* Rename footprints:
* Allegro_SIP-3 to Allegro_SIP-3_4.09x1.52_P1.27mm
* Diodes_SIP-3_AmmoPack to Diodes_SIP-3_4.1x1.5mm_P2.65mm
* Rename Allegro_SIP-4 to Allegro_SIP-4_5.21x1mm_P1.27mm
* Update the name of 3d models
* Undo the change of Allegro SIP-3/4
* Add Diodes SIP-3 1.27mm (Bulk Pack)
* Reduced size of %R to 0.7
Moved package body in y
Updated F.SilkS to new place of body
* Fixed KLC F5.1
* update footprint to have y offset and right size of pads
* Move back F.SilkS line from 0.85 to 0.96
* update F.SilkS it's a bit further away from pad's
- Fix courtyard outline clearance and made it more closely follow the
part
- Fix silk outline to no longer overlap pads plus fix silk arcs to have
the same center as the fab arcs.
- Fix linewidth of fab and silk outlines
- Rotate footprint to get pad 1 nearer to top right corner
- Pad 1 is now a roundrect to distinguish it from the rest
Move the footprint for LEM LV25-P to a new library Sensor_Voltage, as
decided in #694.
Fixed a typo and improved Sensor_Current description in fp-lib-table.
- LEM HO has high/low current versions (8..25A vs 40..150A) The original footprints seemed to suggest that there is only one version. (Adds new footprint for high current and SMT version)
- Fix dimensions for LEM-HTFS
- LEM-HX* rename to fit the style of all other LEM footprints. Fix dimensions.
- LEM_LA25-P naming to allow for others in the series. Fix dimensions
- LEM_LV25-P fix dimensions
Updated footprint due to fit-test on PCB test board.
Enlarged holes and set them all to circular shape.
Re-test footprint after new test board is lasered.
