mirror of
https://gitlab.com/kicad/libraries/kicad-footprints.git
synced 2025-04-24 00:33:25 +00:00
Updates to CSP footprints
This commit is contained in:
Clayton G. Hobbs
parent
c13ebb16d0
commit
6e2e5cba67
Package_CSP.pretty
ST_WLCSP-100_Die422.kicad_modST_WLCSP-100_Die446.kicad_modST_WLCSP-100_Die452.kicad_modST_WLCSP-100_Die461.kicad_modST_WLCSP-104_Die437.kicad_modST_WLCSP-143_Die419.kicad_modST_WLCSP-143_Die449.kicad_modST_WLCSP-144_Die470.kicad_modST_WLCSP-168_Die434.kicad_modST_WLCSP-180_Die451.kicad_modST_WLCSP-25_Die425.kicad_modST_WLCSP-25_Die444.kicad_modST_WLCSP-25_Die457.kicad_modST_WLCSP-36_Die417.kicad_modST_WLCSP-36_Die440.kicad_modST_WLCSP-36_Die445.kicad_modST_WLCSP-36_Die458.kicad_modST_WLCSP-49_Die423.kicad_modST_WLCSP-49_Die431.kicad_modST_WLCSP-49_Die433.kicad_modST_WLCSP-49_Die435.kicad_modST_WLCSP-49_Die438.kicad_modST_WLCSP-49_Die439.kicad_modST_WLCSP-49_Die447.kicad_modST_WLCSP-49_Die448.kicad_modST_WLCSP-63_Die427.kicad_modST_WLCSP-64_Die414.kicad_modST_WLCSP-64_Die427.kicad_modST_WLCSP-64_Die435.kicad_modST_WLCSP-64_Die436.kicad_modST_WLCSP-64_Die441.kicad_modST_WLCSP-64_Die442.kicad_modST_WLCSP-64_Die462.kicad_modST_WLCSP-66_Die411.kicad_modST_WLCSP-66_Die432.kicad_modST_WLCSP-72_Die415.kicad_modST_WLCSP-81_Die415.kicad_modST_WLCSP-81_Die421.kicad_modST_WLCSP-81_Die463.kicad_modST_WLCSP-90_Die413.kicad_mod
@ -1,26 +1,26 @@
|
||||
(module ST_WLCSP-100_Die422 (layer F.Cu) (tedit 5AE0CF08)
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||||
(descr "WLCSP-100, 10x10 raster, 4.166x4.628mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf")
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(module ST_WLCSP-100_Die422 (layer F.Cu) (tedit 5AE11EAD)
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||||
(descr "WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf")
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||||
(tags "BGA 100 0.4")
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||||
(attr smd)
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||||
(fp_text reference REF** (at 0 -3.314) (layer F.SilkS)
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||||
(fp_text reference REF** (at 0 -3.3315) (layer F.SilkS)
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||||
(effects (font (size 1 1) (thickness 0.15)))
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||||
)
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||||
(fp_text value ST_WLCSP-100_Die422 (at 0 3.314) (layer F.Fab)
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||||
(fp_text value ST_WLCSP-100_Die422 (at 0 3.3315) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
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||||
)
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||||
(fp_line (start 2.083 2.314) (end -2.083 2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.083 2.314) (end -2.083 -1.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.083 -1.314) (end -1.083 -2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -1.083 -2.314) (end 2.083 -2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start 2.083 -2.314) (end 2.083 2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -3.09 -3.32) (end -3.09 3.32) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start -3.09 3.32) (end 3.09 3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.09 3.32) (end 3.09 -3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.09 -3.32) (end -3.09 -3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -1.208 -2.439) (end 2.208 -2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.208 -2.439) (end 2.208 2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.208 2.439) (end -2.208 2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start -2.208 2.439) (end -2.208 -1.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.1005 2.3315) (end -2.1005 2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.1005 2.3315) (end -2.1005 -1.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.1005 -1.3315) (end -1.1005 -2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -1.1005 -2.3315) (end 2.1005 -2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start 2.1005 -2.3315) (end 2.1005 2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -3.11 -3.34) (end -3.11 3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start -3.11 3.34) (end 3.11 3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start 3.11 3.34) (end 3.11 -3.34) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.11 -3.34) (end -3.11 -3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start -1.2255 -2.4565) (end 2.2255 -2.4565) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.2255 -2.4565) (end 2.2255 2.4565) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.2255 2.4565) (end -2.2255 2.4565) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start -2.2255 2.4565) (end -2.2255 -1.4565) (layer F.SilkS) (width 0.12))
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||||
(pad A1 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad A2 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad A3 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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@ -122,7 +122,7 @@
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(pad K9 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad K10 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(fp_text user %R (at 0 0) (layer F.Fab)
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||||
(effects (font (size 0.97 0.97) (thickness 0.1455)))
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(effects (font (size 0.98 0.98) (thickness 0.147)))
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)
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(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-100_Die422.wrl
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(at (xyz 0 0 0))
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@ -1,4 +1,4 @@
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(module ST_WLCSP-100_Die446 (layer F.Cu) (tedit 5AE0CF08)
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(module ST_WLCSP-100_Die446 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-100, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf")
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(tags "BGA 100 0.4")
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(attr smd)
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||||
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@ -1,26 +1,26 @@
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(module ST_WLCSP-100_Die452 (layer F.Cu) (tedit 5AE0CF08)
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(descr "WLCSP-100, 10x10 raster, 4.166x4.628mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf")
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(module ST_WLCSP-100_Die452 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf")
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||||
(tags "BGA 100 0.4")
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||||
(attr smd)
|
||||
(fp_text reference REF** (at 0 -3.314) (layer F.SilkS)
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||||
(fp_text reference REF** (at 0 -3.3315) (layer F.SilkS)
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||||
(effects (font (size 1 1) (thickness 0.15)))
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||||
)
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||||
(fp_text value ST_WLCSP-100_Die452 (at 0 3.314) (layer F.Fab)
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||||
(fp_text value ST_WLCSP-100_Die452 (at 0 3.3315) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
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||||
)
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||||
(fp_line (start 2.083 2.314) (end -2.083 2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.083 2.314) (end -2.083 -1.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.083 -1.314) (end -1.083 -2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -1.083 -2.314) (end 2.083 -2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start 2.083 -2.314) (end 2.083 2.314) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -3.09 -3.32) (end -3.09 3.32) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start -3.09 3.32) (end 3.09 3.32) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start 3.09 3.32) (end 3.09 -3.32) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start 3.09 -3.32) (end -3.09 -3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -1.208 -2.439) (end 2.208 -2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.208 -2.439) (end 2.208 2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.208 2.439) (end -2.208 2.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start -2.208 2.439) (end -2.208 -1.439) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.1005 2.3315) (end -2.1005 2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.1005 2.3315) (end -2.1005 -1.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -2.1005 -1.3315) (end -1.1005 -2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -1.1005 -2.3315) (end 2.1005 -2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start 2.1005 -2.3315) (end 2.1005 2.3315) (layer F.Fab) (width 0.1))
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||||
(fp_line (start -3.11 -3.34) (end -3.11 3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start -3.11 3.34) (end 3.11 3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start 3.11 3.34) (end 3.11 -3.34) (layer F.CrtYd) (width 0.05))
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||||
(fp_line (start 3.11 -3.34) (end -3.11 -3.34) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -1.2255 -2.4565) (end 2.2255 -2.4565) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.2255 -2.4565) (end 2.2255 2.4565) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start 2.2255 2.4565) (end -2.2255 2.4565) (layer F.SilkS) (width 0.12))
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||||
(fp_line (start -2.2255 2.4565) (end -2.2255 -1.4565) (layer F.SilkS) (width 0.12))
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||||
(pad A1 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad A2 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad A3 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
@ -122,7 +122,7 @@
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||||
(pad K9 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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||||
(pad K10 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.97 0.97) (thickness 0.1455)))
|
||||
(effects (font (size 0.98 0.98) (thickness 0.147)))
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||||
