mirror of
https://gitlab.com/kicad/libraries/kicad-footprints.git
synced 2025-04-24 23:56:20 +00:00
Minor footprint fixes (3D models and footprint name) (#430)
* Add 3D model reference
* Rename HTSOP-8-1EP_3.9x4.9mm_P1.27mm* to reflect the fact that they are manufacturer specific
* Change them to comply to the currently suggested pad stackup for exposed pads and the manufacturer suggestions.
This commit is contained in:
evanshultz
Rene Pöschl
parent
9e65ca8cbf
commit
a29cd9a712
Package_BGA.pretty
Package_DFN_QFN.pretty
QFN-24_3x3mm_P0.4mm_NoMask.kicad_modQFN-24_4x4mm_P0.5mm.kicad_modQFN-24_4x4mm_P0.5mm_NoMask.kicad_modSiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_ThermalVias.kicad_mod
Package_LGA.pretty
Package_QFP.pretty
Package_SO.pretty
HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias.kicad_modHSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias.kicad_modHTSOP-8-1EP_3.9x4.9mm_P1.27mm_LargeCopper.kicad_modHTSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias.kicad_modHTSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias_LargeCopper.kicad_modTexas_HSOP-8-1EP_3.9x4.9mm_P1.27mm.kicad_modTexas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias.kicad_mod
@ -158,4 +158,9 @@
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(pad R11 smd circle (at 5 6) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(pad T11 smd circle (at 5 7) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(pad U11 smd circle (at 5 8) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(model ${KISYS3DMOD}/Package_BGA.3dshapes/BGA-132_12x18mm_Layout11x17_P0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -178,4 +178,9 @@
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(pad R13 smd circle (at 6 6) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(pad T13 smd circle (at 6 7) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(pad U13 smd circle (at 6 8) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask))
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(model ${KISYS3DMOD}/Package_BGA.3dshapes/BGA-152_14x18mm_Layout13x17_P0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -53,7 +53,7 @@
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(pad 24 smd rect (at -1 -1.5 90) (size 0.55 0.2) (layers F.Cu F.Paste F.Mask))
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(pad 25 smd rect (at 0 0) (size 1.75 1.75) (layers F.Mask)
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(solder_paste_margin_ratio -0.2))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24_3x3mm_Pitch0.4mm.wrl
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24_3x3mm_P0.4mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -51,7 +51,7 @@
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(pad 22 smd rect (at -0.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 23 smd rect (at -0.75 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 24 smd rect (at -1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_P0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -53,7 +53,7 @@
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(pad 24 smd rect (at -1.25 -1.95 90) (size 0.85 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 25 smd rect (at 0 0) (size 2.6 2.6) (layers F.Mask)
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(solder_paste_margin_ratio -0.2))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_Pitch0.5mm.wrl
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_P0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -58,7 +58,7 @@
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(pad 21 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(pad 21 thru_hole circle (at 0 0.45) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(pad 21 thru_hole circle (at 0.45 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/SiliconLabs_QFN-20-1EP_3x3mm_Pitch0.5mm.wrl
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -53,4 +53,9 @@
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(pad 11 smd rect (at 0.645 1.225) (size 0.23 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 1.075 1.225) (size 0.23 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 1.505 1.225) (size 0.23 0.35) (layers F.Cu F.Paste F.Mask))
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(model ${KISYS3DMOD}/Package_LGA.3dshapes/LGA-24L_3x3.5mm_P0.43mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -146,7 +146,7 @@
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(pad "" smd rect (at 1.875 -1.875) (size 1 1) (layers F.Paste))
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(pad "" smd rect (at 0.625 -1.875) (size 1 1) (layers F.Paste))
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(pad "" smd rect (at -0.625 -1.875) (size 1 1) (layers F.Paste))
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(model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-100_14x14mm_Pitch0.5mm_EP5x5mm.wrl
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(model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-100_14x14mm_P0.5mm_EP5x5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -119,7 +119,7 @@
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(pad "" smd rect (at 0 -3.2) (size 1.24 1.24) (layers F.Paste))
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(pad "" smd rect (at -1.6 -3.2) (size 1.24 1.24) (layers F.Paste))
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(pad "" smd rect (at -3.2 -3.2) (size 1.24 1.24) (layers F.Paste))
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(model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm_EP8x8mm.wrl
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(model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-64_10x10mm_P0.5mm_EP8x8mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -74,7 +74,7 @@
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(pad 21 thru_hole circle (at 0 -5.08) (size 1 1) (drill 0.7) (layers *.Cu))
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(pad 21 thru_hole circle (at -1.27 -5.08) (size 1 1) (drill 0.7) (layers *.Cu))
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(pad 21 smd rect (at 0 0) (size 6.78 11.86) (layers B.Cu))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HSOP-20-1EP_11.0x15.9mm_Pitch1.27mm_SlugDown.wrl
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -90,7 +90,7 @@
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(pad 37 thru_hole circle (at 0 -5.08) (size 1 1) (drill 0.7) (layers *.Cu))
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(pad 37 thru_hole circle (at -1.27 -5.08) (size 1 1) (drill 0.7) (layers *.Cu))
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(pad 37 smd rect (at 0 0) (size 6.78 11.86) (layers B.Cu))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HSOP-36-1EP_11.0x15.9mm_Pitch0.65mm_SlugDown.wrl
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -1,52 +0,0 @@
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(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_LargeCopper (layer F.Cu) (tedit 5A02F2D3)
