power-test/gerber/power-test-drl.rpt
Willow Herron 7a5f94adf6 fab ready
2024-11-03 21:53:47 -08:00

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Drill report for power-test.kicad_pcb
Created on 2024-11-03T12:25:52-0800
Copper Layer Stackup:
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L1 : F.Cu front
L2 : In1.Cu in1
L3 : In2.Cu in2
L4 : In3.Cu in3
L5 : In4.Cu in4
L6 : B.Cu back
Drill file 'power-test-PTH.drl' contains
plated through holes:
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T1 0.500mm 0.0197" (37 holes)
T2 0.800mm 0.0315" (6 holes)
T3 1.000mm 0.0394" (8 holes)
T4 1.100mm 0.0433" (6 holes)
T5 1.200mm 0.0472" (6 holes)
T6 1.250mm 0.0492" (2 holes)
Total plated holes count 65
Drill file 'power-test-NPTH.drl' contains
unplated through holes:
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T1 3.200mm 0.1260" (2 holes)
Total unplated holes count 2