kicad/qa/data/pcbnew/padstacks.kicad_pcb

(kicad_pcb
	(version 20240609)
	(generator "pcbnew")
	(generator_version "8.99")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
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		(1 "In1.Cu" signal)
		(2 "In2.Cu" signal)
		(3 "In3.Cu" signal)
		(4 "In4.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 0.535)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In3.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 4"
				(type "core")
				(thickness 0.535)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In4.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 5"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
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			(plot_on_all_layers_selection 0x0000000_00000000)
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			(creategerberjobfile yes)
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			(plotframeref no)
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			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
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			(pdf_metadata yes)
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			(plotvalue yes)
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		)
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