mirror of
https://gitlab.com/kicad/libraries/kicad-footprints.git
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Touchoup some keep out area rules
Tag-Connect: Allow Pads and traces SFP-Conector: Allow Pads, vias and copper, disallow traces and footprints microSD_HC_Hirose*: Split keepout area to prevent DRC warning Linx_RXM_GPS: Is now fully hatched SIMCom_SIM900: Disallow pads in Area-B Microchip_RN4871: fix courtyard
This commit is contained in:
parent
ed39a40a70
commit
4944576777
Connector.pretty
Connector_SFP_and_Cage.kicad_modTag-Connect_TC2030-IDC-FP_2x03_P1.27mm_Vertical.kicad_modTag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical.kicad_modTag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical.kicad_modTag-Connect_TC2050-IDC-NL_2x05_P1.27mm_Vertical.kicad_modTag-Connect_TC2050-IDC-NL_2x05_P1.27mm_Vertical_with_bottom_clip.kicad_modTag-Connect_TC2070-IDC-FP_2x07_P1.27mm_Vertical.kicad_mod
Connector_Card.pretty
RF_GPS.pretty
RF_GSM.pretty
RF_Module.pretty
@ -1,6 +1,6 @@
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(footprint "Connector_SFP_and_Cage" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61FEE2B2)
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(tedit 620171EE)
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||||
(descr "https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=2227302&DocType=Customer+Drawing&DocLang=English")
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(tags "SFP+ SFP")
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(attr smd)
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@ -108,10 +108,10 @@
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(pad "CAGE" thru_hole circle (at -4.6 7.125) (size 1.5 1.5) (drill 0.95) (layers *.Cu *.Mask) (tstamp e53430c5-1bd7-4ebf-9102-329795e29374))
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(pad "CAGE" thru_hole rect (at -27.1 -7.125) (size 2 2) (drill 1.05) (layers *.Cu *.Mask) (tstamp ec252533-fcf6-4777-97d7-b68e891e3b47))
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(pad "CAGE" thru_hole circle (at -9.6 -7.125) (size 1.5 1.5) (drill 0.95) (layers *.Cu *.Mask) (tstamp f6c7b838-1619-42fa-8803-552845ff1017))
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 6cad0a2a-4cb0-4ee3-a83c-cd896f71dc2b) (hatch full 0.508)
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 7ecca34d-ce63-4ed5-9ab4-60b25efa3831) (hatch full 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour allowed) (footprints not_allowed))
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(keepout (tracks not_allowed) (vias allowed) (pads allowed ) (copperpour allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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||||
(pts
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||||
|
@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2030-IDC-FP_2x03_P1.27mm_Vertical" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D2C7)
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(tedit 62016DFE)
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(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -39,10 +39,10 @@
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(pad "4" connect circle (at 0 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 6909bc0f-dc8d-41d1-8f1a-f628a3fa8e05))
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(pad "5" connect circle (at 1.27 0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp dd51353d-2cf5-4a4f-9aab-f13c879361a9))
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(pad "6" connect circle (at 1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp c6d7c4bf-8d40-4dd6-98ad-e2c5a2677c2e))
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp ce4040d5-27ee-43a3-9488-07270bca5a5a) (hatch full 0.508)
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 25ada721-670a-4020-ae0b-77410c4e375a) (hatch full 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks not_allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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||||
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@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D301)
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(tedit 62016E06)
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(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -35,10 +35,10 @@
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(pad "4" connect circle (at 0 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 659e371b-5f69-4ef0-9f3c-600bba994579))
