kicad-footprints/Package_CSP.pretty/WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm.kicad_mod

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		(uuid "9ff333cb-5492-4f5e-942c-be6025254749")
	)
	(pad "G3" smd circle
		(at -0.4 1)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "c158f60d-bd5c-4d5d-8abb-81775f661c91")
	)
	(pad "G4" smd circle
		(at 0 1)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "d2cdd7cc-09a3-48ef-9b4b-43616b050ec4")
	)
	(pad "G5" smd circle
		(at 0.4 1)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "20c466a2-1afa-441e-a8fb-21e6fbd3ffc9")
	)
	(pad "G6" smd circle
		(at 0.8 1)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "ed3a0f89-491a-4310-aec3-5c14f25c5e98")
	)
	(pad "G7" smd circle
		(at 1.2 1)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "2e2bcce8-9756-47c5-ae72-4f1e71ee3a75")
	)
	(pad "H1" smd circle
		(at -1.2 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "253eb91e-b23d-49fc-945e-12d6c701b723")
	)
	(pad "H2" smd circle
		(at -0.8 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "865389f0-8280-4b89-ba0e-171d0ef03cea")
	)
	(pad "H3" smd circle
		(at -0.4 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "0ad8a2dc-e890-4843-88ab-ab620cd63f83")
	)
	(pad "H4" smd circle
		(at 0 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "2417c1d3-7fdf-48f1-89ad-61f9dda0b3fb")
	)
	(pad "H5" smd circle
		(at 0.4 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "ffad88d7-ce70-43bb-838a-f99c52b44e1a")
	)
	(pad "H6" smd circle
		(at 0.8 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "2085b74b-646b-458c-a546-626362cffa59")
	)
	(pad "H7" smd circle
		(at 1.2 1.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(solder_paste_margin_ratio 0.055556)
		(uuid "9a1b6fdc-9327-4837-9eb3-6faa668cea39")
	)
	(model "${KICAD8_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)