99 lines
4.5 KiB
Plaintext
99 lines
4.5 KiB
Plaintext
Solderpad Hardware License v2.1
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This license operates as a wraparound license to the Apache License
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Version 2.0 (the “Apache License”) and incorporates the terms and
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conditions of the Apache License(which can be found here:
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http://apache.org/licenses/LICENSE-2.0), with the following additions
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and modifications. It must be read in conjunction with the Apache
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License. Section 1 below modifies definitions and terminology in the
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Apache License and Section 2 below replaces Section 2 of the Apache
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License. The Appendix replaces the Appendix in the Apache License. You
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may, at your option, choose to treat any Work released under this
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license as released under the Apache License (thus ignoring all
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sections written below entirely).
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1. Terminology in the Apache License is supplemented or modified as
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follows:
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“Authorship”: any reference to ‘authorship’ shall be taken to
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read “authorship or design”.
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“Copyright owner”: any reference to ‘copyright owner’ shall be taken
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to read “Rights owner”.
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“Copyright statement”: the reference to ‘copyright statement’ shall be
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taken to read ‘copyright or other statement pertaining to Rights’.
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The following new definition shall be added to the Definitions section
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of the Apache License:
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“Rights” means copyright and any similar right including design right
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(whether registered or unregistered), rights in semiconductor
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topographies (mask works) and database rights (but excluding Patents
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and Trademarks).
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The following definitions shall replace the corresponding definitions
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in the Apache License:
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“License” shall mean this Solderpad Hardware License version 2.1,
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being the terms and conditions for use, manufacture, instantiation,
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adaptation, reproduction, and distribution as defined by Sections 1
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through 9 of this document.
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“Licensor” shall mean the owner of the Rights or entity authorized by
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the owner of the Rights that is granting the License.
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“Derivative Works” shall mean any work, whether in Source or Object
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form, that is based on (or derived from) the Work and for which the
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editorial revisions, annotations, elaborations, or other
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modifications represent, as a whole, an original work of authorship
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or design. For the purposes of this License, Derivative Works shall
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not include works that remain reversibly separable from, or merely
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link (or bind by name) or physically connect to or interoperate with
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the Work and Derivative Works thereof.
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“Object” form shall mean any form resulting from mechanical
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transformation or translation of a Source form or the application of
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a Source form to physical material, including but not limited to
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compiled object code, generated documentation, the instantiation of
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a hardware design or physical object or material and conversions to
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other media types, including intermediate forms such as bytecodes,
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FPGA bitstreams, moulds, artwork and semiconductor topographies
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(mask works).
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“Source” form shall mean the preferred form for making modifications,
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including but not limited to source code, net lists, board layouts,
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CAD files, documentation source, and configuration files.
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“Work” shall mean the work of authorship or design, whether in Source
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or Object form, made available under the License, as indicated by a
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notice relating to Rights that is included in or attached to the
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work (an example is provided in the Appendix below).
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2. Grant of License. Subject to the terms and conditions of this
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License, each Contributor hereby grants to You a perpetual,
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worldwide, non-exclusive, no-charge, royalty-free, irrevocable
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license under the Rights to reproduce, prepare Derivative Works of,
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make, adapt, repair, publicly display, publicly perform, sublicense,
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and distribute the Work and such Derivative Works in Source or Object
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form and do anything in relation to the Work as if the Rights did not
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exist.
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APPENDIX
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Copyright 2024 James Smith SPDX-License-Identifier: Apache-2.0
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WITH SHL-2.1
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Licensed under the Solderpad Hardware License v 2.1
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(the “License”); you may not use this file except in compliance with
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the License, or, at your option, the Apache License version 2.0. You
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may obtain a copy of the License at
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https://solderpad.org/licenses/SHL-2.1/
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Unless required by applicable law or agreed to in writing, any work
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distributed under the License is distributed on an “AS IS” BASIS,
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WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or
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implied. See the License for the specific language governing
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permissions and limitations under the License.
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