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electrical/power2/LIB_282837-2/282837-2/CR-8000/2828372.ftf

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(ftf
(header
(version 2.0)
(unit DBUNIT)
)
(TechnologyContainer
(technology SamacSys_Footprint
(footprintLayer
(layer Top (type Conductive))
(layer Inner (type Conductive))
(layer Bottom (type Conductive))
(layer Silk-Top (type Symbolmark))
(layer Silk-Bottom (type Symbolmark))
(layer Resist-Top (type Solderresist))
(layer Resist-Bottom (type Solderresist))
(layer MetalMask-Top (type Metalmask))
(layer MetalMask-Bottom (type Metalmask))
(layer CompArea-Top (type Comparea))
(layer CompArea-Bottom (type Comparea))
(layer Assembly-Top (type Undefined))
(layer Assembly-Bottom (type Undefined))
(layer Hole (type Hole))
)
)
)
(footprintContainer
(commonParameters
(dimensionParameters
(arrowLength 100000)
(arrowAngle 15.000000)
(dotDiameter 100000)
(textFrameOffset 100000)
(arrowOffset 100000)
(dimAssistOffset 100000)
(dimLineWidth 10000)
(drawTextFrame NO)
(textFrameRange ALL)
(textClip NO)
(standard JIS)
)
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(padstackGroups
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)
(pads
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(photo FLASH)
(panelUse NO)
(geometry
(circle 82500
(pt 0 0)
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)
)
); End of pads
(padstacks
(padstack c165h110
(type PLATED)
(throughMode THROUGH)
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(Hole (footLayer Hole)
(geometry
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(pt 0 0)
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(padSet (footLayer Top)
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(padSet (footLayer Resist-Top)
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(padSet (footLayer Resist-Bottom)
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(padSet (footLayer Inner)
(clearance (pad c165))
(connect (pad c165))
(noconnect (pad c165))
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(padSet (footLayer Bottom)
(connect (pad c165))
(noconnect (pad c165))
)
)
); End of padstacks
(footprints
(footprint "2828372"
(polarity YES)
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(heelprint
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(layer (footLayer Silk-Top)
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); End of layout
); End of heelprint
(toeprint
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(layout
(layer (FPADSTACK)
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(pin 2
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); End of toeprint
(propertyS accurateShape 282837-2.stp)
); End of footprint
); End of footprints
); End of footprintContainer
); End of ftf