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Add Technik TWP-4002D-H3 dustproof USB B micro connector

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Kevin Joly 2021-03-09 14:45:20 +01:00 committed by kliment
parent aca44d624b
commit 5523ec4e52
1 changed files with 61 additions and 0 deletions

61
Connector_USB.pretty/USB_Micro-B_Technik_TWP-4002D-H3.kicad_mod Normal file
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(footprint "USB_Micro-B_Technik_TWP-4002D-H3" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 60477CF6)
(descr "Dustproof Micro USB Type B TWP-4002D-H3, https://www.technik.com.hk/images/pdf_product/WP4002D-H3-A_2.0.pdf")
(tags "USB Micro B horizontal dustproof waterproof IP67")
(attr smd)
(fp_text reference "REF**" (at 0 -2.825) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 46b64f65-acea-4c73-816a-dd825fc8d7c4)
)
(fp_text value "USB_Micro-B_Technik_TWP-4002D-H3" (at 0 7.275) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 04141b35-e025-4103-a161-7737c1c4b136)
)
(fp_text user "PCB Edge" (at 0 2.5) (layer "Dwgs.User")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ee1fd01e-1a58-4e69-b860-7dce4a6ee367)
)
(fp_text user "${REFERENCE}" (at 0 1) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp cdd00ac3-17ba-4b6a-a495-9bcc3f2902dd)
)
(fp_line (start 5.23 -0.625) (end 3.61 -0.625) (layer "F.SilkS") (width 0.12) (tstamp 066dfe04-dd09-4fca-8447-8f8ca00e1607))
(fp_line (start 5.23 2.995) (end 5.23 -0.625) (layer "F.SilkS") (width 0.12) (tstamp 6ff31ccf-2209-4883-97b3-b3094b5045ec))
(fp_line (start -1.3 -1.925) (end -1.5 -2.125) (layer "F.SilkS") (width 0.12) (tstamp 799e44c1-19fa-4597-bbf1-7a9203c2861e))
(fp_line (start -1.5 -2.125) (end -1.1 -2.125) (layer "F.SilkS") (width 0.12) (tstamp a5fad345-f28d-4fea-b4cc-fd0fb75b9ef0))
(fp_line (start -5.23 -0.525) (end -3.61 -0.525) (layer "F.SilkS") (width 0.12) (tstamp ace9612e-6c1e-409e-a75a-907da0ec2ab4))
(fp_line (start -5.23 2.995) (end -5.23 -0.525) (layer "F.SilkS") (width 0.12) (tstamp ad7b4555-f757-4572-8fad-dade41f3f278))
(fp_line (start -1.1 -2.125) (end -1.3 -1.925) (layer "F.SilkS") (width 0.12) (tstamp b096b58a-0364-49b0-824d-76014e3d7772))
(fp_line (start 5 3.175) (end -5 3.175) (layer "Dwgs.User") (width 0.1) (tstamp 8e65d513-e779-4a79-9ed1-db1189e7b5e1))
(fp_line (start -5.33 6.5) (end -5.33 -2) (layer "F.CrtYd") (width 0.05) (tstamp 5987c6da-9433-4d6f-ac27-d8d9d0e6c9bb))
(fp_line (start 5.33 6.5) (end -5.33 6.5) (layer "F.CrtYd") (width 0.05) (tstamp 65fd9f1b-0057-49f6-bd69-5d2e2aeac231))
(fp_line (start 5.33 -2) (end 5.33 6.5) (layer "F.CrtYd") (width 0.05) (tstamp b7c474f5-edbd-4ce3-a072-316037466239))
(fp_line (start -5.33 -2) (end 5.33 -2) (layer "F.CrtYd") (width 0.05) (tstamp ec1fe0e4-e5da-49e2-bf88-77e6ed48907d))
