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Minor fixes for V1.1 #2

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allspice-hermes commented 2024-07-12 18:18:06 +00:00
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Resolved Issues

Closes #5

Description

Minor fixes to the PCB and Sch files. Added required capacitors, resistors and re-positioned some components for better distribution

Design Review Checklist

Process

  • Schematic and PCB file names follow standard
  • Export necessary review files (3D model, BOM, etc.)
  • Update relevant system architecture documents
  • Update project README page
  • Simulations uploaded and outputs explained

System

  • Power
    • Sufficient power supplied from upstream source
    • Supply rated for necessary country specifications
    • Estimated total worst-case power supply draw
  • Connectors
    • I/Os are specified
    • Sufficient Current and Voltage rating
    • Mating connectors have matching pinout
    • Same contact material specified for mating connectors
  • Testing
    • Test procedure written
  • Environmental
    • Specified min/max operating temperature
    • Specified min/max storage temperature
    • Specified min/max humidity
  • ROHS compliance requirement review

Components

  • Unpopulated components are denoted DNI
  • Components meet environmental specifications
  • All components have quantity, reference designator and description
  • Suggested and alternate manufacturers listed
  • Price and stock checked for each component
  • Component derating
    • Voltage
    • Current
    • Power at worst-case operating temperature
    • Temperature at worst-case power

Schematics

  • Document
    • Dot on each connection
    • No four-point connections
    • Title block completed for each sheet
    • All components have reference designators and values
    • Multi-part components don't have unplaced symbols
    • Page title present and consistent on all pages if not in title block
    • Symbols identify open collector/drain pins and internal pulled up/down pins
    • Pin names and attributes on symbols with multi-function pins should match actual design usage (I/O/Bi, Name)
    • Components follow preferred reference designator pattern

PCB

  • Manufacturing
    • PCB manufacturing requirements noted on fab layer
      • Plating specified
        • Plating material
        • Plating thickness
      • Layer stack-up specified
      • Minimum trace/space specified
      • Minimum hole size specified
      • PCB color specified
      • Silkscreen color specified
      • Controlled impedance specified
      • Blind or buried vias specified
      • Panelization specified
        • External routing specified (ex. v-groove vs route)
      • Drill table generated
      • All specifications exceed manufacturing tolerance
## Resolved Issues Closes #5 ## Description Minor fixes to the PCB and Sch files. Added required capacitors, resistors and re-positioned some components for better distribution ## Design Review Checklist ### Process - [ ] Schematic and PCB file names follow standard - [ ] Export necessary review files (3D model, BOM, etc.) - [ ] Update relevant system architecture documents - [ ] Update project README page - [ ] Simulations uploaded and outputs explained ### System - [ ] Power - [ ] Sufficient power supplied from upstream source - [ ] Supply rated for necessary country specifications - [ ] Estimated total worst-case power supply draw - [ ] Connectors - [ ] I/Os are specified - [ ] Sufficient Current and Voltage rating - [ ] Mating connectors have matching pinout - [ ] Same contact material specified for mating connectors - [ ] Testing - [ ] Test procedure written - [ ] Environmental - [ ] Specified min/max operating temperature - [ ] Specified min/max storage temperature - [ ] Specified min/max humidity - [ ] ROHS compliance requirement review ### Components - [ ] Unpopulated components are denoted DNI - [ ] Components meet environmental specifications - [ ] All components have quantity, reference designator and description - [ ] Suggested and alternate manufacturers listed - [ ] Price and stock checked for each component - [ ] Component derating - [ ] Voltage - [ ] Current - [ ] Power at worst-case operating temperature - [ ] Temperature at worst-case power ### Schematics - [ ] Document - [ ] Dot on each connection - [ ] No four-point connections - [ ] Title block completed for each sheet - [ ] All components have reference designators and values - [ ] Multi-part components don't have unplaced symbols - [ ] Page title present and consistent on all pages if not in title block - [ ] Symbols identify open collector/drain pins and internal pulled up/down pins - [ ] Pin names and attributes on symbols with multi-function pins should match actual design usage (I/O/Bi, Name) - [ ] Components follow preferred reference designator pattern <!-- Link to spec --> ### PCB - [ ] Manufacturing - [ ] PCB manufacturing requirements noted on `fab` layer - [ ] Plating specified - [ ] Plating material - [ ] Plating thickness - [ ] Layer stack-up specified - [ ] Minimum trace/space specified - [ ] Minimum hole size specified - [ ] PCB color specified - [ ] Silkscreen color specified - [ ] Controlled impedance specified - [ ] Blind or buried vias specified - [ ] Panelization specified - [ ] External routing specified (ex. v-groove vs route) - [ ] Drill table generated - [ ] All specifications exceed manufacturing tolerance
allspice-hermes added 1 commit 2024-07-12 18:18:06 +00:00
allspice-hermes added the
priority/3 - medium
layout
 labels 2024-07-12 18:51:24 +00:00
allspice-hermes self-assigned this 2024-07-12 18:51:28 +00:00
allspice-hermes requested review from RevaReviewa 2024-07-12 18:51:42 +00:00
allspice-hermes requested review from MikaChanical 2024-07-12 18:51:42 +00:00
allspice-hermes closed this pull request 2024-07-18 17:56:07 +00:00

Pull request closed

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Reference: AllSpice-Demos/KiCAD-Demo#2
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