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(pad "5" connect circle (at 1.27 0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 356bdc74-443f-47c5-8ce8-a3ed2c9255ee))
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(pad "6" connect circle (at 1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp c69e1cc9-e21f-419e-9c91-24726f9c6382))
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp e07d32e9-6abc-4b88-ba3a-2156fcbbcbb5) (hatch full 0.508)
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 55b6b040-a746-4424-a5b4-1f45a1d15120) (hatch full 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks not_allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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||||
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@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D3FC)
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(tedit 62016E0F)
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(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-430%20Datasheet.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -43,10 +43,10 @@
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(pad "8" connect circle (at 0 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 181b65e3-9e2b-4bad-b49c-ab6c1e2c3370))
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(pad "9" connect circle (at -1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp d132467e-baad-4df9-8789-da7fcd51e4fe))
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(pad "10" connect circle (at -2.54 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 94ccdc57-5b6c-442f-aa09-8a0026a6a48a))
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 5f4fe7ba-9e7b-431a-81db-a78277714ec9) (hatch full 0.508)
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 42a0b0eb-418d-4a6c-b34a-c60d1edfa6b1) (hatch full 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks not_allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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||||
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@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2050-IDC-NL_2x05_P1.27mm_Vertical" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D419)
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(tedit 62016E15)
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(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-NL%20Datasheet.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -95,10 +95,10 @@
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(pad "8" connect circle (at 0 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 22a8fc86-6025-4c1e-bd6b-ae161daa5355))
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(pad "9" connect circle (at -1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 2f7f3677-80b5-4bfe-b73d-a9ecc864c275))
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(pad "10" connect circle (at -2.54 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 0490f742-c202-4bd7-8c0a-25a9bd959d25))
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp e42b7e93-618e-4876-a82a-7488f06396a5) (hatch full 0.508)
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp f559c4d6-733f-431c-8eeb-d76337ee4def) (hatch full 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks not_allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2050-IDC-NL_2x05_P1.27mm_Vertical_with_bottom_clip" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D423)
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(tedit 62016E1C)
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(descr "Tag-Connect programming header with bottom courtyard for TC2050-NL Clip board ; https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-IDC-NL_Datasheet_8.pdf https://www.tag-connect.com/wp-content/uploads/bsk-pdf-manager/TC2050-CLIP_Datasheet_25.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -103,10 +103,10 @@
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(pad "8" connect circle (at 0 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 41c193f4-2305-44a8-acd4-54bd874a030f))
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||||
(pad "9" connect circle (at -1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 653735c5-9650-4d1c-8fbf-76f3facd394d))
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||||
(pad "10" connect circle (at -2.54 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 13b6d3be-7559-4809-acf9-0c8bc6eb0995))
