399 lines
6.9 KiB
Plaintext
399 lines
6.9 KiB
Plaintext
(footprint "ST_WLCSP-36_Die445"
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(version 20240108)
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(generator "kicad-footprint-generator")
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(layer "F.Cu")
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(descr "WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=96")
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(tags "CSP 36 0.4")
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(solder_mask_margin 0.04)
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(solder_paste_margin 0.000001)
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(property "Reference" "REF**"
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(property "Value" "ST_WLCSP-36_Die445"
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(effects
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(property pad_prop_bga)
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(property pad_prop_bga)
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(layers "F.Cu" "F.Paste" "F.Mask")
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(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-36_Die445.wrl"
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(offset
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(xyz 0 0 0)
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(scale
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(xyz 1 1 1)
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(xyz 0 0 0)
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