)
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||||
(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-100_Die452.wrl
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(at (xyz 0 0 0))
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@ -1,26 +1,26 @@
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(module ST_WLCSP-100_Die461 (layer F.Cu) (tedit 5AE0CF08)
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(module ST_WLCSP-100_Die461 (layer F.Cu) (tedit 5AE11EAD)
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(descr "WLCSP-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf")
|
||||
(tags "BGA 100 0.4")
|
||||
(attr smd)
|
||||
(fp_text reference REF** (at 0 -3.314) (layer F.SilkS)
|
||||
(fp_text reference REF** (at 0 -3.071) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value ST_WLCSP-100_Die461 (at 0 3.314) (layer F.Fab)
|
||||
(fp_text value ST_WLCSP-100_Die461 (at 0 3.071) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start 2.083 2.314) (end -2.083 2.314) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.083 2.314) (end -2.083 -1.314) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.083 -1.314) (end -1.083 -2.314) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.083 -2.314) (end 2.083 -2.314) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 2.083 -2.314) (end 2.083 2.314) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -3.09 -3.32) (end -3.09 3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.09 3.32) (end 3.09 3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.09 3.32) (end 3.09 -3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.09 -3.32) (end -3.09 -3.32) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -1.208 -2.439) (end 2.208 -2.439) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.208 -2.439) (end 2.208 2.439) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.208 2.439) (end -2.208 2.439) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.208 2.439) (end -2.208 -1.439) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.309 2.071) (end -2.309 2.071) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.309 2.071) (end -2.309 -1.071) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.309 -1.071) (end -1.309 -2.071) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.309 -2.071) (end 2.309 -2.071) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 2.309 -2.071) (end 2.309 2.071) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -3.31 -3.08) (end -3.31 3.08) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.31 3.08) (end 3.31 3.08) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.31 3.08) (end 3.31 -3.08) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.31 -3.08) (end -3.31 -3.08) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -1.434 -2.196) (end 2.434 -2.196) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.434 -2.196) (end 2.434 2.196) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.434 2.196) (end -2.434 2.196) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.434 2.196) (end -2.434 -1.196) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A2 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A3 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
@ -122,7 +122,7 @@
|
||||
(pad K9 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K10 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.97 0.97) (thickness 0.1455)))
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-100_Die461.wrl
|
||||
(at (xyz 0 0 0))
|
||||
|
||||
@ -1,4 +1,4 @@
|
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(module ST_WLCSP-104_Die437 (layer F.Cu) (tedit 5AE0CF08)
|
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(module ST_WLCSP-104_Die437 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf")
|
||||
(tags "BGA 104 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
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(module ST_WLCSP-143_Die419 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-143_Die419 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf")
|
||||
(tags "BGA 143 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-143_Die449 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-143_Die449 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf")
|
||||
(tags "BGA 143 0.4")
|
||||
(attr smd)
|
||||
@ -22,291 +22,291 @@
|
||||
(fp_line (start 2.3945 3.0495) (end -2.3945 3.0495) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.3945 3.0495) (end -2.3945 -2.0495) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -1.6 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at -1.2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at -0.8 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at -0.4 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A6 smd circle (at 0 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A7 smd circle (at 0.4 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A8 smd circle (at 0.8 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A9 smd circle (at 1.2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A10 smd circle (at 1.6 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A11 smd circle (at 2 -2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -1.6 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at -1.2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at -0.8 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at -0.4 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B6 smd circle (at 0 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B7 smd circle (at 0.4 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B8 smd circle (at 0.8 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B9 smd circle (at 1.2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B10 smd circle (at 1.6 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B11 smd circle (at 2 -2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C6 smd circle (at 0 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C7 smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C8 smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C9 smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C10 smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C11 smd circle (at 2 -1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D6 smd circle (at 0 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D7 smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D8 smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D9 smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D10 smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D11 smd circle (at 2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E6 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E7 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E8 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E9 smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E10 smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E11 smd circle (at 2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F1 smd circle (at -2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F2 smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F3 smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F4 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F5 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F6 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F7 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F8 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F9 smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F10 smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F11 smd circle (at 2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G1 smd circle (at -2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G2 smd circle (at -1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G3 smd circle (at -1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G4 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G5 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G6 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G7 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G8 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G9 smd circle (at 1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G10 smd circle (at 1.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G11 smd circle (at 2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H1 smd circle (at -2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H2 smd circle (at -1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H3 smd circle (at -1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H4 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H5 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H6 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H7 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H8 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H9 smd circle (at 1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H10 smd circle (at 1.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H11 smd circle (at 2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J1 smd circle (at -2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J2 smd circle (at -1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J3 smd circle (at -1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J4 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J5 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J6 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J7 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J8 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J9 smd circle (at 1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J10 smd circle (at 1.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J11 smd circle (at 2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K1 smd circle (at -2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K2 smd circle (at -1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K3 smd circle (at -1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K4 smd circle (at -0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K5 smd circle (at -0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K6 smd circle (at 0 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K7 smd circle (at 0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K8 smd circle (at 0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K9 smd circle (at 1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K10 smd circle (at 1.6 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K11 smd circle (at 2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L1 smd circle (at -2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L2 smd circle (at -1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L3 smd circle (at -1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L4 smd circle (at -0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L5 smd circle (at -0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L6 smd circle (at 0 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L7 smd circle (at 0.4 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L8 smd circle (at 0.8 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L9 smd circle (at 1.2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L10 smd circle (at 1.6 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L11 smd circle (at 2 1.