kicad-footprints/Package_CSP.pretty/ST_WLCSP-25_Die425.kicad_mod

(footprint "ST_WLCSP-25_Die425"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "WLCSP-25, 2.097x2.493mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l031f6.pdf#page=112")
	(tags "CSP 25 0.4")
	(solder_mask_margin 0.04)
	(solder_paste_margin 0.000001)
	(property "Reference" "REF**"
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		(effects
			(font
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				(thickness 0.15)
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	)
	(property "Value" "ST_WLCSP-25_Die425"
		(at 0 2.2465 0)
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		(effects
			(font
				(size 1 1)
				(thickness 0.15)
			)
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	(attr smd)
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		(stroke
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	(fp_poly
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			(xy -1.67 -1.3565)
			(xy -1.17 -1.8565)
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		(stroke
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		(fill solid)
		(layer "F.SilkS")
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		(stroke
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		(layer "F.CrtYd")
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		(stroke
			(width 0.1)
			(type solid)
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		(layer "F.Fab")
	)
	(fp_text user "${REFERENCE}"
		(at 0 0 -90)
		(layer "F.Fab")
		(effects
			(font
				(size 0.58 0.58)
				(thickness 0.087)
			)
		)
	)
	(pad "A1" smd circle
		(at -0.8 -0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A2" smd circle
		(at -0.4 -0.8)
		(size 0.22 0.22)
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	)
	(pad "A3" smd circle
		(at 0 -0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "A4" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "A5" smd circle
		(at 0.8 -0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "B1" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "B2" smd circle
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		(size 0.22 0.22)
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	(pad "B3" smd circle
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		(size 0.22 0.22)
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		(size 0.22 0.22)
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	(pad "C1" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "C2" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C3" smd circle
		(at 0 0)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C4" smd circle
		(at 0.4 0)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C5" smd circle
		(at 0.8 0)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D1" smd circle
		(at -0.8 0.4)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D2" smd circle
		(at -0.4 0.4)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D3" smd circle
		(at 0 0.4)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D4" smd circle
		(at 0.4 0.4)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D5" smd circle
		(at 0.8 0.4)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E1" smd circle
		(at -0.8 0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E2" smd circle
		(at -0.4 0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E3" smd circle
		(at 0 0.8)
		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "E4" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
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	)
	(pad "E5" smd circle
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		(size 0.22 0.22)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-25_Die425.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)