303 lines
5.1 KiB
Plaintext
303 lines
5.1 KiB
Plaintext
(footprint "ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm"
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(version 20240108)
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(generator "kicad-footprint-generator")
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(layer "F.Cu")
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(descr "ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102")
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(tags "CSP 20 0.4")
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(solder_mask_margin 0.0325)
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(solder_paste_margin 0.0125)
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(property "Reference" "REF**"
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(at 0 -2.2 0)
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(layer "F.SilkS")
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(effects
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(font
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(size 1 1)
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(thickness 0.15)
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)
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)
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(property "Value" "ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm"
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(at 0 2.2 0)
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(layer "F.Fab")
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(effects
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(attr smd)
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(fp_line
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(stroke
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(fp_line
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(fp_line
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(stroke
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(type solid)
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(layer "F.Fab")
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(fp_line
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(layer "F.Fab")
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(fp_text user "${REFERENCE}"
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(layer "F.Fab")
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(pad "A1" smd circle
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(at -0.6 -0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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)
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(pad "A2" smd circle
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(at -0.2 -0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "A3" smd circle
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(at 0.2 -0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "A4" smd circle
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(at 0.6 -0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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)
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(pad "B1" smd circle
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(at -0.6 -0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "B2" smd circle
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(at -0.2 -0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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)
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(pad "B3" smd circle
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(at 0.2 -0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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)
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(pad "B4" smd circle
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(at 0.6 -0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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)
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(pad "C1" smd circle
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(at -0.6 0)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "C2" smd circle
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(at -0.2 0)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "C3" smd circle
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(at 0.2 0)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "C4" smd circle
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(at 0.6 0)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "D1" smd circle
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(at -0.6 0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "D2" smd circle
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(at -0.2 0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "D3" smd circle
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(at 0.2 0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "D4" smd circle
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(at 0.6 0.4)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E1" smd circle
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(at -0.6 0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E2" smd circle
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(at -0.2 0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E3" smd circle
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(at 0.2 0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(pad "E4" smd circle
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(at 0.6 0.8)
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(size 0.225 0.225)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm.wrl"
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(offset
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(xyz 0 0 0)
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(scale
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(xyz 1 1 1)
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(rotate
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(xyz 0 0 0)
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