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mirror of https://gitlab.com/kicad/libraries/kicad-footprints.git synced 2025-04-25 00:06:21 +00:00

Reduce paste coverage as per review

This commit is contained in:
Rene Pöschl 2019-01-06 00:59:08 +01:00
parent 22270eeeb0
commit be4e70bb0b
2 changed files with 5 additions and 5 deletions

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@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5C3126AC)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5C31446B)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)

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@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5C3126AC)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5C31446B)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
@ -24,9 +24,9 @@
(pad 9 thru_hole circle (at 0 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd roundrect (at 0 0) (size 0.5 2) (layers B.Cu) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 -0.63) (size 1.01 0.58) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 1.01 0.58) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 1.01 0.58) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 -0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))