7
mirror of https://gitlab.com/kicad/libraries/kicad-footprints.git synced 2025-04-23 22:13:24 +00:00

add vias and extend the surface of pin 5-7

This commit is contained in:
Hartmann Herzfeld 2024-10-28 00:42:14 +01:00
parent 0592f4c331
commit 897992c71d

View File

@ -480,6 +480,33 @@
)
(uuid "025abf3e-c2bc-4b3d-9874-055ce6ec8f14")
)
(pad "2" thru_hole circle
(at -1.65 0.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "51661a2f-dbe5-46fa-91f3-e98346afaa7f")
)
(pad "2" thru_hole circle
(at -1.65 0.665)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "aa02eb46-d63f-4f62-b7a2-3f0f98ab5e34")
)
(pad "2" thru_hole circle
(at -1.65 1.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "6fcff309-c869-4adc-b2ae-6dca54de5213")
)
(pad "2" smd roundrect
(at -1.2 0.675)
(size 1.6 2.3)
@ -489,6 +516,60 @@
(zone_connect 2)
(uuid "eecca51c-a44e-44cd-9897-01111a4bbd59")
)
(pad "2" thru_hole circle
(at -0.65 0.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "8f718a1b-c113-47b6-8c25-103f272cf71a")
)
(pad "2" thru_hole circle
(at -0.65 0.665)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "5c3aa734-10e9-448e-9633-e2a904ae4413")
)
(pad "2" thru_hole circle
(at -0.65 1.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "f42632d9-31d9-4f76-9119-ad746e8aec34")
)
(pad "3" thru_hole circle
(at 0.65 0.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "05772465-ce94-4ad9-89be-4c7de5742458")
)
(pad "3" thru_hole circle
(at 0.65 0.665)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "f53c2099-55ba-403f-8f4a-d2df5329ee32")
)
(pad "3" thru_hole circle
(at 0.65 1.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "8abb8bca-e76f-4993-b937-717ab155b161")
)
(pad "3" smd roundrect
(at 1.2 0.675)
(size 1.6 2.3)
@ -498,6 +579,33 @@
(zone_connect 2)
(uuid "af9b6cb9-0f5d-4d00-b9a9-187e0d60318e")
)
(pad "3" thru_hole circle
(at 1.65 0.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "23c6aaa9-f317-4ee3-945c-d3745b46f482")
)
(pad "3" thru_hole circle
(at 1.65 0.665)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "b3832a56-54c1-4039-b8f3-f2564f6340a8")
)
(pad "3" thru_hole circle
(at 1.65 1.165)
(size 0.3 0.3)
(drill 0.2)
(property pad_prop_heatsink)
(layers "*.Cu")
(remove_unused_layers no)
(uuid "058b996d-619a-4423-95ae-b6fdda4fc470")
)
(pad "4" smd custom
(at 1.25 -1.3 180)
(size 0.6 0.22)
@ -526,8 +634,6 @@
(property pad_prop_fiducial_loc)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.25)
(solder_mask_margin -0.02)
(solder_paste_margin -0.02)
(thermal_bridge_angle 45)
(uuid "7d11116b-2ccc-428a-aea6-6fab32bb18d5")
)
@ -536,8 +642,6 @@
(size 0.6 0.22)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.25)
(solder_mask_margin -0.02)
(solder_paste_margin -0.02)
(thermal_bridge_angle 45)
(uuid "06c45ba2-43a9-412e-9188-73f6c73011a2")
)
@ -547,8 +651,6 @@
(property pad_prop_fiducial_loc)
(layers "F.Cu" "F.Paste" "F.Mask")
(roundrect_rratio 0.25)
(solder_mask_margin -0.02)
(solder_paste_margin -0.02)
(thermal_bridge_angle 45)
(uuid "dc5e8f0f-bf7b-4b5d-901d-ddf0a5a169fb")
)