(fp_line (start -5 3.175) (end -5 4.175) (layer "F.Fab") (width 0.1) (tstamp 0c44cd5e-5671-4d99-be95-84a89e354f95))
(fp_line (start 4.25 6.175) (end 4.25 4.175) (layer "F.Fab") (width 0.1) (tstamp 410418a5-c316-43fd-b91c-ec901beecc63))
(fp_line (start 5 -0.325) (end 5 3.175) (layer "F.Fab") (width 0.1) (tstamp 625161d2-fa37-4b92-82b6-24c34d6f7d4f))
(fp_line (start -5 -0.325) (end 5 -0.325) (layer "F.Fab") (width 0.1) (tstamp 75a54f81-d3df-4556-820e-04be8300f4ec))
(fp_line (start -5 4.175) (end -4.25 4.175) (layer "F.Fab") (width 0.1) (tstamp 7da08f24-e8d7-453b-b4e7-35748d5ac9c9))
(fp_line (start 4.25 4.175) (end 5 4.175) (layer "F.Fab") (width 0.1) (tstamp 9747839e-7a3a-4d88-b30b-2891f30006fa))
(fp_line (start -1.3 -0.025) (end -1.1 -0.325) (layer "F.Fab") (width 0.1) (tstamp bce92d10-7f08-4150-a12c-500e9952c96b))
(fp_line (start -5 3.175) (end -5 -0.325) (layer "F.Fab") (width 0.1) (tstamp d1c8ba43-7066-4793-bfb4-5f6bc56bdc11))
(fp_line (start -4.25 4.175) (end -4.25 6.175) (layer "F.Fab") (width 0.1) (tstamp d4c99ee6-1ca7-48ae-8d92-416bc748f2b9))
(fp_line (start 5 4.175) (end 5 3.175) (layer "F.Fab") (width 0.1) (tstamp e665c916-3f43-4c07-be2a-a925b0f3ad91))
(fp_line (start -4.25 6.175) (end 4.25 6.175) (layer "F.Fab") (width 0.1) (tstamp ec60ce33-ca2d-408e-85fd-7645be24fafe))
(fp_line (start -1.5 -0.325) (end -1.3 -0.025) (layer "F.Fab") (width 0.1) (tstamp f895965d-d232-4feb-b1ec-f37b5830ad99))
(pad "" np_thru_hole circle (at -2.5 1.175) (size 1.1 1.1) (drill 1.1) (layers *.Cu *.Mask) (tstamp 4be8b846-59f4-451a-882b-77bb7f20611f))
(pad "" np_thru_hole circle (at 2.5 1.175) (size 1.1 1.1) (drill 1.1) (layers *.Cu *.Mask) (tstamp 58c8c9c3-3ddc-4669-b890-18a1e621bdc6))
(pad "1" smd rect (at -1.3 -1.075) (size 0.4 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1fff268e-157b-4142-bdf9-24b4991f822b))
(pad "2" smd rect (at -0.65 -1.075) (size 0.4 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 655f8774-a6a1-486f-be21-a6b8487ab4dd))
(pad "3" smd rect (at 0 -1.075) (size 0.4 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 95a7c5af-3874-4e75-be9d-9f0bb7e653f7))
(pad "4" smd rect (at 0.65 -1.075) (size 0.4 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a9bf188d-a0e7-42f8-a1a2-d0575f37ce38))
(pad "5" smd rect (at 1.3 -1.075) (size 0.4 1.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 23cbb213-69ef-4869-9408-61aa2b872995))
(pad "6" thru_hole oval (at -2.55 -1.025) (size 1.6 1.1) (drill oval 1.1 0.6) (layers *.Cu *.Mask) (tstamp 0672d94c-fa38-4e70-a076-04d5bd5d49ad))
(pad "6" thru_hole oval (at 2.55 -1.025) (size 1.6 1.1) (drill oval 1.1 0.6) (layers *.Cu *.Mask) (tstamp be75d398-b76d-4c0d-bacf-4c050633e8d8))
(model "${KICAD6_3DMODEL_DIR}/Connector_USB.3dshapes/USB_Micro-B_Technik_TWP-4002D-H3.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)