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M1 smd circle (at -2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M2 smd circle (at -1.6 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M3 smd circle (at -1.2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M4 smd circle (at -0.8 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M5 smd circle (at -0.4 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M6 smd circle (at 0 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M7 smd circle (at 0.4 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M8 smd circle (at 0.8 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M9 smd circle (at 1.2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M10 smd circle (at 1.6 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M11 smd circle (at 2 2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N1 smd circle (at -2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N2 smd circle (at -1.6 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N3 smd circle (at -1.2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N4 smd circle (at -0.8 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N5 smd circle (at -0.4 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N6 smd circle (at 0 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N7 smd circle (at 0.4 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N8 smd circle (at 0.8 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N9 smd circle (at 1.2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N10 smd circle (at 1.6 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N11 smd circle (at 2 2.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-144_Die470 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-144_Die470 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf")
|
||||
(tags "BGA 144 0.4")
|
||||
(attr smd)
|
||||
@ -22,293 +22,293 @@
|
||||
(fp_line (start 2.745 2.745) (end -2.745 2.745) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.745 2.745) (end -2.745 -1.745) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at -1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at -1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at -0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A6 smd circle (at -0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A7 smd circle (at 0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A8 smd circle (at 0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A9 smd circle (at 1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A10 smd circle (at 1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A11 smd circle (at 1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A12 smd circle (at 2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at -0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B6 smd circle (at -0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B7 smd circle (at 0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B8 smd circle (at 0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B9 smd circle (at 1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B10 smd circle (at 1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B11 smd circle (at 1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B12 smd circle (at 2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at -1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C6 smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C7 smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C8 smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C9 smd circle (at 1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C10 smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C11 smd circle (at 1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C12 smd circle (at 2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at -1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D6 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D7 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D8 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D9 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D10 smd circle (at 1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D11 smd circle (at 1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D12 smd circle (at 2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E6 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E7 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E8 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E9 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E10 smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E11 smd circle (at 1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E12 smd circle (at 2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F1 smd circle (at -2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F2 smd circle (at -1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F3 smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F4 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F5 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F6 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F7 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F8 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F9 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F10 smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F11 smd circle (at 1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F12 smd circle (at 2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G1 smd circle (at -2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G2 smd circle (at -1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G3 smd circle (at -1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G4 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G5 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G6 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G7 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G8 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G9 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G10 smd circle (at 1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G11 smd circle (at 1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G12 smd circle (at 2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H1 smd circle (at -2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H2 smd circle (at -1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H3 smd circle (at -1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H4 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H5 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H6 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H7 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H8 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H9 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H10 smd circle (at 1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H11 smd circle (at 1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H12 smd circle (at 2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J1 smd circle (at -2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J2 smd circle (at -1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J3 smd circle (at -1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J4 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J5 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J6 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J7 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J8 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J9 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J10 smd circle (at 1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J11 smd circle (at 1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J12 smd circle (at 2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K1 smd circle (at -2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K2 smd circle (at -1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K3 smd circle (at -1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K4 smd circle (at -1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K5 smd circle (at -0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K6 smd circle (at -0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K7 smd circle (at 0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K8 smd circle (at 0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K9 smd circle (at 1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K10 smd circle (at 1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K11 smd circle (at 1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K12 smd circle (at 2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L1 smd circle (at -2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L2 smd circle (at -1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L3 smd circle (at -1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L4 smd circle (at -1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L5 smd circle (at -0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L6 smd circle (at -0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L7 smd circle (at 0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L8 smd circle (at 0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L9 smd circle (at 1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L10 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L11 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L12 smd circle (at 2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M1 smd circle (at -2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M2 smd circle (at -1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M3 smd circle (at -1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M4 smd circle (at -1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M5 smd circle (at -0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M6 smd circle (at -0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M7 smd circle (at 0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M8 smd circle (at 0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M9 smd circle (at 1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M10 smd circle (at 1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M11 smd circle (at 1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M12 smd circle (at 2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-168_Die434 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-168_Die434 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf")
