ad0f8a-224c-47f4-97c4-1c5824c62961))
(pad "29" smd rect (at 0.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 08a929db-f7f8-490c-959d-c86aa4943b15))
(pad "30" smd rect (at 0.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 6e24bad4-a1ef-4c54-aef0-d8162e7e0e81))
(pad "31" smd rect (at -0.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 2e1fc409-1d35-4f79-9486-e099fa643bb8))
(pad "32" smd rect (at -0.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 9b43efc2-77c8-40f9-a38b-97cfaa827651))
(pad "33" smd rect (at -1.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 43b2e538-162b-4c9d-9411-8f74cfbe5098))
(pad "34" smd rect (at -1.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 053c446a-c581-4e52-b3aa-899e45f392c9))
(pad "35" smd rect (at -2.25 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp e9e488ef-8b78-4f83-8c7f-82d0c3cabc64))
(pad "36" smd rect (at -2.75 -4.25 270) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 023e6e81-6db1-4cfc-8f62-0e44b640339b))
(pad "37" smd rect (at -4.25 -2.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp fa20d632-690a-4a46-9703-0b0d0641831a))
(pad "38" smd rect (at -4.25 -2.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 5195cad2-fa81-4451-b2ca-eb203d943deb))
(pad "39" smd rect (at -4.25 -1.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp af1ebad7-4bdf-49db-8af1-6e8563bfed8c))
(pad "40" smd rect (at -4.25 -1.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 94524298-7006-46f9-8706-fbb25a5545c2))
(pad "41" smd rect (at -4.25 -0.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp b6b44465-75da-4461-affc-1e86340a40c3))
(pad "42" smd rect (at -4.25 -0.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 62d97487-56bc-456f-8978-9527186ca7d9))
(pad "43" smd rect (at -4.25 0.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp dd4f0504-f7f3-487a-9145-1b2083eccfeb))
(pad "44" smd rect (at -4.25 0.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 2208def5-db68-4f5e-b968-7777ea07f97b))
(pad "45" smd rect (at -4.25 1.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 09c7eb38-9eba-4047-a685-b9bd931d4a14))
(pad "46" smd rect (at -4.25 1.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp b5c82bdd-2ffc-4900-827e-622b7b4adfbd))
(pad "47" smd rect (at -4.25 2.25) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp 79ffe411-99be-4304-ae28-cbd79d0aa3ee))
(pad "48" smd rect (at -4.25 2.75) (size 1.2 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.0635) (thermal_bridge_angle 45) (tstamp d0707611-7401-4c10-8ede-ee9a55fec815))
)
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