mirror of
https://gitlab.com/kicad/code/kicad.git
synced 2024-11-24 09:15:03 +00:00
d25ac664f8
Some simulation demos curtesy of Holger Vogt and a new board design curtesy of Pat Deegan
210 lines
4.9 KiB
Plaintext
210 lines
4.9 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "7.0.9-7.0.9~ubuntu22.04.1"
|
|
},
|
|
"CreationDate": "2023-12-15T15:20:45-05:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "tinytapeout-demo",
|
|
"GUID": "74696e79-7461-4706-956f-75742d64656d",
|
|
"Revision": "0.9.4"
|
|
},
|
|
"Size": {
|
|
"X": 104.6,
|
|
"Y": 81.1
|
|
},
|
|
"LayerNumber": 4,
|
|
"BoardThickness": 1.5625,
|
|
"Finish": "None",
|
|
"ImpedanceControlled": true
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.18,
|
|
"PadToTrack": 0.18,
|
|
"TrackToTrack": 0.2,
|
|
"MinLineWidth": 0.16,
|
|
"TrackToRegion": 0.25,
|
|
"RegionToRegion": 0.25
|
|
},
|
|
{
|
|
"Layers": "Inner",
|
|
"PadToPad": 0.18,
|
|
"PadToTrack": 0.18,
|
|
"TrackToTrack": 0.2,
|
|
"MinLineWidth": 0.23,
|
|
"TrackToRegion": 0.25,
|
|
"RegionToRegion": 0.25
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "tinytapeout-demo-F_Cu.gbr",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-In1_Cu.gbr",
|
|
"FileFunction": "Copper,L2,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-In2_Cu.gbr",
|
|
"FileFunction": "Copper,L3,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-B_Cu.gbr",
|
|
"FileFunction": "Copper,L4,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-F_Paste.gbr",
|
|
"FileFunction": "SolderPaste,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-B_Paste.gbr",
|
|
"FileFunction": "SolderPaste,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-F_Silkscreen.gbr",
|
|
"FileFunction": "Legend,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-B_Silkscreen.gbr",
|
|
"FileFunction": "Legend,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-F_Mask.gbr",
|
|
"FileFunction": "SolderMask,Top",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-B_Mask.gbr",
|
|
"FileFunction": "SolderMask,Bot",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-Edge_Cuts.gbr",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "tinytapeout-demo-User_2.gbr",
|
|
"FileFunction": "Other,User",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Color": "White",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Color": "Green",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Color": "R109G116B75",
|
|
"Thickness": 0.0681,
|
|
"Material": "R-1551(W)",
|
|
"DielectricConstant": "4.3",
|
|
"LossTangent": "0.02",
|
|
"Name": "F.Cu/In1.Cu (1/2)",
|
|
"Notes": "Type: dielectric layer 1 - 1/2 (from F.Cu to In1.Cu)"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Color": "R109G116B75",
|
|
"Thickness": 0.0681,
|
|
"Material": "R-1551(W)",
|
|
"DielectricConstant": "4.3",
|
|
"LossTangent": "0.02",
|
|
"Name": "F.Cu/In1.Cu (2/2)",
|
|
"Notes": "Type: dielectric layer 1 - 2/2 (from F.Cu to In1.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "In1.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Color": "R109G116B75",
|
|
"Thickness": 1.13,
|
|
"Material": "R-1566(W)",
|
|
"DielectricConstant": "4.6",
|
|
"LossTangent": "0.02",
|
|
"Name": "In1.Cu/In2.Cu",
|
|
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "In2.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Color": "R109G116B75",
|
|
"Thickness": 0.0681,
|
|
"Material": "R-1551(W)",
|
|
"DielectricConstant": "4.3",
|
|
"LossTangent": "0.02",
|
|
"Name": "In2.Cu/B.Cu (1/2)",
|
|
"Notes": "Type: dielectric layer 3 - 1/2 (from In2.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Color": "R109G116B75",
|
|
"Thickness": 0.0681,
|
|
"Material": "R-1551(W)",
|
|
"DielectricConstant": "4.3",
|
|
"LossTangent": "0.02",
|
|
"Name": "In2.Cu/B.Cu (2/2)",
|
|
"Notes": "Type: dielectric layer 3 - 2/2 (from In2.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Color": "Green",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Color": "White",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|