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add scripted WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm (#648)
This commit is contained in:
Hubert Denkmair
Rene Pöschl
parent
381d08b097
commit
675853e91c
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(module WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm (layer F.Cu) (tedit 5B5DBBC6)
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(descr "WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf")
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(tags "BGA 56 0.4")
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(attr smd)
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(fp_text reference REF** (at 0 -2.722) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm (at 0 2.722) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 1.585 1.722) (end -1.585 1.722) (layer F.Fab) (width 0.1))
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(fp_line (start -1.585 1.722) (end -1.585 -0.9295) (layer F.Fab) (width 0.1))
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(fp_line (start -1.585 -0.9295) (end -0.7925 -1.722) (layer F.Fab) (width 0.1))
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(fp_line (start -0.7925 -1.722) (end 1.585 -1.722) (layer F.Fab) (width 0.1))
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(fp_line (start 1.585 -1.722) (end 1.585 1.722) (layer F.Fab) (width 0.1))
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(fp_line (start -2.59 -2.73) (end -2.59 2.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.59 2.73) (end 2.59 2.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.59 2.73) (end 2.59 -2.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.59 -2.73) (end -2.59 -2.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.9175 -1.847) (end 1.71 -1.847) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.71 -1.847) (end 1.71 1.847) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.71 1.847) (end -1.71 1.847) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.71 1.847) (end -1.71 -1.0545) (layer F.SilkS) (width 0.12))
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.74 0.74) (thickness 0.111)))
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)
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(pad A1 smd circle (at -1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A2 smd circle (at -0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A3 smd circle (at -0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A4 smd circle (at 0 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A5 smd circle (at 0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A6 smd circle (at 0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad A7 smd circle (at 1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B1 smd circle (at -1.2 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B2 smd circle (at -0.8 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B3 smd circle (at -0.4 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B4 smd circle (at 0 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B5 smd circle (at 0.4 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B6 smd circle (at 0.8 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad B7 smd circle (at 1.2 -1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C1 smd circle (at -1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C2 smd circle (at -0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C3 smd circle (at -0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C4 smd circle (at 0 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C5 smd circle (at 0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C6 smd circle (at 0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad C7 smd circle (at 1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D1 smd circle (at -1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D2 smd circle (at -0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D3 smd circle (at -0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D4 smd circle (at 0 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D5 smd circle (at 0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D6 smd circle (at 0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad D7 smd circle (at 1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E1 smd circle (at -1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E2 smd circle (at -0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E3 smd circle (at -0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E4 smd circle (at 0 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E5 smd circle (at 0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E6 smd circle (at 0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad E7 smd circle (at 1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F1 smd circle (at -1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F2 smd circle (at -0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F3 smd circle (at -0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F4 smd circle (at 0 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F5 smd circle (at 0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F6 smd circle (at 0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad F7 smd circle (at 1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G1 smd circle (at -1.2 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G2 smd circle (at -0.8 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G3 smd circle (at -0.4 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G4 smd circle (at 0 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G5 smd circle (at 0.4 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G6 smd circle (at 0.8 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad G7 smd circle (at 1.2 1) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H1 smd circle (at -1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H2 smd circle (at -0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H3 smd circle (at -0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H4 smd circle (at 0 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H5 smd circle (at 0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H6 smd circle (at 0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(pad H7 smd circle (at 1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio 0.055556))
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(model ${KISYS3DMOD}/Package_CSP.3dshapes/WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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