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp fc386388-fbea-487a-ad2e-d2eb7e155d60) (hatch full 0.508)
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 915afd34-85f2-4f65-b2f6-5c607c325148) (hatch full 0.508)
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||||
(connect_pads (clearance 0))
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||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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||||
(polygon
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||||
(pts
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||||
|
@ -1,6 +1,6 @@
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(footprint "Tag-Connect_TC2070-IDC-FP_2x07_P1.27mm_Vertical" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4D43A)
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||||
(tedit 62016E22)
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(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2070-IDC%20Datasheet.pdf")
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(tags "tag connect programming header pogo pins")
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(attr exclude_from_pos_files exclude_from_bom)
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@ -47,10 +47,10 @@
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(pad "12" connect circle (at -1.27 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp b58d4478-a936-45db-93e7-5048121642ea))
|
||||
(pad "13" connect circle (at -2.54 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp 57a8fc74-f2a7-4b3b-a3df-65b16d2d990b))
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||||
(pad "14" connect circle (at -3.81 -0.635) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask") (tstamp e0c85292-781c-42ef-8584-d7dff2f93c02))
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 80d4a527-d2a9-4690-8d11-c148a8d9e800) (hatch full 0.508)
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||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 1eed5896-aa04-45cd-9356-be7e685c823f) (hatch full 0.508)
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||||
(connect_pads (clearance 0))
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(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
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||||
(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour not_allowed) (footprints not_allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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||||
|
@ -1,6 +1,6 @@
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(footprint "microSD_HC_Hirose_DM3AT-SF-PEJM5" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 61D4C0A1)
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(tedit 62016F73)
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(descr "Micro SD, SMD, right-angle, push-pull (https://www.hirose.com/product/en/download_file/key_name/DM3AT-SF-PEJM5/category/Drawing%20(2D)/doc_file_id/44099/?file_category_id=6&item_id=06090031000&is_series=)")
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(tags "Micro SD")
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(attr smd)
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@ -86,21 +86,7 @@
|
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(pad "11" smd rect (at 6.675 7.375) (size 1.3 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5b63e2f0-5c93-4e49-aed2-9e4171b31824))
|
||||
(pad "11" smd rect (at 4.325 -7.725) (size 1 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 73790d06-0792-4a85-90a6-bea9bbf93bb9))
|
||||
(pad "11" smd rect (at -6.825 -3.425) (size 1 1.2) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 9ce495f9-4e92-4dbc-8edf-00e89c0997fe))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 60844b4b-acad-40db-bf6f-fae8a40cd826) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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||||
(polygon
|
||||
(pts
|
||||
(xy 2.925 6.975)
|
||||
(xy 5.475 6.975)
|
||||
(xy 5.475 8.325)
|
||||
(xy 2.925 8.325)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 775e7d1b-d5c7-4dee-8de5-d3a22e3f0991) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 213a2af1-412b-47f4-ab3b-c5f43b6be7a6) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
@ -109,26 +95,12 @@
|
||||
(pts
|
||||
(xy -6.475 0.775)
|
||||
(xy -7.225 0.775)
|
||||
(xy -7.225 -7.275)
|
||||
(xy -6.475 -7.275)
|
||||
(xy -7.225 -2.825)
|
||||
(xy -6.475 -2.825)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp b616b717-7130-40ea-9c67-b34caa288035) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -6.125 -1.425)
