AllSpiceMirrors/kicad-footprints
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EP now no longer uses rounded corners for copper

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This commit is contained in:
Rene Pöschl 2019-11-09 00:39:21 +01:00
parent 086995abe4
commit 66c4783492
3 changed files with 8 additions and 8 deletions

4
Package_LGA.pretty/Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm.kicad_mod
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@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5D9F7937)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
@ -27,7 +27,7 @@
(pad 6 smd roundrect (at 1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask) (roundrect_rratio 0.113636))
(pad 9 smd rect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask))
(pad "" smd roundrect (at 0 -0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))

6
Package_LGA.pretty/Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias.kicad_mod
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@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
@ -27,11 +27,11 @@
(pad 6 smd roundrect (at 1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask) (roundrect_rratio 0.113636))
(pad 9 smd rect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask))
(pad 9 thru_hole circle (at 0 -0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd roundrect (at 0 0) (size 0.5 2) (layers B.Cu) (roundrect_rratio 0.25))
(pad 9 smd rect (at 0 0) (size 0.5 2) (layers B.Cu))
(pad "" smd roundrect (at 0 -0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))

6
Package_LGA.pretty/Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias.kicad_mod
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@ -1,4 +1,4 @@
(module Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
@ -29,11 +29,11 @@
(pad 8 smd roundrect (at 1.525 0) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 1.525 -0.6) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 10 smd roundrect (at 1.525 -1.2) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 11 smd roundrect (at -0.175 0) (size 0.7 2.9) (layers F.Cu F.Mask) (roundrect_rratio 0.160714))
(pad 11 smd rect (at -0.175 0) (size 0.7 2.9) (layers F.Cu F.Mask))
(pad 11 thru_hole circle (at -0.175 -1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 smd roundrect (at -0.175 0) (size 0.5 2.56) (layers B.Cu) (roundrect_rratio 0.225))
(pad 11 smd rect (at -0.175 0) (size 0.5 2.56) (layers B.Cu))
(pad "" smd roundrect (at -0.175 -0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))