mirror of
https://gitlab.com/kicad/code/kicad.git
synced 2024-11-22 12:25:01 +00:00
151 lines
9.5 KiB
Plaintext
151 lines
9.5 KiB
Plaintext
(kicad_pcb (version 20201002) (generator pcbnew)
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(general
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(thickness 0.6)
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)
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(paper "A4" portrait)
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(layers
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(0 "F.Cu" signal)
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(31 "B.Cu" signal)
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(34 "B.Paste" user)
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(35 "F.Paste" user)
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(36 "B.SilkS" user "B.Silkscreen")
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(37 "F.SilkS" user "F.Silkscreen")
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(38 "B.Mask" user)
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(39 "F.Mask" user)
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(40 "Dwgs.User" user "User.Drawings")
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(41 "Cmts.User" user "User.Comments")
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(42 "Eco1.User" user "User.Eco1")
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(43 "Eco2.User" user "User.Eco2")
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(44 "Edge.Cuts" user)
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(45 "Margin" user)
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(46 "B.CrtYd" user "B.Courtyard")
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(47 "F.CrtYd" user "F.Courtyard")
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(48 "B.Fab" user)
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(49 "F.Fab" user)
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)
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(setup
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(grid_origin 118.35 87.8)
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(pcbplotparams
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(layerselection 0x0020000_7ffffffe)
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(disableapertmacros false)
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(usegerberextensions true)
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(usegerberattributes false)
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(usegerberadvancedattributes false)
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(creategerberjobfile false)
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(svguseinch false)
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(svgprecision 6)
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(excludeedgelayer false)
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(plotframeref false)
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(viasonmask false)
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(mode 1)
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(useauxorigin false)
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(hpglpennumber 1)
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(hpglpenspeed 20)
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(hpglpendiameter 15.000000)
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(psnegative false)
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(psa4output false)
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(plotreference true)
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(plotvalue false)
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(plotinvisibletext false)
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(sketchpadsonfab false)
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(subtractmaskfromsilk false)
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(outputformat 1)
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(mirror false)
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(drillshape 0)
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(scaleselection 1)
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(outputdirectory "output/")
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)
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)
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(net 0 "")
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(module "Library:QFN-20_EPthermal_4x4_Pitch0.5mm" (layer "F.Cu") (tedit 5A577FBB) (tstamp 45b7cde5-bc80-41b4-aa8e-41957f86bdb8)
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(at 111.85 167.8)
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(solder_mask_margin 0.05)
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(attr smd)
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(fp_text reference "U1" (at 3.1212 2.10262) (layer "F.SilkS")
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(effects (font (size 0.6 0.6) (thickness 0.125)))
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(tstamp 8b4262ff-30a3-4738-9376-1c809710ad89)
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)
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(fp_text value "DRV8662" (at -0.95 1.55) (layer "F.Fab")
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(effects (font (size 0.2 0.2) (thickness 0.04)))
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(tstamp 5f9a7236-4a12-4d4e-8a5e-887c58ad8dec)
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)
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(fp_line (start 1.5 2.15) (end 2.15 2.15) (layer "F.SilkS") (width 0.15) (tstamp 327d2c64-87cf-402c-afdd-ed5a14beeb7e))
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(fp_line (start -1.5 2.15) (end -2.15 2.15) (layer "F.SilkS") (width 0.15) (tstamp 6a1ed244-ec32-45a6-b784-c506ab3c221b))
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(fp_line (start -1.5 -2.15) (end -2.45 -2.15) (layer "F.SilkS") (width 0.15) (tstamp 75225048-9669-4639-ac49-c0a544a1eafa))
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(fp_line (start 1.5 -2.15) (end 2.15 -2.15) (layer "F.SilkS") (width 0.15) (tstamp 7944d492-4921-47c1-a264-5b48b2ae90a5))
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(fp_line (start 2.15 2.15) (end 2.15 1.5) (layer "F.SilkS") (width 0.15) (tstamp 7c24d088-1c24-4609-910e-7f97e05d7552))
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(fp_line (start 2.15 -2.15) (end 2.15 -1.5) (layer "F.SilkS") (width 0.15) (tstamp c3ec1833-b076-414f-805b-967aa57886cd))
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(fp_line (start -2.15 2.15) (end -2.15 1.5) (layer "F.SilkS") (width 0.15) (tstamp d2f67dea-2553-4e93-891f-77c862864ea6))
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(fp_line (start -2.7 -2.7) (end 2.7 -2.7) (layer "F.CrtYd") (width 0.05) (tstamp 36f09194-9ad6-4b52-b405-d3bd5ea8e9e6))
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(fp_line (start 2.7 2.7) (end -2.7 2.7) (layer "F.CrtYd") (width 0.05) (tstamp 6e9c91e8-ae74-4418-8f8a-46261d4f8e63))
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(fp_line (start -2.7 2.7) (end -2.7 -2.7) (layer "F.CrtYd") (width 0.05) (tstamp deb91194-cc4f-4bb7-bf04-6785f76afef6))
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(fp_line (start 2.7 -2.7) (end 2.7 2.7) (layer "F.CrtYd") (width 0.05) (tstamp e00ef1b1-d5b2-4815-8652-d067f42c7c52))
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(fp_line (start 2 -2) (end -1 -2) (layer "F.Fab") (width 0.15) (tstamp 3a9112de-af1c-4faf-b4ab-9a961b86ff75))
