Add HDMI symbol and footprint #20

Open
AllSpiceAlice wants to merge 2 commits from AU/add_hdmi into main

Resolved Issues

Closes #18: create HDMI connector

Description

Adding HDMI connector

Design Review Checklist

Process

  • Commits in correct branch
  • File names follow standard
  • Update project README page

System

  • Power
    • Supply rated for necessary country specifications
    • Estimated total worst-case power supply draw
  • Connectors
    • Sufficient Current and Voltage rating
    • Mating connectors have matching pinout
    • Same contact material specified for mating connectors
  • Testing
    • Test procedure written
  • Environmental
    • Specified min/max operating temperature
    • Specified min/max storage temperature
    • Specified min/max humidity
  • ROHS compliance requirement review

Components

  • Components meet environmental specifications
  • All components have quantity, reference designator and description
  • Suggested and alternate manufacturers listed
  • Price and stock checked for each component
  • Component derating
    • Voltage
    • Current
    • Power at worst-case operating temperature
    • Temperature at worst-case power

Schematics

  • Microcontrollers / ICs
    • Check the data sheet errata and apnotes for weird IC behaviors
  • Busses
  • Analog
    • Sufficient power rails for analog circuits
    • Amplifiers checked for stability
    • Consider signal rate-of-rise and fall for noise radiation
  • General
    • Sufficient bulk capacitance calculated
    • Polarized components checked
    • Electrolytic/tantalum capacitors checked for no reverse voltage
    • Electrolytic/tantalum capacitors temperature/voltage derating sufficient for MTBF
    • Check pin numbers of all custom-generated parts
    • Check reverse base-emitter current/voltage on bipolar transistors
    • Power nets use preferred and consistent naming (ex. no 3.3V vs +3.3V)
    • Debug resources added by design (leds, serial ports, etc.) even if unpopulated by default

