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oresat-adcs-hardware/oresat-rw-card/README-fabrication.md
Andrew Greenberg cbe040fa59 Schematic and layout polishing and prep for fabrication 
Updated schematic symbols, cleaned up schematic pages to be more like protocard, removed uncessessary TPs, updated layout, cleaned up layout routing and some zones, added Makefile and READMEs for fabrication. Only BOM formatting left!
2026-03-09 03:56:26 -07:00

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OreSat Reaction Wheel (RW) Card

Description

The OreSat RW Card is a 99.8 x 94.6 x 1.6 mm four layer PCB with a mix of through-hole and SMT components on the top and bottom sides.

Printed Circuit Board (PCB) Fabrication information

  • 4 layer board
    • Board thickness is 1.59 mm (0.063 inch) +/- 2 mil)
    • Bounding box is 99.8 x 94.6 mm
  • Design Rules
    • Minimum Trace / Space design rules
      • Outer layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
      • Inner layers: 0.127 mm (5.0 mil) / 0.127 mm (5.0 mil)
    • Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
    • Hole placement tolerance: +/- 0.075 mm (3.0 mil)
    • Inner tab routed slot tolerance: +/- 0.254 mm (10.0 mil)
  • Drills
    • Drill Positional Tolerance: 0.051 mm (2.0 mil)
    • Drill Size tolerance: +/- 0.064 mm (2.5 mil)
  • Plated/Un-plated holes
    • There are 2 un-plated (NPT) holes
    • There are 629 plated through (PTH) holes
    • PTH minimum diameter: 0.254 mm (10 mil)
    • PTH minimum annulus: 0.102 mm (4 mil) radius
  • Slots
    • There is 1 interior unplated slots
  • There are 6 fiducials
    • 3 on the top layer
    • 3 on the bottom layer
  • Panel tabs
    • No requirements, besides try to minimize board protrusions
  • If not otherwise specified, build to IPC 6012 Class 2 or better.

Materials

  • Outside copper layers is 1 oz Cu after plating (0.043 mm / 1.7 mil)
  • Inside copper layers are 0.5 oz Cu (0.018 mm / 0.7 mil)
  • There are no requirements on the prepreg or core of this four layer stackup.
  • Board Surface treatment should be ENIG, althogh immersion Silver is acceptable.
  • White silkscreen on top and bottom surface
  • Taiyo PSR-4000 or equivalent soldermask on top and bottom

Array / Panel Information

  • Coordinate with Contract Manufacturer (CM) for optimal size of this panel.
  • If no feedback from CM, then produce single boards (no panel).

Fabrication Files in "fabrication" Folder

PCB Artwork

Filename Notes
-Edge_Cuts.gbr RS274X file for the dimension (outline) layer
-F_Silkscreen.gbr RS274X file for the top silkscreen
-F_Mask.gbr RS274X file for the top soldermask
-F_Cu.gbr RS274X file for the top copper layer
-In1_Cu.gbr RS274X file for the layer 2 copper
-In2_Cu.gbr RS274X file for the layer 3 copper
-B_Cu.gbr RS274X file for the bottom copper layer
-B_Mask.gbr RS274X file for the bottom soldermask
-B_Silkscreen.gbr RS274X file for the bottom silkscreen
-NPTH.drl Excellon file for non-plated through holes
-PTH.drl Excellon file for plated through holes

Other Fabrication Information

Filename Notes
-ipc2581.xml IPC-2581 board information file