forked from MUREX/electrical
77 lines
6.5 KiB
Plaintext
77 lines
6.5 KiB
Plaintext
(footprint "EDAC 690-019-298-412" (version 20230410) (generator pcbnew)
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(layer "F.Cu")
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(attr smd)
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(fp_text reference "EDAC 690-019-298-412" (at -6.01142 -2.43939) (layer "F.SilkS") (tstamp 1cc094a6-0188-4092-b2d1-cc7dcb617687)
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(effects (font (size 0.800457 0.800457) (thickness 0.05)))
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(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp a6382446-4eb2-413d-8676-b08ee21cfde4))
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(pad "1" smd rect (at 4.5 -0.73 90) (size 2.6 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fb3ecc2e-ade2-4f60-87bb-cb1e9fcbf558))
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(pad "9" smd rect (at 0.5 -0.73 90) (size 2.6 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0a7906ff-a4db-4afb-b5fa-cf70c50a84d4))
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(pad "12" smd rect (at -1 -0.73 90) (size 2.6 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c3134f3e-1eb4-4ede-864c-5c17a40f3fd3))
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(pad "19" smd rect (at -4.5 -0.73 90) (size 2.6 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1c3325b0-97e4-4dfe-9010-7836799cd80a))
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(pad "SH1" thru_hole oval (at 7.25 0) (size 1.5 3.3) (drill oval 0.9 2.7) (layers "*.Cu" "*.Mask") (tstamp e3205586-cda5-4187-9187-80794490bd82))
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(pad "SH2" thru_hole oval (at -7.25 0) (size 1.5 3.3) (drill oval 0.9 2.7) (layers "*.Cu" "*.Mask") (tstamp 326886f7-b68e-4ee7-b9bd-075080b943b1))
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(pad "SH3" thru_hole oval (at -7.25 5.96) (size 1.5 2.3) (drill oval 0.9 1.7) (layers "*.Cu" "*.Mask") (tstamp 4f4b37e0-4680-433b-bd8b-2ad65c9275c8))
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(pad "SH4" thru_hole oval (at 7.25 5.96) (size 1.5 2.3) (drill oval 0.9 1.7) (layers "*.Cu" "*.Mask") (tstamp 59b63a7a-6614-4c15-8006-94f07b2db07f))
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(model "./CM4IO.3dshapes/471511051.stp"
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(offset (xyz 0 -10.5 3.5))
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(scale (xyz 1 1 1))
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(rotate (xyz -90 0 0))
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)
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)
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