|
||||
(tags "BGA 168 0.4")
|
||||
(attr smd)
|
||||
@ -21,342 +21,174 @@
|
||||
(fp_line (start 2.5705 -2.971) (end 2.5705 2.971) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 2.5705 2.971) (end -2.5705 2.971) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.5705 2.971) (end -2.5705 -1.971) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -2.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A2 smd circle (at -1.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A3 smd circle (at -1.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A4 smd circle (at -1 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A5 smd circle (at -0.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A6 smd circle (at -0.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A7 smd circle (at 0.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A8 smd circle (at 0.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A9 smd circle (at 1 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A10 smd circle (at 1.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A11 smd circle (at 1.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A12 smd circle (at 2.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B1 smd circle (at -2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B2 smd circle (at -1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B3 smd circle (at -1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B4 smd circle (at -1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B5 smd circle (at -0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B6 smd circle (at -0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B7 smd circle (at 0.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B8 smd circle (at 0.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B9 smd circle (at 1 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B10 smd circle (at 1.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B11 smd circle (at 1.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad B12 smd circle (at 2.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C1 smd circle (at -2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C2 smd circle (at -1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C3 smd circle (at -1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C4 smd circle (at -1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C5 smd circle (at -0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C6 smd circle (at -0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C7 smd circle (at 0.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C8 smd circle (at 0.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C9 smd circle (at 1 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C10 smd circle (at 1.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C11 smd circle (at 1.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad C12 smd circle (at 2.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D1 smd circle (at -2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D2 smd circle (at -1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D3 smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D4 smd circle (at -1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D5 smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D6 smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D7 smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D8 smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D9 smd circle (at 1 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D10 smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D11 smd circle (at 1.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad D12 smd circle (at 2.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E1 smd circle (at -2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E2 smd circle (at -1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E3 smd circle (at -1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E4 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E5 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E6 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E7 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E8 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E9 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E10 smd circle (at 1.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E11 smd circle (at 1.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad E12 smd circle (at 2.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F1 smd circle (at -2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F2 smd circle (at -1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F3 smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F4 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F5 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F6 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F7 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F8 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F9 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F10 smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F11 smd circle (at 1.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad F12 smd circle (at 2.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G1 smd circle (at -2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G2 smd circle (at -1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G3 smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G4 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G5 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G6 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G7 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G8 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G9 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G10 smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G11 smd circle (at 1.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad G12 smd circle (at 2.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H1 smd circle (at -2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H2 smd circle (at -1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H3 smd circle (at -1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H4 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H5 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H6 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H7 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H8 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H9 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H10 smd circle (at 1.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H11 smd circle (at 1.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad H12 smd circle (at 2.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J1 smd circle (at -2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J2 smd circle (at -1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J3 smd circle (at -1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J4 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J5 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J6 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J7 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J8 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J9 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J10 smd circle (at 1.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J11 smd circle (at 1.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad J12 smd circle (at 2.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K1 smd circle (at -2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K2 smd circle (at -1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K3 smd circle (at -1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K4 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K5 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K6 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K7 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K8 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K9 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K10 smd circle (at 1.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K11 smd circle (at 1.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad K12 smd circle (at 2.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L1 smd circle (at -2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L2 smd circle (at -1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L3 smd circle (at -1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L4 smd circle (at -1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L5 smd circle (at -0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L6 smd circle (at -0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L7 smd circle (at 0.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L8 smd circle (at 0.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L9 smd circle (at 1 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L10 smd circle (at 1.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L11 smd circle (at 1.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad L12 smd circle (at 2.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M1 smd circle (at -2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M2 smd circle (at -1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M3 smd circle (at -1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M4 smd circle (at -1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M5 smd circle (at -0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M6 smd circle (at -0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M7 smd circle (at 0.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M8 smd circle (at 0.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M9 smd circle (at 1 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M10 smd circle (at 1.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M11 smd circle (at 1.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad M12 smd circle (at 2.