oresat-adcs-hardware/oresat-rw-card

title, subtitle, fontsize, geometry, toc, toc-depth, colorlinks, urlcolor

title	subtitle	fontsize	geometry	toc	toc-depth	colorlinks	urlcolor
**OreSat Reaction Wheel (RW) Card**	**Fabrication and Assembly Information**\ For build TIME-STAMP	10pt	margin=0.5in	true	2	true	blue

\newpage

About this Board

Board Description

The OreSat RW Card run the four reaction wheels on the open source OreSat CubeSat system. The RW card:

• Has an OreSat Power Domain (OPD) per reaction wheel.
• Requires a flexible cable between the card and the RW board.

Documentation Links

• RW card hardware Git repository: https://github.com/oresat/oresat-adcs-hardware
• TODO: RW card Design Notes + Design Review Notes

Documentation Files

Filename	Notes
README.pdf	This README file
PROJECT-NAME-outline.dxf	Board outline (with holes) in DXF format
PROJECT-NAME-pcba.step	3D model of PCBA (with components)
PROJECT-NAME-render-bot.jpg	Render of the top of the 3D model
PROJECT-NAME-render-bot.jpg	Render of the bottom of the 3D model
PROJECT-NAME-schematic.pdf	PDF of board schematics

Contact Information

• Website: https://www.oresat.org/
• Email: oresat@pdx.edu
• Instagram: @pdxaerospace

Board Renders

{width=50%} {width=50%}

\newpage

Printed Circuit Board (PCB) Fabrication Information

Board Info

• 4 layer board
• Bounding box is 99.8 x 94.6 mm (3.93 x 3.72 in)
• Board thickness is 1.59 mm (0.063 inch)

Board Requirements

• Design Rules
  • Minimum Trace / Space design rules
    • Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
    • Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
  • Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
  • Hole placement tolerance: +/- 0.075 mm (3.0 mil)
  • Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
• Drills
  • Drill Positional Tolerance: 0.051 mm (2.0 mil)
  • Drill Size tolerance: +/- 0.064 mm (2.5 mil)
• Plated/Un-plated holes
  • There are 2 un-plated (NPT) holes
  • There are 664 plated through (PTH) holes
  • PTH minimum diameter: 0.254 mm (10 mil)
  • PTH minimum annulus: 0.102 mm (4 mil) radius
• Outline/Routing
  • Requires a 1.0 mm or smaller diameter routing bit
• Slots
  • There is one cutout.
• Cutouts
  • There are no cutouts
• There are 3 fiducials on the top layer and 3 fiducials on the bottom layer.
• Panel tabs ("mouse bites")
  • Card edges must be smooth; no mouse bites or other intrusions into the card outline.
  • If external mouse bites are required, minimize and customer will remove by hand before assembly.
• If not otherwise specified, build to IPC 6012 Class 2 or better.

Materials

• No controlled impedance.
• Outer layers must be 1 oz Copper, inner layers can be 0.5 or 1.0 oz Copper.
• Isola FR408HR or material recommended.
• Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.
• White silkscreen on top and bottom surface
• Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.

Suggested Stack Up

Layer	Thickness	Notes
Top Copper	0.043 mm / 1.7 mil	Layer 1 foil, 1 oz Cu after plating
prepreg	0.200 mm / 7.9 mil	Prepreg - Isola FR408HR 2113
Layer 2	0.018 mm / 0.7 mil	Layer 2 foil, 0.5 oz Cu
Core	0.991 mm / 39 mil	Core Isola FR408HR
Layer 3	0.018 mm / 0.7 mil	Layer 3 foil, 0.5 oz Cu
prepreg	0.200 mm / 7.9 mil	Prepreg - Isola FR408HR 2113
Bottom Copper	0.043 mm / 1.7 mil	Layer 4 foil, 1 oz copper after plating
Total Stackup	1.588 mm / 62.5 mil

Array / Panel Information

• Coordinate with Contract Manufacturer (CM) for optimal size of this panel.
• If no feedback from CM, then produce single boards (no panel).

Fabrication Files

IPC-2581 File

Filename	Notes
PROJECT-NAME-ipc2581.xml	IPC-2581 board information file

Legacy PCB Files

Filename	Notes
PROJECT-NAME-Edge_Cuts.gbr	RS274X file for the dimension (outline) layer
PROJECT-NAME-F_Silkscreen.gbr	RS274X file for the top silkscreen
PROJECT-NAME-F_Mask.gbr	RS274X file for the top soldermask
PROJECT-NAME-F_Cu.gbr	RS274X file for the top copper layer
PROJECT-NAME-In1_Cu.gbr	RS274X file for the layer 2 copper
PROJECT-NAME-In2_Cu.gbr	RS274X file for the layer 3 copper
PROJECT-NAME-B_Cu.gbr	RS274X file for the bottom copper layer
PROJECT-NAME-B_Mask.gbr	RS274X file for the bottom soldermask
PROJECT-NAME-B_Silkscreen.gbr	RS274X file for the bottom silkscreen
PROJECT-NAME-NPTH.drl	Excellon file for non-plated through holes
PROJECT-NAME-PTH.drl	Excellon file for plated through holes

\newpage

Printed Circuit Board Assembly (PCBA) Information

Assembly Info

• There are components on the top and bottom sides of the board.
• This PCBA is mostly surface mount (SMT) with a one through-hole (THT) components.

Assembly Requirements

• Assemble to IPC Class 2 or better
• Bake components that are not moisture sealed to appropriate levels as required.
• Solder paste MUST be leaded.
• Aqueous flux and wash strongly preferred.
  • Clean to NASA Standard "Visibly Clean (VC)": No particles or residues are visible to the naked eye.
• No conformal coating.
• Ship in antistatic protective bag

Component Specific Assembly Information

• No specific requirements.

Assembly Files

IPC-2581 File

Filename	Notes
PROJECT-NAME-ipc2581.xml	IPC-2581 board information file

Bill of Materials (BOM)

Filename	Description
PROJECT-NAME-bom.csv	BOM in Comma Separated Variable format

Solder Paste Stencils

Filename	Notes
PROJECT-NAME-B_Paste.gbr	RS274X file for top/front solder paste stencil
PROJECT-NAME-F_Paste.gbr	RS274X file for bottom/back solder paste stencil

Mounting/Placement Location

Filename	Description
PROJECT-NAME-3u.pos	Pick and place locations for components