Board Mechanical Review #12

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opened 2026-07-21 15:55:52 +00:00 by allspice-wayne · 0 comments
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What changed mechanically since the last review?

Updated mounting holes to match new mechanical drawing. Request complete mechanical review.

Board and Enclosure Fit

  • PCB outline and dimensions match the mechanical model and enclosure drawing
  • Mounting hole size, location, and plating confirmed. Keepout zones respected.
  • Board-to-board or board-to-chassis standoff heights verified
  • Any cutouts, slots, or notches in the PCB confirmed against enclosure features

Component Clearance and Height

  • Tallest components identified and cleared against enclosure lid, adjacent boards, and cables
  • No components within keepout zones around mounting hardware
  • Heat-generating components have adequate clearance for airflow or heatsink attachment
  • Component placement does not obstruct access to connectors, test points, or adjustment features

Connector Selection and Placement

  • Connector locations align with panel cutouts, cable entry points, and mating clearances
  • Connector mating direction verified. Adequate clearance for mating and unmating.
  • Connector mechanical retention reviewed. Locking mechanism or strain relief present where needed.
  • IP rating of connectors meets enclosure ingress protection requirement
  • Contact material and plating compatible with mating connector and environment

Thermal Management

  • Thermal interface materials specified where required. TIM type and thickness confirmed.
  • Heatsink or thermal pad attachment method reviewed. Mounting hardware and torque specified.
  • Airflow path unobstructed by component placement or board orientation
  • Operating temperature at worst-case power dissipation reviewed against component and enclosure ratings

Cable Routing and Assembly

  • Cable routing paths clear. No pinch points, sharp edges, or interference with moving parts.
  • Strain relief specified at all cable attachment points
  • Connector orientation supports efficient assembly and service access
  • Assembly sequence reviewed. No components block installation of others.

Regulatory and Marking

  • Required regulatory markings present and legible (IEC symbols, voltage, class)
  • Silkscreen and labels visible after assembly in enclosure
  • Serial number and revision marking location confirmed with manufacturing

Findings

No response

Sign-Off

No response

### What changed mechanically since the last review? Updated mounting holes to match new mechanical drawing. Request complete mechanical review. ### Board and Enclosure Fit - [ ] PCB outline and dimensions match the mechanical model and enclosure drawing - [ ] Mounting hole size, location, and plating confirmed. Keepout zones respected. - [ ] Board-to-board or board-to-chassis standoff heights verified - [ ] Any cutouts, slots, or notches in the PCB confirmed against enclosure features ### Component Clearance and Height - [ ] Tallest components identified and cleared against enclosure lid, adjacent boards, and cables - [ ] No components within keepout zones around mounting hardware - [ ] Heat-generating components have adequate clearance for airflow or heatsink attachment - [ ] Component placement does not obstruct access to connectors, test points, or adjustment features ### Connector Selection and Placement - [ ] Connector locations align with panel cutouts, cable entry points, and mating clearances - [ ] Connector mating direction verified. Adequate clearance for mating and unmating. - [ ] Connector mechanical retention reviewed. Locking mechanism or strain relief present where needed. - [ ] IP rating of connectors meets enclosure ingress protection requirement - [ ] Contact material and plating compatible with mating connector and environment ### Thermal Management - [ ] Thermal interface materials specified where required. TIM type and thickness confirmed. - [ ] Heatsink or thermal pad attachment method reviewed. Mounting hardware and torque specified. - [ ] Airflow path unobstructed by component placement or board orientation - [ ] Operating temperature at worst-case power dissipation reviewed against component and enclosure ratings ### Cable Routing and Assembly - [ ] Cable routing paths clear. No pinch points, sharp edges, or interference with moving parts. - [ ] Strain relief specified at all cable attachment points - [ ] Connector orientation supports efficient assembly and service access - [ ] Assembly sequence reviewed. No components block installation of others. ### Regulatory and Marking - [ ] Required regulatory markings present and legible (IEC symbols, voltage, class) - [ ] Silkscreen and labels visible after assembly in enclosure - [ ] Serial number and revision marking location confirmed with manufacturing ### Findings _No response_ ### Sign-Off _No response_
allspice-wayne added the
feature
layout
mechanical
priority/3 - medium
labels 2026-07-21 15:56:07 +00:00
allspice-wayne added this to the V3 Project Update milestone 2026-07-21 15:56:09 +00:00
MikaChanical was assigned by allspice-wayne 2026-07-21 15:56:18 +00:00
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Reference: AllSpice-Demos/SystemCap-Demo-Project#12
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