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N1 smd circle (at -2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N2 smd circle (at -1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N3 smd circle (at -1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N4 smd circle (at -1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N5 smd circle (at -0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N6 smd circle (at -0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N7 smd circle (at 0.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N8 smd circle (at 0.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N9 smd circle (at 1 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N10 smd circle (at 1.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N11 smd circle (at 1.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad N12 smd circle (at 2.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P1 smd circle (at -2.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P2 smd circle (at -1.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P3 smd circle (at -1.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P4 smd circle (at -1 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P5 smd circle (at -0.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P6 smd circle (at -0.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P7 smd circle (at 0.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P8 smd circle (at 0.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P9 smd circle (at 1 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P10 smd circle (at 1.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P11 smd circle (at 1.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad P12 smd circle (at 2.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(pad A1 smd circle (at -2.2 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A2 smd circle (at -1.8 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A3 smd circle (at -1.4 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A4 smd circle (at -1 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A5 smd circle (at -0.6 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A6 smd circle (at -0.2 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A7 smd circle (at 0.2 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A8 smd circle (at 0.6 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A9 smd circle (at 1 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A10 smd circle (at 1.4 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A11 smd circle (at 1.8 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A12 smd circle (at 2.2 -2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B1 smd circle (at -2.2 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B2 smd circle (at -1.8 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B3 smd circle (at -1.4 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B4 smd circle (at -1 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B5 smd circle (at -0.6 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B6 smd circle (at -0.2 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B7 smd circle (at 0.2 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B8 smd circle (at 0.6 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B9 smd circle (at 1 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B10 smd circle (at 1.4 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B11 smd circle (at 1.8 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad B12 smd circle (at 2.2 -2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C1 smd circle (at -2.2 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C2 smd circle (at -1.8 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C3 smd circle (at -1.4 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C4 smd circle (at -1 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C5 smd circle (at -0.6 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C6 smd circle (at -0.2 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C7 smd circle (at 0.2 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C8 smd circle (at 0.6 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C9 smd circle (at 1 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C10 smd circle (at 1.4 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C11 smd circle (at 1.8 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad C12 smd circle (at 2.2 -1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D1 smd circle (at -2.2 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D2 smd circle (at -1.8 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D3 smd circle (at -1.4 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D4 smd circle (at -1 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D5 smd circle (at -0.6 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D6 smd circle (at -0.2 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D7 smd circle (at 0.2 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D8 smd circle (at 0.6 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D9 smd circle (at 1 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D10 smd circle (at 1.4 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D11 smd circle (at 1.8 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad D12 smd circle (at 2.2 -1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E1 smd circle (at -2.2 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E2 smd circle (at -1.8 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E3 smd circle (at -1.4 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E4 smd circle (at -1 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E5 smd circle (at -0.6 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E6 smd circle (at -0.2 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E7 smd circle (at 0.2 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E8 smd circle (at 0.6 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E9 smd circle (at 1 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E10 smd circle (at 1.4 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E11 smd circle (at 1.8 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad E12 smd circle (at 2.2 -1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F1 smd circle (at -2.2 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F2 smd circle (at -1.8 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F3 smd circle (at -1.4 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F4 smd circle (at -1 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F5 smd circle (at -0.6 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F6 smd circle (at -0.2 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F7 smd circle (at 0.2 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F8 smd circle (at 0.6 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F9 smd circle (at 1 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F10 smd circle (at 1.4 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F11 smd circle (at 1.8 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad F12 smd circle (at 2.2 -0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G1 smd circle (at -2.2 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G2 smd circle (at -1.8 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G3 smd circle (at -1.4 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G4 smd circle (at -1 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G5 smd circle (at -0.6 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G6 smd circle (at -0.2 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G7 smd circle (at 0.2 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G8 smd circle (at 0.6 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G9 smd circle (at 1 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G10 smd circle (at 1.4 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G11 smd circle (at 1.8 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G12 smd circle (at 2.2 -0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H1 smd circle (at -2.2 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H2 smd circle (at -1.8 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H3 smd circle (at -1.4 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H4 smd circle (at -1 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H5 smd circle (at -0.6 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H6 smd circle (at -0.2 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H7 smd circle (at 0.2 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H8 smd circle (at 0.6 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H9 smd circle (at 1 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H10 smd circle (at 1.4 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H11 smd circle (at 1.8 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad H12 smd circle (at 2.2 0.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J1 smd circle (at -2.2 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J2 smd circle (at -1.8 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J3 smd circle (at -1.4 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J4 smd circle (at -1 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J5 smd circle (at -0.6 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J6 smd circle (at -0.2 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J7 smd circle (at 0.2 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J8 smd circle (at 0.6 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J9 smd circle (at 1 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J10 smd circle (at 1.4 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J11 smd circle (at 1.8 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad J12 smd circle (at 2.2 0.