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kicad-footprints
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kicad-footprints/Package_CSP.pretty/ST_WLCSP-66_Die411.kicad_mod

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(footprint "ST_WLCSP-66_Die411"
(version 20240108)
(generator "pcbnew")
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(descr "WLCSP-66, 3.639x3.971mm, 66 Ball, 9x9 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=154")
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(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "fef52ed4-dbfe-4e88-a3f6-a558c57929d6")
)
(pad "J5" smd circle
(at 0 1.6)
(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "21d0f27d-7ea9-4487-9e84-621a7df38890")
)
(pad "J6" smd circle
(at 0.4 1.6)
(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "8dff6e40-8ded-419d-bc99-0d4ee9e21fbb")
)
(pad "J7" smd circle
(at 0.8 1.6)
(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "11498d38-cd1b-45bf-b263-d54486a43cdd")
)
(pad "J8" smd circle
(at 1.2 1.6)
(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "6c6c1102-9668-44f6-8149-e4cb24d12073")
)
(pad "J9" smd circle
(at 1.6 1.6)
(size 0.225 0.225)
(property pad_prop_bga)
(layers "F.Cu" "F.Paste" "F.Mask")
(uuid "733b84b5-38f1-43b5-860b-d7386cd4c092")
)
(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-66_Die411.wrl"
(offset
(xyz 0 0 0)
)
(scale
(xyz 1 1 1)
)
(rotate
(xyz 0 0 0)
)
)
)
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