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uw-midsun-hardware/MSXII_BMS_AFE/Project Outputs for BMS_AFE
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Chenao Yuan af68991d90
Mh 54 bms carrier board (#108) 
* enlarge the hole size on thermal pad

* MH-54 Changed diameter of via on the thermal relief to 0.6mm, updated the version number

* MH-54 Generate and update the project outputs

* enlarge hole size for footprint IC HSD DUAL-CHANNEL TSOP65P640X120_HS-17N

* MH-54 BMS Carrier Organized the output files

* mh-54 tent the via by C21, fix 3D models' offset and update few supplier link in library

* mh-54 update the fabrication files

* fix the overlay of label FAN4 and P12

Co-authored-by: Liam Hawkins <45611744+lghawkin@users.noreply.github.com>
2020-02-05 20:31:40 -05:00
..
Fabrication Files HW-87 BMS Carrier Board Rev 4 (#89) 2019-04-06 15:50:34 -04:00
Rev 4.1 HW-160 BMS AFE Rev 5 (#84) 2019-03-26 21:45:21 -04:00
BMS_AFE_4.1.xlsx~HEAD HW-87 BMS Carrier Board Rev 4 (#89) 2019-04-06 15:50:34 -04:00
BMS_AFE_4.1.xlsx~master HW-87 BMS Carrier Board Rev 4 (#89) 2019-04-06 15:50:34 -04:00
BMS_AFE_5.0.PDF HW-160 BMS AFE Rev 5 (#84) 2019-03-26 21:45:21 -04:00
BMS_AFE_5.0.step HW-160 BMS AFE Rev 5 (#84) 2019-03-26 21:45:21 -04:00
BMS_AFE_5.0.xlsx HW-160 BMS AFE Rev 5 (#84) 2019-03-26 21:45:21 -04:00
lockfile.lck Mh 54 bms carrier board (#108) 2020-02-05 20:31:40 -05:00
Status Report.Txt HW-160 BMS AFE Rev 5 (#84) 2019-03-26 21:45:21 -04:00