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K1 smd circle (at -2.2 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K2 smd circle (at -1.8 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K3 smd circle (at -1.4 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K4 smd circle (at -1 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K5 smd circle (at -0.6 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K6 smd circle (at -0.2 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K7 smd circle (at 0.2 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K8 smd circle (at 0.6 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K9 smd circle (at 1 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K10 smd circle (at 1.4 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K11 smd circle (at 1.8 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad K12 smd circle (at 2.2 1) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L1 smd circle (at -2.2 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L2 smd circle (at -1.8 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L3 smd circle (at -1.4 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L4 smd circle (at -1 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L5 smd circle (at -0.6 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L6 smd circle (at -0.2 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L7 smd circle (at 0.2 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L8 smd circle (at 0.6 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L9 smd circle (at 1 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L10 smd circle (at 1.4 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L11 smd circle (at 1.8 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad L12 smd circle (at 2.2 1.4) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M1 smd circle (at -2.2 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M2 smd circle (at -1.8 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M3 smd circle (at -1.4 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M4 smd circle (at -1 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M5 smd circle (at -0.6 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M6 smd circle (at -0.2 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M7 smd circle (at 0.2 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M8 smd circle (at 0.6 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M9 smd circle (at 1 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M10 smd circle (at 1.4 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M11 smd circle (at 1.8 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad M12 smd circle (at 2.2 1.8) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N1 smd circle (at -2.2 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N2 smd circle (at -1.8 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N3 smd circle (at -1.4 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N4 smd circle (at -1 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N5 smd circle (at -0.6 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N6 smd circle (at -0.2 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N7 smd circle (at 0.2 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N8 smd circle (at 0.6 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N9 smd circle (at 1 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N10 smd circle (at 1.4 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N11 smd circle (at 1.8 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad N12 smd circle (at 2.2 2.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P1 smd circle (at -2.2 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P2 smd circle (at -1.8 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P3 smd circle (at -1.4 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P4 smd circle (at -1 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P5 smd circle (at -0.6 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P6 smd circle (at -0.2 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P7 smd circle (at 0.2 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P8 smd circle (at 0.6 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P9 smd circle (at 1 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P10 smd circle (at 1.4 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P11 smd circle (at 1.8 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad P12 smd circle (at 2.2 2.6) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-180_Die451 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-180_Die451 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf")
|
||||
(tags "BGA 180 0.4")
|
||||
(attr smd)
|
||||
@ -22,365 +22,365 @@
|
||||
(fp_line (start 2.8935 3.1725) (end -2.8935 3.1725) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.8935 3.1725) (end -2.8935 -2.1725) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at -1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at -1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at -0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A6 smd circle (at -0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A7 smd circle (at 0 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A8 smd circle (at 0.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A9 smd circle (at 0.8 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A10 smd circle (at 1.2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A11 smd circle (at 1.6 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A12 smd circle (at 2 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A13 smd circle (at 2.4 -2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at -1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at -1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at -0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B6 smd circle (at -0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B7 smd circle (at 0 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B8 smd circle (at 0.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B9 smd circle (at 0.8 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B10 smd circle (at 1.2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B11 smd circle (at 1.6 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B12 smd circle (at 2 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B13 smd circle (at 2.4 -2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at -1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at -1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at -0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C6 smd circle (at -0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C7 smd circle (at 0 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C8 smd circle (at 0.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C9 smd circle (at 0.8 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C10 smd circle (at 1.2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C11 smd circle (at 1.6 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C12 smd circle (at 2 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C13 smd circle (at 2.4 -1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at -1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at -1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at -0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D6 smd circle (at -0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D7 smd circle (at 0 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D8 smd circle (at 0.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D9 smd circle (at 0.8 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D10 smd circle (at 1.2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D11 smd circle (at 1.6 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D12 smd circle (at 2 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D13 smd circle (at 2.4 -1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at -1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at -1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at -0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E6 smd circle (at -0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E7 smd circle (at 0 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E8 smd circle (at 0.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E9 smd circle (at 0.8 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E10 smd circle (at 1.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E11 smd circle (at 1.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E12 smd circle (at 2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E13 smd circle (at 2.4 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F1 smd circle (at -2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F2 smd circle (at -2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F3 smd circle (at -1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F4 smd circle (at -1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F5 smd circle (at -0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F6 smd circle (at -0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F7 smd circle (at 0 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F8 smd circle (at 0.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F9 smd circle (at 0.8 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F10 smd circle (at 1.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F11 smd circle (at 1.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F12 smd circle (at 2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F13 smd circle (at 2.4 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G1 smd circle (at -2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G2 smd circle (at -2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G3 smd circle (at -1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G4 smd circle (at -1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G5 smd circle (at -0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G6 smd circle (at -0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G8 smd circle (at 0.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G9 smd circle (at 0.8 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G10 smd circle (at 1.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G11 smd circle (at 1.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G12 smd circle (at 2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G13 smd circle (at 2.4 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H1 smd circle (at -2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H2 smd circle (at -2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H3 smd circle (at -1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H4 smd circle (at -1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H5 smd circle (at -0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H6 smd circle (at -0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H8 smd circle (at 0.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H9 smd circle (at 0.8 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H10 smd circle (at 1.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H11 smd circle (at 1.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H12 smd circle (at 2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad H13 smd circle (at 2.4 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J1 smd circle (at -2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J2 smd circle (at -2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J3 smd circle (at -1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J4 smd circle (at -1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J5 smd circle (at -0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J6 smd circle (at -0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J7 smd circle (at 0 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J8 smd circle (at 0.