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Add Molex 105450-0101 USB 3.1/3.2/4.0 Type-C receptacle

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Thanks to Timofey Negrebetsky for drafting this footprint
Thanks to aris-kimi for bringing it to a mergeable state
And also thanks to karolmika for previous contributions on the same part
This commit is contained in:
Timofey Negrebetsky 2022-11-23 22:14:38 +00:00 committed by kliment
parent a078cde2b8
commit 912dac3642
1 changed files with 84 additions and 0 deletions

84
Connector_USB.pretty/USB_C_Receptacle_Molex_105450-0101.kicad_mod Normal file
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(footprint "USB_C_Receptacle_Molex_105450-0101" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf)")
(tags "USB C Type-C USB3 receptacle SMD")
(attr smd)
(fp_text reference "REF**" (at 0 -5.315 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 7bd6a5a6-975a-47f2-9ae0-724cced216ae)
)
(fp_text value "USB_C_Receptacle_Molex_105450-0101" (at 0 5.935 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 4362d6f1-39b0-4140-a0c9-e1c7e29f1387)
)
(fp_text user "PCB Edge" (at 0 3.875 unlocked) (layer "Dwgs.User")
(effects (font (size 0.5 0.5) (thickness 0.125)))
(tstamp 507638d4-7fb3-4ed3-964f-9e3bb837b211)
)
(fp_text user "${REFERENCE}" (at 0 1.51 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 1c6434d3-2eb4-45c4-919b-76bc5df93b2a)
)
(fp_line (start 4.75 1.125) (end 4.75 -1.6) (layer "F.SilkS") (width 0.12) (tstamp 89460726-8ec5-4f46-968d-a3160f4c5f93))
(fp_line (start -4.75 -1.625) (end -4.75 1.075) (layer "F.SilkS") (width 0.12) (tstamp 8e0100ab-5bec-42c9-88a7-058bf79e923b))
(fp_line (start -3.125 -4.275) (end -2.9 -4.275) (layer "F.SilkS") (width 0.12) (tstamp 8fef5ecc-754d-49b5-85a6-8459cd49e0b4))
(fp_line (start -4.75 4.235) (end -4.75 4.025) (layer "F.SilkS") (width 0.12) (tstamp a6599f2c-a813-4ec4-889a-a3c42b3d9024))
(fp_line (start -4.75 -4.125) (end 4.75 -4.125) (layer "F.SilkS") (width 0.12) (tstamp bb7e1885-8c5b-40e4-a514-27aa758ecfd2))
(fp_line (start 4.75 4.225) (end 4.75 4) (layer "F.SilkS") (width 0.12) (tstamp d11572a2-0ec3-435f-b83d-bf2571d2a572))
(fp_line (start -4 4.325) (end 4 4.325) (layer "Dwgs.User") (width 0.1) (tstamp 17c369cf-c27d-429e-9fd7-b60e8872935e))
(fp_rect (start -5.3 -4.46) (end 5.3 5) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 33e0e933-7271-4fd2-9fbb-71fc2a2a02fd))
(fp_line (start -4.6 4.505) (end 4.6 4.505) (layer "F.Fab") (width 0.1) (tstamp 6e2190a8-0a8f-4569-8c96-006456c6e6b2))
(fp_line (start 4.6 4.505) (end 4.6 -3.965) (layer "F.Fab") (width 0.1) (tstamp 6e358669-3de0-4722-aa93-76f2cbf033ca))
(fp_line (start -3 -3.775) (end -2.85 -3.95) (layer "F.Fab") (width 0.1) (tstamp a56f16a2-807f-444a-a200-24803eba09c4))
(fp_line (start -4.6 -3.965) (end 4.6 -3.965) (layer "F.Fab") (width 0.1) (tstamp f150533b-1259-41c5-ad28-2c6245d0e07a))
(fp_line (start -3.175 -3.95) (end -3 -3.775) (layer "F.Fab") (width 0.1) (tstamp f9ed4703-8b54-485d-92eb-cb84b60e1ee5))
(fp_line (start -4.6 -3.965) (end -4.6 4.505) (layer "F.Fab") (width 0.1) (tstamp fa287af3-8143-4b7d-ba6a-f713228393e0))
(pad "A1" smd rect (at -3 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 42770697-efd8-47a4-998a-d1be32b61634))
(pad "A2" smd rect (at -2.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 732f4616-9686-45b7-995e-72519f23bdcd))
(pad "A3" smd rect (at -2 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 95b30749-aec6-48f0-8358-fd329add7197))
