kicad-footprints/Package_CSP.pretty/ST_WLCSP-25_Die444.kicad_mod

(footprint ST_WLCSP-25_Die444 (version 20221018) (generator kicad-footprint-generator)
  (layer F.Cu)
  (descr "WLCSP-25, 2.423x2.325mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=93")
  (tags "CSP 25 0.4")
  (attr smd)
  (solder_mask_margin 0.0325)
  (solder_paste_margin 0.0125)
  (fp_text reference REF** (at 0 -2.1625) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value ST_WLCSP-25_Die444 (at 0 2.1625) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.2115 1.1625) (end -1.2115 1.1625)
    (stroke (width 0.1) (type solid)) (layer F.Fab))
  (fp_line (start -1.2115 1.1625) (end -1.2115 -0.58125)
    (stroke (width 0.1) (type solid)) (layer F.Fab))
  (fp_line (start -1.2115 -0.58125) (end -0.63025 -1.1625)
    (stroke (width 0.1) (type solid)) (layer F.Fab))
  (fp_line (start -0.63025 -1.1625) (end 1.2115 -1.1625)
    (stroke (width 0.1) (type solid)) (layer F.Fab))
  (fp_line (start 1.2115 -1.1625) (end 1.2115 1.1625)
    (stroke (width 0.1) (type solid)) (layer F.Fab))
  (fp_line (start -2.22 -2.17) (end -2.22 2.17)
    (stroke (width 0.05) (type solid)) (layer F.CrtYd))
  (fp_line (start -2.22 2.17) (end 2.22 2.17)
    (stroke (width 0.05) (type solid)) (layer F.CrtYd))
  (fp_line (start 2.22 2.17) (end 2.22 -2.17)
    (stroke (width 0.05) (type solid)) (layer F.CrtYd))
  (fp_line (start 2.22 -2.17) (end -2.22 -2.17)
    (stroke (width 0.05) (type solid)) (layer F.CrtYd))
  (fp_line (start -0.74025 -1.2725) (end 1.3215 -1.2725)
    (stroke (width 0.12) (type solid)) (layer F.SilkS))
  (fp_line (start 1.3215 -1.2725) (end 1.3215 1.2725)
    (stroke (width 0.12) (type solid)) (layer F.SilkS))
  (fp_line (start 1.3215 1.2725) (end -1.3215 1.2725)
    (stroke (width 0.12) (type solid)) (layer F.SilkS))
  (fp_line (start -1.3215 1.2725) (end -1.3215 -0.69125)
    (stroke (width 0.12) (type solid)) (layer F.SilkS))
  (pad A1 smd circle (at -0.8 -0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad A2 smd circle (at -0.4 -0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad A3 smd circle (at 0 -0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad A4 smd circle (at 0.4 -0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad A5 smd circle (at 0.8 -0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad B1 smd circle (at -0.8 -0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad B2 smd circle (at -0.4 -0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad B3 smd circle (at 0 -0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad B4 smd circle (at 0.4 -0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad B5 smd circle (at 0.8 -0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad C1 smd circle (at -0.8 0) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad C2 smd circle (at -0.4 0) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad C3 smd circle (at 0 0) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad C4 smd circle (at 0.4 0) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad C5 smd circle (at 0.8 0) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad D1 smd circle (at -0.8 0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad D2 smd circle (at -0.4 0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad D3 smd circle (at 0 0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad D4 smd circle (at 0.4 0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad D5 smd circle (at 0.8 0.4) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad E1 smd circle (at -0.8 0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad E2 smd circle (at -0.4 0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad E3 smd circle (at 0 0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad E4 smd circle (at 0.4 0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (pad E5 smd circle (at 0.8 0.8) (size 0.225 0.225) (property pad_prop_bga) (layers F.Cu F.Mask F.Paste))
  (fp_poly (pts (xy -1.3215 -1.2725) (xy -1.8215 -1.2725) (xy -1.3215 -1.7725) (xy -1.3215 -1.2725))
    (stroke (width 0.12) (type solid)) (fill solid) (layer F.SilkS))
  (fp_text user ${REFERENCE} (at 0 0) (layer F.Fab)
    (effects (font (size 0.56 0.56) (thickness 0.084)))
  )
  (model ${KICAD7_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-25_Die444.wrl
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)