Add component update request, moved templates, add design review component template #19

Merged
AllSpiceAlice merged 1 commits from develop into main 2023-08-29 01:24:24 +00:00
3 changed files with 208 additions and 0 deletions

View File

@ -0,0 +1,67 @@
name: Update component request
about: Request a component to be updated/deleted
title: "[Update component request]: "
body:
- type: markdown
attributes:
value: Request a component to be updated/deleted
# Justification
- type: input
id: what
attributes:
label: Requested changes
description: Describe requested changes
placeholder: "Add thermal pad to footprint"
value: ""
validations:
required: true
# Where used
- type: input
id: where-used
attributes:
label: Affected components
description: List what components are affected
placeholder: "All quad flat pack footprints with ground pads"
value: ""
# Part numbers
- type: textarea
id: description
attributes:
label: Description
description: Describe the changes you'd like to make
placeholder: "Update all footprints of quad packages that have footprints to include the thermal ground pad"
value: ""
render: "true"
validations:
required: true
# Checklist
- type: checkboxes
id: checklist
attributes:
label: Checklist
options:
- label: Checked library for existing parts
- label: Price check
- label: QTY check
- label: Lead time check
- label: Distributor part number
- label: Datasheet review
- label: Symbol review
- label: Footprint review
- label: Component check (symbol+footprint review)
- label: Package check
- label: Dimension check
- label: Automotive grade
- label: Space grade
- label: FMEA analysis
- type: markdown
attributes:
value: |
## Attach files
(datasheet, design notes, firmware)

View File

@ -0,0 +1,141 @@
---
name: "AllSpice component review template"
about: "Optional description"
---
*This short description prepends any pull request. It is fully markdown compatible. See [markdown guide](https://www.markdownguide.org/cheat-sheet/) for examples of what you can do!*
## Resolved Issues
<!-- Include any relevant issues closed by this pull request. Use the form "Closes #<number of issue>" -->
...
## Description
<!-- Include a description for this design review. What is the primary purpose? What will be the status of this design after approval? -->
...
## Design Review Checklist
### Process
- [ ] Commits in correct branch
- [ ] File names follow standard
- [ ] Update project README page
### System
- [ ] Power
- [ ] Supply rated for necessary country specifications
- [ ] Estimated total worst-case power supply draw
- [ ] Connectors
- [ ] Sufficient Current and Voltage rating
- [ ] Mating connectors have matching pinout
- [ ] Same contact material specified for mating connectors
- [ ] Testing
- [ ] Test procedure written
- [ ] Environmental
- [ ] Specified min/max operating temperature
- [ ] Specified min/max storage temperature
- [ ] Specified min/max humidity
- [ ] ROHS compliance requirement review
### Components
- [ ] Components meet environmental specifications
- [ ] All components have quantity, reference designator and description
- [ ] Suggested and alternate manufacturers listed
- [ ] Price and stock checked for each component
- [ ] Component derating
- [ ] Voltage
- [ ] Current
- [ ] Power at worst-case operating temperature
- [ ] Temperature at worst-case power
### Schematics
- [ ] Microcontrollers / ICs
- [ ] Check the data sheet errata and apnotes for weird IC behaviors
- [ ] Busses
- [ ] UART/USART TX->RX and RX<-TX
- [ ] I2C SDA and SCL pins correct(https://www.ti.com/lit/an/slva689/slva689.pdf)
- [ ] Analog
- [ ] Sufficient power rails for analog circuits
- [ ] Amplifiers checked for stability
- [ ] Consider signal rate-of-rise and fall for noise radiation
- [ ] General
- [ ] Sufficient bulk capacitance calculated
- [ ] Polarized components checked
- [ ] Electrolytic/tantalum capacitors checked for no reverse voltage
- [ ] Electrolytic/tantalum capacitors temperature/voltage derating sufficient for MTBF
- [ ] Check pin numbers of all custom-generated parts
- [ ] Check reverse base-emitter current/voltage on bipolar transistors
- [ ] Power nets use preferred and consistent naming (ex. no `3.3V` vs `+3.3V`)
- [ ] Debug resources added by design (leds, serial ports, etc.) even if unpopulated by default
### PCB
- [ ] Manufacturing
- [ ] PCB manufacturing requirements noted on `fab` layer
- [ ] Plating specified
- [ ] Plating material
- [ ] Plating thickness
- [ ] Layer stack-up specified
- [ ] Minimum trace/space specified
- [ ] Minimum hole size specified
- [ ] Controlled impedance specified
- [ ] Blind or buried vias specified
- [ ] Footprints
- [ ] Pin 1 marked in a consistent manner
- [ ] Component polarity marked
- [ ] Diodes, LEDs
- [ ] Electrolytic, tantalum capacitors
- [ ] Keyed components like connectors
- [ ] Footprint dimensions cross-checked with datasheet recommendation
- [ ] Sufficient thermal pads on high-power components or nets
- [ ] Clearance
- [ ] Keep-out areas honored
- [ ] Around mounting holes
- [ ] For programming tools
- [ ] For assembly tools (wrenches, screwdrivers etc.)
- [ ] For connectors
- [ ] Trace-to-trace clearance based upon voltage rating
- [ ] Component size based upon voltage rating
- [ ] Mechanical
- [ ] CAD file uploaded
- [ ] Clearance above connectors
- [ ] Clearance below through-hole components
- [ ] Mounting holes electrically isolated if necessary
- [ ] Mounting holes have via stitching
- [ ] Hole diameters leave margin for plating
- [ ] Electrical
- [ ] ERC passes
- [ ] Isolation barriers are large enough
- [ ] Signal integrity
- [ ] Gaps in ground planes checked and minimized
- [ ] High-speed signals avoid gaps in ground planes
- [ ] Stubs minimized for high-speed signals
- [ ] Differential pair spacing based upon impedance matching
- [ ] Via fencing of sensitive RF transission lines done with the proper via spacing (< 1/20 lambda)
- [ ] Option for a shielding can over sensitive circuitry e.g. RF?
- [ ] Copper pour
- [ ] All planes have been poured
- [ ] Planes and pours checked for high-impedance paths
- [ ] No pour between adjacent pins on ICs
- [ ] Traces
- [ ] Trace-pad connections sufficiently obtuse (angle 90 deg or more)
- [ ] Trace widths sufficient for the current draw and max heating
- [ ] No connections between adjacent pins on ICs
- [ ] Vias for internal power traces sufficiently large
- [ ] Mitered bends or soft curves (r > 3 trace width) for impedance sensitive traces
- [ ] Thermal
- [ ] Temperature sensitive components placed away from hot components
- [ ] Thermal vias in thermal pads
- [ ] Silk screen
- [ ] Notes and documentation
- [ ] Updated revision number
- [ ] Updated date
- [ ] No silk screen over pads / vias
- [ ] Text is readable from at most two directions
- [ ] Silk screen size / font will legible after printing
- [ ] Connector pin-outs labeled
- [ ] Fuse size and type marked on PCB
- [ ] Functional groups marked
- [ ] Functionality labeled
- [ ] Test points
- [ ] LEDs
- [ ] Buttons
- [ ] Connectors/terminals
- [ ] Jumpers/fuses
<!-- Special thanks to Henrik Enggaard Hansen for https://pcbchecklist.com/ -->