**Fabrication and Assembly Information**\
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true
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About this Board
Board Description
This flexible circuit board connects the OreSat Reaction Wheel boards (the boards that control each reaction wheel) to the
the OreSat RW Card, which handles the OreSat Power Domain for each RW. For more information, see the open source
OreSat CubeSat system
Printed Circuit Board (PCB) Fabrication Information
Board Info
2 layer board
Bounding box is 39.5 x 10.2 mm
Flexible PCB with two polimide stiffeners (see below)
Note that these boards were originally run and tested using JLCPCB's flexible PCB service.
Board Requirements
Design Rules
Minimum Trace / Space design rules
Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
Hole placement tolerance: +/- 0.075 mm (3.0 mil)
Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
Drills
Drill Positional Tolerance: 0.051 mm (2.0 mil)
Drill Size tolerance: +/- 0.064 mm (2.5 mil)
Plated/Un-plated holes
PTH minimum diameter: 0.3 mm (11.8 mil)
PTH minimum annulus: 0.2 mm (7.9 mil)
Outline/Routing
No requirements
Slots
There are no slots.
Cutouts
There are no cutouts.
There are no fiducials.
Panel tabs ("mouse bites")
No requirements; prefer that board edges are smooth; no mouse bites or other intrusions into the card outline.
If external mouse bites are required, minimize and customer will remove by hand before assembly.
If not otherwise specified, build to IPC 6012 Class 2 or better.
Materials
No controlled impedance.
Note that these boards were originally run and tested using JLCPCB's flexible PCB service, and so numbers here are arbitrarily from that service. Other thicknesses can be used, contact us to discuss.
0.33 to 0.5 oz Copper.
Polyimide flexible circuit material, 25 um thick dielectric
Coverlay (soldermask equivalent) is 12.5 um Polyimide
There are two 0.25 mm thick Polyimide stiffeners on the TOP surface, one on each end.
These can be FR4 stiffeners if easier / cheaper.
Board Surface treatment should be ENIG.
White silkscreen on top and bottom surface
Suggested Stack Up
Layer
Thickness
Notes
Top Stiffener
0.25 mm / 9.84 mils
Stiffener on top surface of board only
Top Coverlay
12.5 um / 0.49 mils
Coverlay / Solder mask
Top Copper
18.0 um / 0.71 mils
Layer 1 foil, 0.5 oz Cu after plating
Polyimide Core
25.0 um / 0.98 mils
Polyimide flex material
Bottom Copper
18.0 um / 0.71 mils
Layer 2 foil, 0.5 oz Cu after plating
Bottom Coverlay
12.5 um / 0.49 mils
Coverlay / Solder mask
Total thickness: 86 um (without stiffener)
Array / Panel Information
No panel or array required.
Fabrication Files
IPC-2581 File
Filename
Notes
PROJECT-NAME-ipc2581.xml
IPC-2581 board information file
Legacy PCB Files
Filename
Notes
PROJECT-NAME-Edge_Cuts.gbr
RS274X file for the dimension (outline) layer
PROJECT-NAME-F_Silkscreen.gbr
RS274X file for the top silkscreen
PROJECT-NAME-F_Mask.gbr
RS274X file for the top soldermask
PROJECT-NAME-F_Cu.gbr
RS274X file for the top copper layer
PROJECT-NAME-B_Cu.gbr
RS274X file for the bottom copper layer
PROJECT-NAME-B_Mask.gbr
RS274X file for the bottom soldermask
PROJECT-NAME-B_Silkscreen.gbr
RS274X file for the bottom silkscreen
PROJECT-NAME-User_Stiffeners.gbr
RS274X file for PI stiffener
PROJECT-NAME-PTH.drl
Excellon file for plated through holes
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Printed Circuit Board Assembly (PCBA) Information
Assembly Info
There are SMT components only on the bottom side of the board.
Assembly Requirements
Assemble to IPC Class 2 or better
Bake components that are not moisture sealed to appropriate levels as required.
Solder paste MUST be leaded.
Aqueous flux and wash strongly preferred.
Clean to NASA Standard "Visibly Clean (VC)": No particles or residues are visible to the naked eye.
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