KiCAD-Demo/.allspice/pull_request_template.md

Resolved Issues

Include any relevant issues closed by this pull request. Use the form "Closes #" ...

Description

Include a description for this design review. What is the primary purpose? What will be the status of this design after approval? ...

Design Review Checklist

Process

• Schematic and PCB file names follow standard
• Export necessary review files (3D model, BOM, etc.)
• Update relevant system architecture documents
• Update project README page
• Simulations uploaded and outputs explained

System

• Power
  • Sufficient power supplied from upstream source
  • Supply rated for necessary country specifications
  • Estimated total worst-case power supply draw
• Connectors
  • I/Os are specified
  • Sufficient Current and Voltage rating
  • Mating connectors have matching pinout
  • Same contact material specified for mating connectors
• Testing
  • Test procedure written
• Environmental
  • Specified min/max operating temperature
  • Specified min/max storage temperature
  • Specified min/max humidity
• ROHS compliance requirement review

Components

• Unpopulated components are denoted DNI
• Components meet environmental specifications
• All components have quantity, reference designator and description
• Suggested and alternate manufacturers listed
• Price and stock checked for each component
• Component derating
  • Voltage
  • Current
  • Power at worst-case operating temperature
  • Temperature at worst-case power

Schematics

• Document
  • Dot on each connection
  • No four-point connections
  • Title block completed for each sheet
  • All components have reference designators and values
  • Multi-part components don't have unplaced symbols
  • Page title present and consistent on all pages if not in title block
  • Symbols identify open collector/drain pins and internal pulled up/down pins
  • Pin names and attributes on symbols with multi-function pins should match actual design usage (I/O/Bi, Name)
  • Components follow preferred reference designator pattern

PCB

• Manufacturing
  • PCB manufacturing requirements noted on fab layer
    • Plating specified
      • Plating material
      • Plating thickness
    • Layer stack-up specified
    • Minimum trace/space specified
    • Minimum hole size specified
    • PCB color specified
    • Silkscreen color specified
    • Controlled impedance specified
    • Blind or buried vias specified
    • Panelization specified
      • External routing specified (ex. v-groove vs route)
    • Drill table generated
    • All specifications exceed manufacturing tolerance