|
||||
(xy -5.425 -1.425)
|
||||
(xy -5.425 6.175)
|
||||
(xy -6.125 6.175)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp dc909162-76ba-4986-9d9a-9c7447ae5a25) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 6199bec7-e7eb-4ae0-b9ec-c563e157d635) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
@ -142,6 +114,48 @@
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 7f3eb118-a20c-4239-b800-c9211c66847d) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -6.475 -4.025)
|
||||
(xy -7.225 -4.025)
|
||||
(xy -7.225 -7.275)
|
||||
(xy -6.475 -7.275)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp d2de4093-1fc2-4bc1-94b6-4d0fe3426c6f) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -6.125 -1.425)
|
||||
(xy -5.425 -1.425)
|
||||
(xy -5.425 6.175)
|
||||
(xy -6.125 6.175)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp e47adf3d-9c24-4345-80c9-66679cad107e) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy 2.925 6.975)
|
||||
(xy 5.475 6.975)
|
||||
(xy 5.475 8.325)
|
||||
(xy 2.925 8.325)
|
||||
)
|
||||
)
|
||||
)
|
||||
(model "${KICAD6_3DMODEL_DIR}/Connector_Card.3dshapes/microSD_HC_Hirose_DM3AT-SF-PEJM5.wrl"
|
||||
(offset (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
|
@ -1,6 +1,6 @@
|
||||
(footprint "microSD_HC_Hirose_DM3BT-DSF-PEJS" (version 20211014) (generator pcbnew)
|
||||
(layer "F.Cu")
|
||||
(tedit 61D4C0D1)
|
||||
(tedit 62016FD3)
|
||||
(descr "Micro SD, SMD, reverse on-board, right-angle, push-pull (https://www.hirose.com/product/en/download_file/key_name/DM3BT-DSF-PEJS/category/Drawing%20(2D)/doc_file_id/44097/?file_category_id=6&item_id=06090029900&is_series=)")
|
||||
(tags "Micro SD")
|
||||
(attr smd)
|
||||
@ -68,7 +68,7 @@
|
||||
(pad "11" smd rect (at -6.575 7.375) (size 1.5 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 985046ec-657b-4f1c-99ae-774dfd82821d))
|
||||
(pad "11" smd rect (at -4.675 -7.625) (size 1 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b511126a-32ce-47e8-8b28-e7b1fcdab590))
|
||||
(pad "11" smd rect (at -5.575 8.075) (size 0.5 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c9ebaf5a-be09-4f4c-9d02-21159d825262))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 4b1bf859-453e-4f06-932c-ff939bb2a810) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp ad660c70-c749-4a2b-b6f8-2d6803a806d8) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
@ -77,6 +77,20 @@
|
||||
(pts
|
||||
(xy 6.475 0.775)
|
||||
(xy 7.225 0.775)
|
||||
(xy 7.225 -2.825)
|
||||
(xy 6.475 -2.825)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp ff0e0c14-7ce9-493b-9fd4-786183bf280d) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy 6.475 -4.025)
|
||||
(xy 7.225 -4.025)
|
||||
(xy 7.225 -7.275)
|
||||
(xy 6.475 -7.275)
|
||||
)
|
||||
|
@ -1,6 +1,6 @@
|
||||
(footprint "Linx_RXM-GPS" (version 20211014) (generator pcbnew)
|
||||
(layer "F.Cu")
|
||||
(tedit 61D9E435)
|
||||
(tedit 6201707C)
|
||||
(descr "GPS Module, Linx (https://linxtechnologies.com/wp/wp-content/uploads/rxm-gps-rm.pdf)")
|
||||
(tags "gps linx")
|
||||
(attr smd)
|
||||
@ -66,7 +66,7 @@
|
||||
(pad "20" smd rect (at 6.5 -6.35 90) (size 0.7 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4c781c9a-e807-49d4-86ff-6cdd1c359e5b))
|
||||
(pad "21" smd rect (at -6.3 0 90) (size 0.92 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2ace8487-40da-41e8-ba8c-fda79875719f))
|
||||
(pad "22" smd rect (at 6.3 0 90) (size 0.92 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8bd25b4b-dd37-4432-8ed4-7622bdbe8e23))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp f2787062-e264-478f-b44d-8be18349539f) (hatch edge 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 02565f97-cd17-42be-94e0-c07f1614224c) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
|
@ -1,6 +1,6 @@
|
||||
(footprint "SIMCom_SIM900" (version 20211014) (generator pcbnew)
|
||||
(layer "F.Cu")
|
||||
(tedit 61D9E2B1)
|
||||
(tedit 620170CF)
|
||||
(descr "Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf")
|
||||
(tags "GSM Module SIM900")
|
||||
(attr smd)
|
||||
@ -125,10 +125,10 @@
|
||||
(pad "66" smd oval (at -6 -12) (size 0.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b56ca38b-85e0-45cc-b06a-e72d6a04032f))
|
||||
(pad "67" smd oval (at -7 -12) (size 0.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a106b45b-b432-437d-abe6-f77080d31dd1))
|
||||
