power-test/gerber/power-test-job.gbrjob
Willow Herron 7a5f94adf6 fab ready
2024-11-03 21:53:47 -08:00

195 lines
4.1 KiB
Plaintext

{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "8.0.6"
},
"CreationDate": "2024-11-03T12:26:14-08:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "power-test",
"GUID": "706f7765-722d-4746-9573-742e6b696361",
"Revision": "rev?"
},
"Size": {
"X": 67.8,
"Y": 50.55
},
"LayerNumber": 6,
"BoardThickness": 1.6,
"Finish": "Immersion gold"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.2,
"PadToTrack": 0.2,
"TrackToTrack": 0.2,
"MinLineWidth": 0.6,
"TrackToRegion": 0.2,
"RegionToRegion": 0.2
},
{
"Layers": "Inner",
"PadToPad": 0.2,
"PadToTrack": 0.2,
"TrackToTrack": 0.2,
"MinLineWidth": 0.2,
"TrackToRegion": 0.5,
"RegionToRegion": 0.5
}
],
"FilesAttributes": [
{
"Path": "power-test-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "power-test-In1_Cu.gbr",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "power-test-In2_Cu.gbr",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "power-test-In3_Cu.gbr",
"FileFunction": "Copper,L4,Inr",
"FilePolarity": "Positive"
},
{
"Path": "power-test-In4_Cu.gbr",
"FileFunction": "Copper,L5,Inr",
"FilePolarity": "Positive"
},
{
"Path": "power-test-B_Cu.gbr",
"FileFunction": "Copper,L6,Bot",
"FilePolarity": "Positive"
},
{
"Path": "power-test-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "power-test-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "power-test-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "power-test-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "power-test-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "F.Cu/In1.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In1.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.535,
"Material": "FR4",
"Name": "In1.Cu/In2.Cu",
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In2.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "In2.Cu/In3.Cu",
"Notes": "Type: dielectric layer 3 (from In2.Cu to In3.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In3.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.535,
"Material": "FR4",
"Name": "In3.Cu/In4.Cu",
"Notes": "Type: dielectric layer 4 (from In3.Cu to In4.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In4.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.1,
"Material": "FR4",
"Name": "In4.Cu/B.Cu",
"Notes": "Type: dielectric layer 5 (from In4.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}