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J9 smd circle (at 0.8 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J10 smd circle (at 1.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J11 smd circle (at 1.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J12 smd circle (at 2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad J13 smd circle (at 2.4 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K1 smd circle (at -2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K2 smd circle (at -2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K3 smd circle (at -1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K4 smd circle (at -1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K5 smd circle (at -0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K6 smd circle (at -0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K7 smd circle (at 0 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K8 smd circle (at 0.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K9 smd circle (at 0.8 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K10 smd circle (at 1.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K11 smd circle (at 1.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K12 smd circle (at 2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad K13 smd circle (at 2.4 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L1 smd circle (at -2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L2 smd circle (at -2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L3 smd circle (at -1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L4 smd circle (at -1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L5 smd circle (at -0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L6 smd circle (at -0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L7 smd circle (at 0 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L8 smd circle (at 0.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L9 smd circle (at 0.8 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L10 smd circle (at 1.2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L11 smd circle (at 1.6 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L12 smd circle (at 2 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad L13 smd circle (at 2.4 1.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M1 smd circle (at -2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M2 smd circle (at -2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M3 smd circle (at -1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M4 smd circle (at -1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M5 smd circle (at -0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M6 smd circle (at -0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M7 smd circle (at 0 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M8 smd circle (at 0.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M9 smd circle (at 0.8 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M10 smd circle (at 1.2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M11 smd circle (at 1.6 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M12 smd circle (at 2 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad M13 smd circle (at 2.4 1.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N1 smd circle (at -2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N2 smd circle (at -2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N3 smd circle (at -1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N4 smd circle (at -1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N5 smd circle (at -0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N6 smd circle (at -0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N7 smd circle (at 0 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N8 smd circle (at 0.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N9 smd circle (at 0.8 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N10 smd circle (at 1.2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N11 smd circle (at 1.6 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N12 smd circle (at 2 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad N13 smd circle (at 2.4 2.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P1 smd circle (at -2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P2 smd circle (at -2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P3 smd circle (at -1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P4 smd circle (at -1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P5 smd circle (at -0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P6 smd circle (at -0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P7 smd circle (at 0 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P8 smd circle (at 0.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P9 smd circle (at 0.8 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P10 smd circle (at 1.2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P11 smd circle (at 1.6 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P12 smd circle (at 2 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad P13 smd circle (at 2.4 2.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-25_Die425 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-25_Die425 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf")
|
||||
(tags "BGA 25 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-25_Die444 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-25_Die444 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf")
|
||||
(tags "BGA 25 0.4")
|
||||
(attr smd)
|
||||
@ -22,55 +22,55 @@
|
||||
(fp_line (start 1.3365 1.2875) (end -1.3365 1.2875) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.3365 1.2875) (end -1.3365 -0.70625) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.56 0.56) (thickness 0.084)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-25_Die457 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-25_Die457 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf")
|
||||
(tags "BGA 25 0.4")
|
||||
(attr smd)
|
||||
@ -22,55 +22,55 @@
|
||||
(fp_line (start 1.1915 1.16) (end -1.1915 1.16) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.1915 1.16) (end -1.1915 -0.6425) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.5 0.5) (thickness 0.075)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-36_Die417 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-36_Die417 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf")
|
||||
(tags "BGA 36 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-36_Die440 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-36_Die440 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf")
|
||||
(tags "BGA 36 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-36_Die445 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-36_Die445 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf")
|
||||
(tags "BGA 36 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-36_Die458 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-36_Die458 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf")
|
||||
(tags "BGA 36 0.4")
|
||||
(attr smd)
|
||||
@ -22,77 +22,77 @@
|
||||
(fp_line (start 1.4015 1.4145) (end -1.4015 1.4145) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.4015 1.4145) (end -1.4015 -0.77625) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at -0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at 0.2 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at 0.6 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A6 smd circle (at 1 -1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B6 smd circle (at 1 -0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C6 smd circle (at 1 -0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at -0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at 0.2 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at 0.6 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D6 smd circle (at 1 0.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at -0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at 0.2 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at 0.6 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E6 smd circle (at 1 0.6) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F1 smd circle (at -1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F2 smd circle (at -0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F3 smd circle (at -0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F4 smd circle (at 0.2 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F5 smd circle (at 0.6 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F6 smd circle (at 1 1) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.59 0.59) (thickness 0.0885)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die423 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die423 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die431 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die431 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,26 +1,26 @@
|
||||
(module ST_WLCSP-49_Die433 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.06x3.06mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf")
|
||||
(module ST_WLCSP-49_Die433 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
(fp_text reference REF** (at 0 -2.53) (layer F.SilkS)
|
||||
(fp_text reference REF** (at 0 -2.5145) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value ST_WLCSP-49_Die433 (at 0 2.53) (layer F.Fab)
|
||||
