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51 lines
3.0 KiB
Plaintext
51 lines
3.0 KiB
Plaintext
(module "QFN45P300X300X100-21N-D" (layer F.Cu)
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(descr "rje")
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(tags "Integrated Circuit")
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(attr smd)
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(fp_text reference IC** (at 0 0) (layer F.SilkS)
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(effects (font (size 1.27 1.27) (thickness 0.254)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 1.27 1.27) (thickness 0.254)))
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)
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(fp_text value "QFN45P300X300X100-21N-D" (at 0 0) (layer F.SilkS) hide
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(effects (font (size 1.27 1.27) (thickness 0.254)))
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)
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(fp_line (start -2.125 -2.125) (end 2.125 -2.125) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.125 -2.125) (end 2.125 2.125) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.125 2.125) (end -2.125 2.125) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.125 2.125) (end -2.125 -2.125) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
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(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
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(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5 -1.05) (end -1.05 -1.5) (layer F.Fab) (width 0.1))
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(fp_circle (center -1.8745 -1.575) (end -1.8745 -1.4625) (layer F.SilkS) (width 0.225))
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(pad 1 smd rect (at -1.45 -0.9 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -1.45 -0.45 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -1.45 0 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -1.45 0.45 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -1.45 0.9 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -0.9 1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at -0.45 1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 0 1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 0.45 1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at 0.9 1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 1.45 0.9 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 1.45 0.45 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 1.45 0 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 1.45 -0.45 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at 1.45 -0.9 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at 0.9 -1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 0.45 -1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 18 smd rect (at 0 -1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 19 smd rect (at -0.45 -1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 20 smd rect (at -0.9 -1.45 0) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask))
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(pad 21 smd rect (at 0 0 0) (size 1.026 1.075) (layers F.Cu F.Paste F.Mask))
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(model TPS56C230RJER.stp
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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