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(fp_line (start -2 -1) (end -2 2) (layer "F.Fab") (width 0.15) (tstamp 4e9f2468-ca53-4094-a969-dad35490bef5))
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(fp_line (start -2 2) (end 2 2) (layer "F.Fab") (width 0.15) (tstamp 7d98b9b4-7fa5-4ec2-b289-94599c56eb28))
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(fp_line (start 2 2) (end 2 -2) (layer "F.Fab") (width 0.15) (tstamp a8e95b8b-1ba3-4b98-a49a-a1379bbfc6a4))
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(fp_line (start -1 -2) (end -2 -1) (layer "F.Fab") (width 0.15) (tstamp bb4d5b22-c955-448b-ba2c-e21d20421eb0))
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(pad "" smd rect (at 0.7 -0.45 180) (size 1.15 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp 53be17fd-90aa-45c2-8960-2aac1f09b2b7))
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(pad "" smd rect (at 0.45 0 270) (size 2.5 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp 7b955d4c-951f-47ab-9cb9-d3535edabc4d))
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(pad "" smd rect (at -0.7 -0.45 180) (size 1.15 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp 7f5d1a78-4bf0-4a63-a6a7-e9f734b54bca))
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(pad "" smd rect (at -0.7 0.45 180) (size 1.15 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp 8b4516fb-bc3a-404c-a00d-38569b343da5))
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(pad "" smd rect (at 0.7 0.45 180) (size 1.15 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp c8fba975-8e7c-403e-ae9c-49154d2b6189))
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(pad "" smd rect (at -0.45 0 270) (size 2.5 0.5) (layers "F.Paste")
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(solder_paste_margin -0.001) (solder_paste_margin_ratio -0.00001) (tstamp ef12e846-e57f-4e28-9f2e-3f00e11c197e))
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(pad "1" smd oval (at -2 -1 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 768a7468-1753-4223-902f-76af41e9fac5))
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(pad "2" smd oval (at -2 -0.5 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6b1c48fe-8c58-4c07-84bd-19466c67d61e))
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(pad "3" smd oval (at -2 0 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b4e991e0-48e3-4f1e-8958-eb74f1605ff3))
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(pad "4" smd oval (at -2 0.5 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c469c387-729d-49e0-ba07-d3274e6750f2))
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(pad "5" smd oval (at -2 1 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 91136658-66ff-4f6e-a83a-eb428d0a82ec))
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(pad "6" smd oval (at -1 2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e6e435c1-f3b5-432d-baed-6a3b0d037e6f))
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(pad "7" smd oval (at -0.5 2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 648b167b-9735-4366-8574-8291918326c0))
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(pad "8" smd oval (at 0 2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d4fc124e-fd92-44fe-bfff-dbde2578cede))
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(pad "9" smd oval (at 0.5 2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5a9cc9c0-cb48-4734-8d45-42b2d71efaa8))
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(pad "10" smd oval (at 1 2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5f46267a-8bbd-46df-b186-11bf6c0aeae2))
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(pad "11" smd oval (at 2 1 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6e62e90e-49b3-4580-80df-b98eb8e6bdd3))
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(pad "12" smd oval (at 2 0.5 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 688d58dc-5cb4-4847-94fb-89376c16c1b1))
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(pad "13" smd oval (at 2 0 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4e747f0e-c64a-47de-bbfc-9a80d6053f48))
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(pad "14" smd oval (at 2 -0.5 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a86fee9b-e895-4625-af7b-1bbbcaa60a1b))
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(pad "15" smd oval (at 2 -1 90) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3a07e109-54f7-47e0-b916-a4bf49106377))
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(pad "16" smd oval (at 1 -2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b79e63c3-00af-402c-9f78-8748b728dabb))
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(pad "17" smd oval (at 0.5 -2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c49d8a2a-516e-4c7c-8a70-3d52e15a470e))
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(pad "18" smd oval (at 0 -2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 73f5fd23-6004-41c3-93d4-82d07b0b753f))
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(pad "19" smd oval (at -0.5 -2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8c8282eb-b554-4fc9-a715-20220d73947d))
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(pad "20" smd oval (at -1 -2) (size 0.28 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b05e47c7-918e-499c-a5da-c457afef2e5c))
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(pad "21" smd rect (at 0 0) (size 2.69 2.69) (layers "F.Cu" "F.Mask")
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(solder_paste_margin -0.1) (solder_paste_margin_ratio -0.5) (tstamp 0ee5314f-6106-43e6-98d8-f37806cc06dc))
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(pad "21" thru_hole circle (at 0 0) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 2dc81eab-8a72-457b-8a91-39614ced35b3))
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(pad "21" thru_hole circle (at 0.9 -0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 52012ffa-7aa6-4d85-84f0-9f2f9f9df1c4))
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(pad "21" thru_hole circle (at 0 0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 5225ad7d-bb06-4401-bdb8-110ab2b0aade))
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(pad "21" thru_hole circle (at 0.9 0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 6ea7d2d3-6d72-47b6-87b1-f7adc48bf14a))
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(pad "21" thru_hole circle (at -0.9 -0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 70d30e2f-895f-491c-9c54-437a2ccac849))
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(pad "21" thru_hole circle (at 0 -0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 77d71e37-7032-46a2-8537-6d07e9ba2472))
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(pad "21" smd rect (at 0 0) (size 2.69 2.69) (layers "B.Cu")
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(solder_paste_margin -0.1) (solder_paste_margin_ratio -0.5) (tstamp 8450d738-e08f-4bb2-8086-d58a63ba384c))
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(pad "21" thru_hole circle (at -0.9 0) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp 8ff0f344-6a82-4ed0-96d9-64833fc41a86))
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(pad "21" thru_hole circle (at 0.9 0) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp bfcd3d32-8e9a-4760-ae2b-b32e0778299a))
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(pad "21" thru_hole circle (at -0.9 0.9) (size 0.45 0.45) (drill 0.3) (layers *.Cu)
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(solder_paste_margin_ratio -0.5) (tstamp dba7fae7-a726-4eff-bcfe-fa5080a06b44))
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)
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)
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