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mark-hughes:0.2a

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Archimajor.PcbDoc

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mark-hughes commented 2022-07-14 20:34:34 +00:00

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Unfilled vias can lead to solder wicking and insufficient bonding between the land pad and part pad. Please design footprint according to IPC-7351 guidelines.

!thumbnail[](Archimajor.PcbDoc){ diff="mark-hughes/Archimajor:b3d8f4944eb75153b8fa17971bfa92dc89bf8cbd...078977c646cae5ceb4a742a237cc5af05467e1c1" pr="1" layers="82,74,72,71,69,68,66,65,64,63,60,59,58,57,33,35,37,1,2,41,40,39,32,38,34" diff-visibility="full" variant="default" view-coords="27.7,52.3,32.9,59.4" aspect-ratio="1.346" } Unfilled vias can lead to solder wicking and insufficient bonding between the land pad and part pad. Please design footprint according to IPC-7351 guidelines.

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EndStops.SchDoc

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