(pad "A4" smd rect (at -1.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3c27dc86-1701-4cfb-9ebf-f044da440656))
(pad "A5" smd rect (at -1 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3a86913b-d325-469d-99bf-10362833b6d6))
(pad "A6" smd rect (at -0.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 30aad354-f659-4962-8ba3-32f351d490c0))
(pad "A7" smd rect (at 0.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp db00ed9d-5cbd-42e1-a367-f32e41a8348a))
(pad "A8" smd rect (at 1 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 02eeeaf0-02f1-49a3-b288-95e452374a4f))
(pad "A9" smd rect (at 1.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 206bfdd0-417d-49a5-beaa-7015cee73d7c))
(pad "A10" smd rect (at 2 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c54946dc-b56a-4075-a391-5835ff06fc87))
(pad "A11" smd rect (at 2.5 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c41543a3-3bad-4682-9e5f-797025664df0))
(pad "A12" smd rect (at 3 -3.215) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 57e60628-6d13-49e5-8e0f-1cf31bada668))
(pad "B1" smd rect (at 3.1 -1.915) (size 1 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4b680c6f-6bf5-42bc-954e-399a8095278c))
(pad "B2" smd rect (at 2.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 22ce5f01-00e9-4ddd-a65e-815d60dce969))
(pad "B3" smd rect (at 1.75 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4e171e27-0952-4a5f-bd26-afc8662a6d9a))
(pad "B4" smd rect (at 1.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a5efeb95-9dc3-486a-bcda-cc7446645e28))
(pad "B5" smd rect (at 0.75 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0b3d4208-4257-4a45-bf45-0ac0b66edc08))
(pad "B6" smd rect (at 0.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 09f6b727-b73b-4591-a484-7c0de0a910bf))
(pad "B7" smd rect (at -0.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp bbe6d1fa-41f5-4203-bfc1-ec3317627975))
(pad "B8" smd rect (at -0.75 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b84e5c3c-d5ba-45dc-a996-457d3d15ea34))
(pad "B9" smd rect (at -1.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 08402209-d3fd-42d4-8065-6a77e812c43c))
(pad "B10" smd rect (at -1.75 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ec3b3a1b-bc30-4c1b-a40c-639e4fb72f82))
(pad "B11" smd rect (at -2.25 -1.915) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2449ad7e-7c10-430f-8adf-47601bb4af79))
(pad "B12" smd rect (at -3.1 -1.915) (size 1 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3c2b8904-a734-4a85-a82f-6473c641e8e2))
(pad "S1" thru_hole oval (at -4.32 2.555) (size 1.1 2.6) (drill oval 0.6 2.1) (layers *.Cu *.Mask) (tstamp 196b4d12-8e07-4703-8fe8-4da98394f0b6))
(pad "S1" thru_hole oval (at 4.32 2.555) (size 1.1 2.6) (drill oval 0.6 2.1) (layers *.Cu *.Mask) (tstamp 583bd426-b49b-4e7c-ad61-436f13b7a903))
(pad "S1" thru_hole oval (at -4.32 -2.805) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (tstamp 6cbd3a6d-e8b4-4a95-be74-c741893631c8))
(pad "S1" thru_hole oval (at 4.32 -2.805) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (tstamp b5084c89-9ef9-4fc9-83c8-88e6bc8e892b))
(zone (net 0) (net_name "") (layers "F.Cu" "Dwgs.User") (tstamp a63bc584-eeb6-40c6-8804-6cb35a542b24) (hatch full 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
(xy 3.5 4.325)
(xy -3.5 4.325)
(xy -3.5 -1.305)
(xy 3.5 -1.305)
)
)
)
(model "${KICAD6_3DMODEL_DIR}/Connector_USB.3dshapes/USB_C_Receptacle_Molex_105450-0101.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)