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kicad/qa/data/pcbnew/issue16182.kicad_pcb
Seth Hillbrand 9e48b388fe Add additional QA sliver check
2023-11-28 16:02:39 -08:00

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(kicad_pcb (version 20231007) (generator pcbnew)
(general
(thickness 1.6062)
)
(paper "A4")
(title_block
(title "grblPANEL")
(date "2023-04-28")
(rev "B")
(company "dresco")
)
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" power)
(2 "In2.Cu" power)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Black") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.2104) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.0152))
(layer "dielectric 2" (type "core") (thickness 1.065) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.0152))
(layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Black") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "ENIG")
(dielectric_constraints yes)
)
(pad_to_mask_clearance 0)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(plot_on_all_layers_selection 0x0000000_00000000)
(disableapertmacros false)
(usegerberextensions true)
(usegerberattributes true)
(usegerberadvancedattributes false)
(creategerberjobfile false)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 6)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(pdf_front_fp_property_popups true)
(pdf_back_fp_property_popups true)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue false)
(plotfptext true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk true)
(outputformat 1)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "manufacturing/")
)
)
(net 0 "")
(net 1 "GND")
(net 2 "/Power/VIN_PI_OUT")
(net 3 "+3V3")
(net 4 "/MCU/~{RST}")
(net 5 "/Power/PWR_LED_K")
(net 6 "DISPLAY_D{slash}C")
(net 7 "DISPLAY_SDA")
(net 8 "Net-(JP401-B)")
(net 9 "Net-(R202-Pad1)")
(net 10 "/MCU/LED_K")
(net 11 "/MCU/SWCLK{slash}BOOT0")
(net 12 "MODBUS_RX")
(net 13 "MODBUS_TX")
(net 14 "/Modbus/CONN_RS485_A")
(net 15 "/Modbus/CONN_RS485_B")
(net 16 "/Modbus/RS485_B")
(net 17 "/Modbus/RS485_A")
(net 18 "/Modbus/RS485_MODE_SELECT")
(net 19 "/Display/CONN_SCL")
(footprint "TestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm" (layer "F.Cu")
(tstamp 0000468b-72e2-4a41-a1c6-bb64ad8b1463)
(at 161 100.5)
(descr "THT pad as test Point, diameter 2.0mm, hole diameter 1.0mm")
(tags "test point THT pad")
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(at 178.3 107 90)
(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
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(net 9 "Net-(R202-Pad1)") (pintype "passive")
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