(pad "68" smd oval (at -8 -12) (size 0.6 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5dca691d-218c-477d-a6fb-f5e530be9742))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp ea5d7d53-f23a-4652-9a17-b14556c12c7c) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 8174ff25-f2f4-4079-ac82-9d147c6420b9) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour allowed) (footprints allowed))
|
||||
(keepout (tracks allowed) (vias not_allowed) (pads not_allowed ) (copperpour allowed) (footprints allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
@ -139,7 +139,7 @@
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp ee8996ab-e5f2-47a7-bfa9-6358b52a0784) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp e3b225b6-9dd7-4224-bfd0-ec113e04e53e) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
|
@ -1,6 +1,6 @@
|
||||
(footprint "Microchip_RN4871" (version 20211014) (generator pcbnew)
|
||||
(layer "F.Cu")
|
||||
(tedit 61FED80A)
|
||||
(tedit 6201717F)
|
||||
(descr "Microchip RN4871 footprint")
|
||||
(tags "RN4871 BLE")
|
||||
(attr smd)
|
||||
@ -38,10 +38,10 @@
|
||||
)
|
||||
(fp_line (start -4.7 -4.1) (end -4.7 -4.4) (layer "F.SilkS") (width 0.12) (tstamp 87dcbc2e-a0da-4cc2-ac56-fec1b49cc638))
|
||||
(fp_line (start -5.1 -4.1) (end -4.7 -4.1) (layer "F.SilkS") (width 0.12) (tstamp a9b48f2b-eb44-444b-8e21-40f66a82ca8a))
|
||||
(fp_line (start -5.38 4.08) (end 5.36 4.08) (layer "F.CrtYd") (width 0.05) (tstamp 136cfcde-f951-46e4-8f8e-5d540f84266e))
|
||||
(fp_line (start -5.36 4.08) (end 5.36 4.08) (layer "F.CrtYd") (width 0.05) (tstamp 136cfcde-f951-46e4-8f8e-5d540f84266e))
|
||||
(fp_line (start 5.36 4.08) (end 5.36 -8.61) (layer "F.CrtYd") (width 0.05) (tstamp 164397f7-3508-460b-a22b-47b9e1ab4740))
|
||||
(fp_line (start 5.36 -8.61) (end -5.38 -8.61) (layer "F.CrtYd") (width 0.05) (tstamp c87d9ee9-d105-4d80-a68e-689c3dbdb1b1))
|
||||
(fp_line (start -5.38 4.08) (end -5.38 -8.61) (layer "F.CrtYd") (width 0.05) (tstamp d24edef9-230a-4036-9112-bf2bdcbefbd9))
|
||||
(fp_line (start 5.36 -8.61) (end -5.36 -8.61) (layer "F.CrtYd") (width 0.05) (tstamp c87d9ee9-d105-4d80-a68e-689c3dbdb1b1))
|
||||
(fp_line (start -5.36 4.08) (end -5.36 -8.61) (layer "F.CrtYd") (width 0.05) (tstamp d24edef9-230a-4036-9112-bf2bdcbefbd9))
|
||||
(fp_line (start 4.5 3.25) (end 4.5 -8.25) (layer "F.Fab") (width 0.1) (tstamp 5af8c5cc-fa59-4b4d-af1c-b015149cd992))
|
||||
(fp_line (start -4.5 -8.25) (end -4.5 3.25) (layer "F.Fab") (width 0.1) (tstamp 60aedfba-1877-408b-8361-382ffa335794))
|
||||
(fp_line (start -4.5 3.25) (end 4.5 3.25) (layer "F.Fab") (width 0.1) (tstamp 901907af-c6c1-4290-adba-513601a86a2f))
|
||||
@ -62,35 +62,7 @@
|
||||
(pad "14" smd rect (at 4.35 -1.05 90) (size 0.7 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 284e650a-809f-45d8-920d-19343fe8bf81))
|
||||
(pad "15" smd rect (at 4.35 -2.3 90) (size 0.7 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 491fc85a-642a-46cc-9ec2-28cc7eb5cf8b))
|
||||
(pad "16" smd rect (at 4.35 -3.45 90) (size 0.7 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 868a1f52-a571-4ec8-b4aa-00ec886bf8c9))
|
||||
(zone (net 0) (net_name "") (layers *.Cu) (tstamp 3ad38a53-ba98-4059-a4a6-363cd1acc6a5) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -4.5 -4.25)
|
||||
(xy 4.5 -4.25)
|
||||
(xy 4.5 -8.25)
|
||||
(xy -4.5 -8.25)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 6abec51c-ec74-4310-a127-a3703c24bb5d) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -1.6 -0.75)
|
||||
(xy -3.5 -0.75)
|
||||
(xy -3.5 -4.25)
|
||||
(xy -1.6 -4.25)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp f587efca-c95e-49e9-b30d-e65ef3433c1a) (hatch full 0.508)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 19cbda20-8968-4c35-923e-40ce69eb2c34) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
@ -104,6 +76,34 @@
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 3016f82c-f9ba-4261-b0a3-5308a5a478cd) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -1.6 -0.75)
|
||||
(xy -3.5 -0.75)
|
||||
(xy -3.5 -4.25)
|
||||
(xy -1.6 -4.25)
|
||||
)
|
||||
)
|
||||
)
|
||||
(zone (net 0) (net_name "") (layers *.Cu) (tstamp f6222b4f-14ee-41a9-9938-9739811dada7) (hatch full 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
|
||||
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
(polygon
|
||||
(pts
|
||||
(xy -4.5 -4.25)
|
||||
(xy 4.5 -4.25)
|
||||
(xy 4.5 -8.25)
|
||||
(xy -4.5 -8.25)
|
||||
)
|
||||
)
|
||||
)
|
||||
(model "${KICAD6_3DMODEL_DIR}/RF_Module.3dshapes/Microchip_RN4871.wrl"
|
||||
(offset (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
|
Loading…
Reference in New Issue
Block a user