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Add WLCSP-20_2.434x1.934mm_Layout5x4_P0.4mm footprint ()

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Add a footprint for Atmel/Microchip SAMD WLCSP-20 package.

Used BGA/CSP script from pointhi/kicad-footprint-generator to generate
footprint.
This commit is contained in:
Hubert Denkmair 2018-07-02 03:45:07 +02:00 committed by Clayton G. Hobbs
parent 8b85027fda
commit f3703f6d09
1 changed files with 72 additions and 0 deletions

72
Package_CSP.pretty/WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm.kicad_mod Normal file
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(module WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm (layer F.Cu) (tedit 5B391AD1)
(descr "WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf")
(tags "BGA 20 0.4")
(attr smd)
(fp_text reference REF** (at 0 -2.217) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm (at 0 2.217) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 0.967 1.217) (end -0.967 1.217) (layer F.Fab) (width 0.1))
(fp_line (start -0.967 1.217) (end -0.967 -0.7335) (layer F.Fab) (width 0.1))
(fp_line (start -0.967 -0.7335) (end -0.4835 -1.217) (layer F.Fab) (width 0.1))
(fp_line (start -0.4835 -1.217) (end 0.967 -1.217) (layer F.Fab) (width 0.1))
(fp_line (start 0.967 -1.217) (end 0.967 1.217) (layer F.Fab) (width 0.1))
(fp_line (start -1.97 -2.22) (end -1.97 2.22) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.97 2.22) (end 1.97 2.22) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.97 2.22) (end 1.97 -2.22) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.97 -2.22) (end -1.97 -2.22) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.6085 -1.342) (end 1.092 -1.342) (layer F.SilkS) (width 0.12))
(fp_line (start 1.092 -1.342) (end 1.092 1.342) (layer F.SilkS) (width 0.12))
(fp_line (start 1.092 1.342) (end -1.092 1.342) (layer F.SilkS) (width 0.12))
(fp_line (start -1.092 1.342) (end -1.092 -0.8585) (layer F.SilkS) (width 0.12))
(pad A1 smd circle (at -0.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A2 smd circle (at -0.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A3 smd circle (at 0.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad A4 smd circle (at 0.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B1 smd circle (at -0.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B2 smd circle (at -0.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B3 smd circle (at 0.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad B4 smd circle (at 0.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C1 smd circle (at -0.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C2 smd circle (at -0.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C3 smd circle (at 0.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad C4 smd circle (at 0.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D1 smd circle (at -0.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D2 smd circle (at -0.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D3 smd circle (at 0.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad D4 smd circle (at 0.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E1 smd circle (at -0.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E2 smd circle (at -0.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E3 smd circle (at 0.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(pad E4 smd circle (at 0.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste)
(solder_paste_margin_ratio 0.055556))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.45 0.45) (thickness 0.0675)))
)
(model ${KISYS3DMOD}/Package_CSP.3dshapes/WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)