PCB

  • Manufacturing
    • PCB manufacturing requirements noted on fab layer
      • Plating specified
        • Plating material
        • Plating thickness
      • Layer stack-up specified
      • Minimum trace/space specified
      • Minimum hole size specified
      • Controlled impedance specified
      • Blind or buried vias specified
  • Footprints
    • Pin 1 marked in a consistent manner
    • Component polarity marked
      • Diodes, LEDs
      • Electrolytic, tantalum capacitors
      • Keyed components like connectors
    • Footprint dimensions cross-checked with datasheet recommendation
    • Sufficient thermal pads on high-power components or nets
  • Clearance
    • Keep-out areas honored
      • Around mounting holes
      • For programming tools
      • For assembly tools (wrenches, screwdrivers etc.)
      • For connectors
    • Trace-to-trace clearance based upon voltage rating
    • Component size based upon voltage rating
  • Mechanical
    • CAD file uploaded
    • Clearance above connectors
    • Clearance below through-hole components
    • Mounting holes electrically isolated if necessary
      • Mounting holes have via stitching
    • Hole diameters leave margin for plating
  • Electrical
    • ERC passes
    • Isolation barriers are large enough
  • Signal integrity
    • Gaps in ground planes checked and minimized
    • High-speed signals avoid gaps in ground planes
    • Stubs minimized for high-speed signals
    • Differential pair spacing based upon impedance matching
    • Via fencing of sensitive RF transission lines done with the proper via spacing (< 1/20 lambda)
    • Option for a shielding can over sensitive circuitry e.g. RF?
  • Copper pour
    • All planes have been poured
    • Planes and pours checked for high-impedance paths
    • No pour between adjacent pins on ICs
  • Traces
    • Trace-pad connections sufficiently obtuse (angle 90 deg or more)
    • Trace widths sufficient for the current draw and max heating
    • No connections between adjacent pins on ICs
    • Vias for internal power traces sufficiently large
    • Mitered bends or soft curves (r > 3 trace width) for impedance sensitive traces
  • Thermal
    • Temperature sensitive components placed away from hot components
    • Thermal vias in thermal pads
  • Silk screen
    • Notes and documentation
      • Updated revision number
      • Updated date
    • No silk screen over pads / vias
    • Text is readable from at most two directions
    • Silk screen size / font will legible after printing
    • Connector pin-outs labeled
    • Fuse size and type marked on PCB
    • Functional groups marked
    • Functionality labeled
      • Test points
      • LEDs
      • Buttons
      • Connectors/terminals
      • Jumpers/fuses
## Resolved Issues Closes #18: create HDMI connector ## Description Adding HDMI connector ## Design Review Checklist ### Process - [x] Commits in correct branch - [x] File names follow standard - [x] Update project README page ### System - [x] Power - [x] Supply rated for necessary country specifications - [x] Estimated total worst-case power supply draw - [x] Connectors - [x] Sufficient Current and Voltage rating - [x] Mating connectors have matching pinout - [x] Same contact material specified for mating connectors - [x] Testing - [x] Test procedure written - [x] Environmental - [x] Specified min/max operating temperature - [x] Specified min/max storage temperature - [x] Specified min/max humidity - [x] ROHS compliance requirement review ### Components - [x] Components meet environmental specifications - [ ] All components have quantity, reference designator and description - [ ] Suggested and alternate manufacturers listed - [x] Price and stock checked for each component - [x] Component derating - [x] Voltage - [x] Current - [x] Power at worst-case operating temperature - [ ] Temperature at worst-case power ### Schematics - [x] Microcontrollers / ICs - [ ] Check the data sheet errata and apnotes for weird IC behaviors - [x] Busses - [x] UART/USART TX->RX and RX<-TX - [ ] I2C SDA and SCL pins correct(https://www.ti.com/lit/an/slva689/slva689.pdf) - [x] Analog - [x] Sufficient power rails for analog circuits - [ ] Amplifiers checked for stability - [ ] Consider signal rate-of-rise and fall for noise radiation - [x] General - [x] Sufficient bulk capacitance calculated - [ ] Polarized components checked - [ ] Electrolytic/tantalum capacitors checked for no reverse voltage - [ ] Electrolytic/tantalum capacitors temperature/voltage derating sufficient for MTBF - [ ] Check pin numbers of all custom-generated parts - [ ] Check reverse base-emitter current/voltage on bipolar transistors - [ ] Power nets use preferred and consistent naming (ex. no `3.3V` vs `+3.3V`) - [ ] Debug resources added by design (leds, serial ports, etc.) even if unpopulated by default ### PCB - [x] Manufacturing - [x] PCB manufacturing requirements noted on `fab` layer - [ ] Plating specified - [ ] Plating material - [ ] Plating thickness - [ ] Layer stack-up specified - [ ] Minimum trace/space specified - [ ] Minimum hole size specified - [ ] Controlled impedance specified - [ ] Blind or buried vias specified - [x] Footprints - [x] Pin 1 marked in a consistent manner - [ ] Component polarity marked - [ ] Diodes, LEDs - [ ] Electrolytic, tantalum capacitors - [ ] Keyed components like connectors - [ ] Footprint dimensions cross-checked with datasheet recommendation - [ ] Sufficient thermal pads on high-power components or nets - [x] Clearance - [ ] Keep-out areas honored - [ ] Around mounting holes - [ ] For programming tools - [ ] For assembly tools (wrenches, screwdrivers etc.) - [ ] For connectors - [ ] Trace-to-trace clearance based upon voltage rating - [ ] Component size based upon voltage rating - [x] Mechanical - [x] CAD file uploaded - [x] Clearance above connectors - [x] Clearance below through-hole components - [ ] Mounting holes electrically isolated if necessary - [ ] Mounting holes have via stitching - [ ] Hole diameters leave margin for plating - [x] Electrical - [x] ERC passes - [x] Isolation barriers are large enough - [x] Signal integrity - [ ] Gaps in ground planes checked and minimized - [ ] High-speed signals avoid gaps in ground planes - [ ] Stubs minimized for high-speed signals - [ ] Differential pair spacing based upon impedance matching - [ ] Via fencing of sensitive RF transission lines done with the proper via spacing (< 1/20 lambda) - [ ] Option for a shielding can over sensitive circuitry e.g. RF? - [x] Copper pour - [x] All planes have been poured - [x] Planes and pours checked for high-impedance paths - [x] No pour between adjacent pins on ICs - [x] Traces - [x] Trace-pad connections sufficiently obtuse (angle 90 deg or more) - [x] Trace widths sufficient for the current draw and max heating - [x] No connections between adjacent pins on ICs - [x] Vias for internal power traces sufficiently large - [x] Mitered bends or soft curves (r > 3 trace width) for impedance sensitive traces - [ ] Thermal - [ ] Temperature sensitive components placed away from hot components - [ ] Thermal vias in thermal pads - [ ] Silk screen - [ ] Notes and documentation - [ ] Updated revision number - [ ] Updated date - [ ] No silk screen over pads / vias - [ ] Text is readable from at most two directions - [ ] Silk screen size / font will legible after printing - [ ] Connector pin-outs labeled - [ ] Fuse size and type marked on PCB - [ ] Functional groups marked - [ ] Functionality labeled - [ ] Test points - [ ] LEDs - [ ] Buttons - [ ] Connectors/terminals - [ ] Jumpers/fuses <!-- Special thanks to Henrik Enggaard Hansen for https://pcbchecklist.com/ -->
AllSpiceAlice added the
4 - high
documentation
labels 2023-08-29 13:23:48 +00:00
AllSpiceAlice added 1 commit 2023-08-29 13:23:48 +00:00
AllSpiceAlice changed title from Add HDMI symbol and footpring to Add HDMI symbol and footprint 2023-08-29 13:24:54 +00:00
AllSpiceAlice requested review from RevaReviewa 2023-08-29 14:05:31 +00:00
AllSpiceAlice requested review from PavelInPurchasing 2023-08-29 14:05:31 +00:00
AllSpiceAlice requested review from MikaChanical 2023-08-29 14:15:50 +00:00
Member

@AllSpiceUser , I've reviewed all the footprints, everything looks great.

@AllSpiceUser , I've reviewed all the footprints, everything looks great.

@AllSpiceUser, what effect will this have on our legacy video outputs?

@AllSpiceUser, what effect will this have on our legacy video outputs?
Author
Owner

@AllSpiceUser, what effect will this have on our legacy video outputs?

Unfortunately @PavelInPurchasing, we'll have to create a ramp-down plan. We're moving to all HDMI by 2025. Those legacy connectors won't be supported after then.

> @AllSpiceUser, what effect will this have on our legacy video outputs? Unfortunately @PavelInPurchasing, we'll have to create a ramp-down plan. We're moving to all HDMI by 2025. Those legacy connectors won't be supported after then.
AllSpiceAlice added 1 commit 2023-09-14 17:29:58 +00:00
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