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(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, with enlarged copper area, see http://www.ti.com/lit/ds/symlink/tps5430.pdf")
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(tags "HTSOP 1.27")
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(attr smd)
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(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value HTSOP-8-1EP_3.9x4.9mm_P1.27mm_LargeCopper (at 0 3.5) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.9 0.9) (thickness 0.135)))
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)
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(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
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(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu))
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(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at 0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -52,7 +52,7 @@
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(pad 9 thru_hole circle (at -0.6 0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(pad 9 thru_hole circle (at 0.6 0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(pad 9 thru_hole circle (at 0.6 1.2) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
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(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_P1.27mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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@ -1,61 +0,0 @@
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(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias_LargeCopper (layer F.Cu) (tedit 5A02F2D3)
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(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, with enlarged copper area, see http://www.ti.com/lit/ds/symlink/tps5430.pdf")
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(tags "HTSOP 1.27")
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(attr smd)
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(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value HTSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias_LargeCopper (at 0 3.5) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.9 0.9) (thickness 0.135)))
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)
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(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
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(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
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(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
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(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers F.Cu))
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(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
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(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
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(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
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(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at 0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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||||
(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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||||
(solder_paste_margin_ratio -0.2))
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(pad 9 smd rect (at -0.6 -0.8) (size 1.2 1.6) (layers F.Cu F.Paste F.Mask)
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||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 9 smd rect (at 0 0) (size 2.95 4.5) (layers B.Cu))
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||||
(pad 9 thru_hole circle (at -0.6 -1.2) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
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||||
(pad 9 thru_hole circle (at -0.6 -0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.6 -0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.6 -1.2) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at -0.6 1.2) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at -0.6 0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.6 0.4) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.6 1.2) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
|
||||
(at (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
(rotate (xyz 0 0 0))
|
||||
)
|
||||
)
|
||||
@ -0,0 +1,46 @@
|
||||
(module Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm (layer F.Cu) (tedit 5A02F2D3)
|
||||
(descr "Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)")
|
||||
(tags "HSOP 1.27")
|
||||
(attr smd)
|
||||
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm (at 0 3.5) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.9 0.9) (thickness 0.135)))
|
||||
)
|
||||
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
|
||||
(pad 9 smd rect (at 0 0) (size 2.95 4.9) (layers F.Cu))
|
||||
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad "" smd rect (at 0 0) (size 2.6 3.1) (layers F.Paste))
|
||||
(pad "" smd rect (at 0 0) (size 2.6 3.1) (layers F.Mask))
|
||||
(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
|
||||
(at (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
(rotate (xyz 0 0 0))
|
||||
)
|
||||
)
|
||||
@ -0,0 +1,55 @@
|
||||
(module Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias (layer F.Cu) (tedit 5A02F2D3)
|
||||
(descr "Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)")
|
||||
(tags "HSOP 1.27")
|
||||
(attr smd)
|
||||
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias (at 0 3.5) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text user %R (at 0 0) (layer F.Fab)
|
||||
(effects (font (size 0.9 0.9) (thickness 0.135)))
|
||||
)
|
||||
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer F.SilkS) (width 0.15))
|
||||
(pad 9 smd rect (at 0 0) (size 2.95 4.9) (layers F.Cu))
|
||||
(pad 9 smd rect (at 0 0) (size 2.95 4.9) (layers B.Cu))
|
||||
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
|
||||
(pad "" smd rect (at 0 0) (size 2.6 3.1) (layers F.Paste))
|
||||
(pad "" smd rect (at 0 0) (size 2.6 3.1) (layers F.Mask))
|
||||
(pad 9 thru_hole circle (at -0.65 -1.95) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at -0.65 -0.65) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.65 -0.65) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.65 -1.95) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at -0.65 1.95) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at -0.65 0.65) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.65 0.65) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(pad 9 thru_hole circle (at 0.65 1.95) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
|
||||
(model ${KISYS3DMOD}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
|
||||
(at (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
(rotate (xyz 0 0 0))
|
||||
)
|
||||
)
|
||||
Loading…
Reference in New Issue
Block a user