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Package_DFN_QFN:Texas_DRB0008A: Added missing property to thermal vias
See merge request kicad/libraries/kicad-footprints!3960
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@ -343,6 +343,7 @@
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(at -0.5 0)
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(size 0.5 0.5)
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(drill 0.2)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "a2794304-6f9c-45ee-ac0f-376a65c22c4e")
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@ -365,6 +366,7 @@
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(at 0 -0.625)
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(size 0.5 0.5)
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(drill 0.2)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "1cbf9478-38c5-4327-8e7b-4cc11c20798f")
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@ -387,6 +389,7 @@
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(at 0 0.625)
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(size 0.5 0.5)
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(drill 0.2)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "497eceef-42ea-43ac-95a1-3fb97c1bf567")
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@ -409,6 +412,7 @@
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(at 0.5 0)
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(size 0.5 0.5)
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(drill 0.2)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(remove_unused_layers no)
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(uuid "e57efd26-d4ba-495c-9a01-0110e1693c07")
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