(fp_text value ST_WLCSP-49_Die433 (at 0 2.5145) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start 1.53 1.53) (end -1.53 1.53) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.53 1.53) (end -1.53 -0.765) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.53 -0.765) (end -0.765 -1.53) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -0.765 -1.53) (end 1.53 -1.53) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 1.53 -1.53) (end 1.53 1.53) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.54 -2.54) (end -2.54 2.54) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -2.54 2.54) (end 2.54 2.54) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 2.54 2.54) (end 2.54 -2.54) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 2.54 -2.54) (end -2.54 -2.54) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -0.89 -1.655) (end 1.655 -1.655) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 1.655 -1.655) (end 1.655 1.655) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 1.655 1.655) (end -1.655 1.655) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.655 1.655) (end -1.655 -0.89) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 1.5145 1.5145) (end -1.5145 1.5145) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.5145 1.5145) (end -1.5145 -0.75725) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -1.5145 -0.75725) (end -0.75725 -1.5145) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -0.75725 -1.5145) (end 1.5145 -1.5145) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 1.5145 -1.5145) (end 1.5145 1.5145) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -2.52 -2.52) (end -2.52 2.52) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -2.52 2.52) (end 2.52 2.52) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 2.52 2.52) (end 2.52 -2.52) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 2.52 -2.52) (end -2.52 -2.52) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -0.88225 -1.6395) (end 1.6395 -1.6395) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 1.6395 -1.6395) (end 1.6395 1.6395) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start 1.6395 1.6395) (end -1.6395 1.6395) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.6395 1.6395) (end -1.6395 -0.88225) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -1.2 -1.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A2 smd circle (at -0.8 -1.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad A3 smd circle (at -0.4 -1.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
@ -71,7 +71,7 @@
|
||||
(pad G6 smd circle (at 0.8 1.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(pad G7 smd circle (at 1.2 1.2) (size 0.22 0.22) (layers F.Cu F.Mask F.Paste))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.71 0.71) (thickness 0.1065)))
|
||||
(effects (font (size 0.7 0.7) (thickness 0.105)))
|
||||
)
|
||||
(model ${KISYS3DMOD}/Package_CSP.3dshapes/ST_WLCSP-49_Die433.wrl
|
||||
(at (xyz 0 0 0))
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die435 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die435 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
@ -22,103 +22,103 @@
|
||||
(fp_line (start 1.6955 1.6885) (end -1.6955 1.6885) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -1.6955 1.6885) (end -1.6955 -0.90675) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A2 smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A3 smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A4 smd circle (at 0 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A5 smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A6 smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad A7 smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B1 smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B2 smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B3 smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B4 smd circle (at 0 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B5 smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B6 smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad B7 smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C1 smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C2 smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C3 smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C4 smd circle (at 0 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C5 smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C6 smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad C7 smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D1 smd circle (at -1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D2 smd circle (at -0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D3 smd circle (at -0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D4 smd circle (at 0 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D5 smd circle (at 0.4 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D6 smd circle (at 0.8 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad D7 smd circle (at 1.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E1 smd circle (at -1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E2 smd circle (at -0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E3 smd circle (at -0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E4 smd circle (at 0 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E5 smd circle (at 0.4 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E6 smd circle (at 0.8 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad E7 smd circle (at 1.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F1 smd circle (at -1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F2 smd circle (at -0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F3 smd circle (at -0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F4 smd circle (at 0 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F5 smd circle (at 0.4 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F6 smd circle (at 0.8 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad F7 smd circle (at 1.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G1 smd circle (at -1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G2 smd circle (at -0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G3 smd circle (at -0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G4 smd circle (at 0 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G5 smd circle (at 0.4 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G6 smd circle (at 0.8 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(pad G7 smd circle (at 1.2 1.2) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0555))
|
||||
(solder_paste_margin_ratio 0.055556))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.73 0.73) (thickness 0.1095)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die438 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die438 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf")
|
||||
(tags "BGA 49 0.5")
|
||||
(attr smd)
|
||||
@ -22,103 +22,103 @@
|
||||
(fp_line (start 2.07 1.995) (end -2.07 1.995) (layer F.SilkS) (width 0.12))
|
||||
(fp_line (start -2.07 1.995) (end -2.07 -1.06) (layer F.SilkS) (width 0.12))
|
||||
(pad A1 smd circle (at -1.5 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A2 smd circle (at -1 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A3 smd circle (at -0.5 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A4 smd circle (at 0 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A5 smd circle (at 0.5 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A6 smd circle (at 1 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad A7 smd circle (at 1.5 -1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B1 smd circle (at -1.5 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B2 smd circle (at -1 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B3 smd circle (at -0.5 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B4 smd circle (at 0 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B5 smd circle (at 0.5 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B6 smd circle (at 1 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad B7 smd circle (at 1.5 -1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C1 smd circle (at -1.5 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C2 smd circle (at -1 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C3 smd circle (at -0.5 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C4 smd circle (at 0 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C5 smd circle (at 0.5 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C6 smd circle (at 1 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad C7 smd circle (at 1.5 -0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D1 smd circle (at -1.5 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D2 smd circle (at -1 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D3 smd circle (at -0.5 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D4 smd circle (at 0 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D5 smd circle (at 0.5 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D6 smd circle (at 1 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad D7 smd circle (at 1.5 0) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E1 smd circle (at -1.5 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E2 smd circle (at -1 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E3 smd circle (at -0.5 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E4 smd circle (at 0 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E5 smd circle (at 0.5 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E6 smd circle (at 1 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad E7 smd circle (at 1.5 0.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F1 smd circle (at -1.5 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F2 smd circle (at -1 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F3 smd circle (at -0.5 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F4 smd circle (at 0 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F5 smd circle (at 0.5 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F6 smd circle (at 1 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad F7 smd circle (at 1.5 1) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G1 smd circle (at -1.5 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G2 smd circle (at -1 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G3 smd circle (at -0.5 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G4 smd circle (at 0 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G5 smd circle (at 0.5 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G6 smd circle (at 1 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(pad G7 smd circle (at 1.5 1.5) (size 0.29 0.29) (layers F.Cu F.Mask F.Paste)
|
||||
(solder_paste_margin_ratio 0.0345))
|
||||
(solder_paste_margin_ratio 0.034483))
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.9 0.9) (thickness 0.135)))
|
||||
)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die439 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die439 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die447 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die447 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
|
||||
@ -1,4 +1,4 @@
|
||||
(module ST_WLCSP-49_Die448 (layer F.Cu) (tedit 5AE0CF08)
|
||||
(module ST_WLCSP-49_Die448 (layer F.Cu) (tedit 5AE11EAD)
|
||||
(descr "WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf")
|
||||
(tags "BGA 49 0.4")
|
||||
(attr smd)
|
||||
|
||||
Some files were not shown because too many files have changed in this diff Show More
Loading…
Reference in New Issue
Block a user