303 lines
5.0 KiB
Plaintext
303 lines
5.0 KiB
Plaintext
(footprint "LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias"
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(version 20240108)
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(generator "kicad-footprint-generator")
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(layer "F.Cu")
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(descr "LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
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(tags "LFCSP-WD NoLead")
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(property "Reference" "REF**"
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(at 0 -2.45 0)
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(effects
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(size 1 1)
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(thickness 0.15)
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)
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)
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)
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(property "Value" "LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias"
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(at 0 2.45 0)
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(layer "F.Fab")
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(fp_text user "${REFERENCE}"
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(at 0 0 0)
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(effects
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(layers "F.Paste")
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(pad "" smd roundrect
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(pad "1" smd roundrect
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "2" smd roundrect
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "3" smd roundrect
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(at -1.45 0.325)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "4" smd roundrect
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "5" smd roundrect
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(at 1.45 0.975)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "9" thru_hole circle
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(pad "9" thru_hole circle
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(at -0.5 0)
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(size 0.6 0.6)
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(drill 0.3)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(pad "9" thru_hole circle
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(size 0.6 0.6)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(pad "9" smd rect
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(at 0 0)
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(size 1.6 2.44)
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(property pad_prop_heatsink)
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(layers "F.Cu" "F.Mask")
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(zone_connect 2)
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(pad "9" smd rect
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(at 0 0)
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(size 1.6 2.44)
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(property pad_prop_heatsink)
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(layers "B.Cu")
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(zone_connect 2)
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(pad "9" thru_hole circle
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(at 0.5 -0.92)
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(size 0.6 0.6)
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(drill 0.3)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(pad "9" thru_hole circle
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(at 0.5 0)
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(size 0.6 0.6)
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(drill 0.3)
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(property pad_prop_heatsink)
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(layers "*.Cu")
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(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm.wrl"
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(offset
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(xyz 0 0 0)
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(xyz 1 1 1)
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(xyz 0 0 0)
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